Abstract: A MEMS device includes a first substrate; a second substrate that is disposed laminated on the first substrate; and a functional element that is disposed between the first substrate and the second substrate, in which the second substrate is smaller than the first substrate, and in planar view, an end portion of the second substrate is disposed inside an end portion of the first substrate.

Abstract: There is provided an MEMS device in which a first substrate provided with a driving element and a second substrate protecting the driving element are bonded to each other with an adhesive, in which the driving element is formed inside the space surrounded by the adhesive between the first substrate and the second substrate, an open hole which communicates with the space and the outside of the adhesive is formed on the adhesive, and an end of the outside of the open hole is provided to be with an end of the first substrate and an end of the second substrate.

Abstract: An inkjet head includes: a pressure chamber-forming plate in which a plurality of pressure chambers each communicating with a nozzle are formed in a first direction; a vibration plate that defines one surface of each pressure chamber and allows for deformation of a defining region thereof; a piezoelectric element formed by stacking a first electrode layer, a piezoelectric layer, and a second electrode layer in a region corresponding to the pressure chamber in an order from a surface of the vibration plate, which is opposite to the pressure chamber; a circuit board that is arranged at an interval from the vibration plate, with a plurality of bump electrodes interposed therebetween, and outputs a signal for driving the piezoelectric element; and an adhesive agent that bonds the pressure chamber-forming plate and the circuit board, wherein an element end on at least one side of the piezoelectric element is formed outside of the defining region and covered by the adhesive agent in a second direction orthogonal to

Abstract: A manufacturing method of a piezoelectric element includes forming an adhesive layer of a lead electrode on a piezoelectric element main body of a vibration plate, forming a metallic layer of the lead electrode on the adhesive layer, removing the metallic layer to leave the adhesive layer in a portion that corresponds to an extended electrode of the lead electrode using etching, patterning the remaining adhesive layer as individual extended electrodes that correspond to the piezoelectric element main body using etching, joining a protective substrate onto the vibration plate in a state in which the piezoelectric element main body is accommodated inside an accommodation hollow section and the extended electrode is positioned further on an outer side of the vibration plate than the protective substrate, layering and forming a section of the wiring on the protective substrate and the extended electrode, and patterning the wiring as individual wiring for each extended electrode using etching.

Abstract: An inkjet head includes: a pressure chamber-forming plate in which a plurality of pressure chambers each communicating with a nozzle are formed; a vibration plate that defines one surface of each pressure chamber and allows for deformation of a defining region thereof; a piezoelectric element formed by stacking a first electrode layer, a piezoelectric layer, and a second electrode layer in a region corresponding to the pressure chamber in an order from a surface of the vibration plate, which is opposite to the pressure chamber; and a circuit board that is arranged at an interval from the vibration plate, with a plurality of bump electrodes interposed therebetween, and outputs a signal for driving the piezoelectric element, wherein the first electrode layer is formed independently for each piezoelectric element, the second electrode layer is formed continuously across the plurality of piezoelectric elements, and at least part of the bump electrodes is electrically connected with the first electrode layer and t

Abstract: A manufacturing method of a head which includes a channel formation substrate having two piezoelectric actuator rows formed thereon, a driving circuit, and a driving circuit board which is provided with a first bump and a second bump. In the method, a piezo element is formed and the first bump is formed on the outside of the piezoelectric actuator row, on the driving circuit board, an adhesive layer is provided on both sides of the first bump and the second bump, a first through hole and a second through hole are formed on the driving circuit board, a first connection wiring and a second connection wiring which are connected to the driving circuit are formed, and a first electrode of the piezoelectric actuator is electrically connected to the first connection wiring via the first bump and a second electrode is electrically connected to the second connection wiring via the second bump.

Abstract: A MEMS device includes a first substrate; a second substrate that is disposed laminated on the first substrate; and a functional element that is disposed between the first substrate and the second substrate, in which the second substrate is smaller than the first substrate, and in planar view, an end portion of the second substrate is disposed inside an end portion of the first substrate.

Abstract: A MEMS device includes a first substrate; a second substrate that is disposed laminated on the first substrate; and a functional element that is disposed between the first substrate and the second substrate, in which the second substrate is smaller than the first substrate, and in planar view, an end portion of the second substrate is disposed inside an end portion of the first substrate.

Abstract: A MEMS device includes a first substrate and a second substrate that is disposed laminated on the first substrate and has a piezoelectric element on the first substrate side, in which the first substrate and the second substrate are substantially the same size, and in planar view, an end of the first substrate and an end of the second substrate are disposed at substantially the same position.

Abstract: A head including a channel formation substrate is provided with a pressure generating chamber which communicates with a nozzle for ejecting a liquid; a piezo element includes a first electrode which is provided on one surface side of a channel formation substrate, a piezoelectric layer is provided on the first electrode, and a second electrode is provided on the piezoelectric layer; and a driving circuit board is bonded to the one surface side of the channel formation substrate via an adhesive layer, and is provided with a driving circuit for driving the piezo element, in which the piezo element and the driving circuit are electrically connected to each other via a bump which is provided on any one of the channel formation substrate and the driving circuit board, and in which the bump and the adhesive layer are provided above the piezoelectric layer of the piezo element.

Abstract: An inkjet head includes: a pressure chamber-forming plate in which a plurality of pressure chambers each communicating with a nozzle are formed in a first direction; a vibration plate that defines one surface of each pressure chamber and allows for deformation of a defining region thereof; a piezoelectric element formed by stacking a first electrode layer, a piezoelectric layer, and a second electrode layer in a region corresponding to the pressure chamber in an order from a surface of the vibration plate, which is opposite to the pressure chamber; a circuit board that is arranged at an interval from the vibration plate, with a plurality of bump electrodes interposed therebetween, and outputs a signal for driving the piezoelectric element; and an adhesive agent that bonds the pressure chamber-forming plate and the circuit board, wherein an element end on at least one side of the piezoelectric element is formed outside of the defining region and covered by the adhesive agent in a second direction orthogonal to

Abstract: An inkjet head includes: a pressure chamber-forming plate in which a plurality of pressure chambers each communicating with a nozzle are formed; a vibration plate that defines one surface of each pressure chamber and allows for deformation of a defining region thereof; a piezoelectric element formed by stacking a first electrode layer, a piezoelectric layer, and a second electrode layer in a region corresponding to the pressure chamber in an order from a surface of the vibration plate, which is opposite to the pressure chamber; and a circuit board that is arranged at an interval from the vibration plate, with a plurality of bump electrodes interposed therebetween, and outputs a signal for driving the piezoelectric element, wherein the first electrode layer is formed independently for each piezoelectric element, the second electrode layer is formed continuously across the plurality of piezoelectric elements, and at least part of the bump electrodes is electrically connected with the first electrode layer and t

Abstract: There is provided an MEMS device in which a first substrate provided with a driving element and a second substrate protecting the driving element are bonded to each other with an adhesive, in which the driving element is formed inside the space surrounded by the adhesive between the first substrate and the second substrate, an open hole which communicates with the space and the outside of the adhesive is formed on the adhesive, and an end of the outside of the open hole is provided to be with an end of the first substrate and an end of the second substrate.

Abstract: A head includes a channel formation substrate having two piezoelectric actuator rows formed thereon, a driving circuit, and a driving circuit board which is provided with a first bump and a second bump, in which the first bump is provided on the outside of the piezoelectric actuator row, an adhesive layer is provided on both sides of the first bump and the second bump, a first through hole and a second through hole are provided on the driving circuit board, a first connection wiring and a second connection wiring are provided in the first through hole and the second through hole, and a first electrode of the piezoelectric actuator is electrically connected to a first connection wiring via the first bump and a second electrode is electrically connected to a second connection wiring via the second bump.

Abstract: A MEMS device includes a first substrate and a second substrate that is disposed laminated on the first substrate and has a piezoelectric element on the first substrate side, in which the first substrate and the second substrate are substantially the same size, and in planar view, an end of the first substrate and an end of the second substrate are disposed at substantially the same position.

Abstract: A MEMS device includes a first substrate which has a first electrode and a protective layer that covers the first electrode; a second substrate that is disposed laminated on the first substrate and that has a second electrode that is electrically connected to the first electrode; and a photosensitive adhesive which joins the protective layer and the second substrate, in which a joining surface of the protective layer which is joined by the photosensitive adhesive is flat.

Abstract: A MEMS device includes a first substrate; a second substrate that is disposed laminated on the first substrate; and a functional element that is disposed between the first substrate and the second substrate, in which the second substrate is smaller than the first substrate, and in planar view, an end portion of the second substrate is disposed inside an end portion of the first substrate.

Abstract: Provided is a head including a channel formation substrate that is provided with a pressure generating chamber which communicates with a nozzle for ejecting a liquid, a piezo element, a driving circuit board that is bonded to the one surface side of the channel formation substrate, and a driving circuit for driving the piezo element. The piezo element and the driving circuit are electrically connected to each other via a bump which is provided on any one of the channel formation substrate and the driving circuit board. A holding portion that holds the piezo element is provided between the driving circuit board and the channel formation substrate. The holding portion is opened to an atmosphere through an atmosphere open passage which is provided to penetrate the driving circuit board in a direction in which the driving circuit board and the channel formation substrate are stacked.

Abstract: A liquid ejection head includes a vibration portion that serves as a wall of a pressure chamber having a shape extending in a first direction; at least one piezoelectric element that is disposed on the vibration portion at an opposite side to the pressure chamber; and an extracting portion that electrically connects the piezoelectric element to external wiring. The piezoelectric element includes a first electrode, a second electrode, and a piezoelectric material layer between the first electrode and the second electrode. In a plan view, the first electrode has a planar shape that is included in shapes of the second electrode and the pressure chamber, and the extracting portion protrudes from a peripheral edge of the first electrode so as to cross a long side of an inner peripheral edge extending in the first direction of the pressure chamber.

Abstract: Provided is a head including a channel formation substrate that is provided with a pressure generating chamber which communicates with a nozzle for ejecting a liquid; a piezo element that includes a first electrode which is provided on one surface side of a channel formation substrate, a piezoelectric layer which is provided on the first electrode, and a second electrode which is provided on the piezoelectric layer; and a driving circuit board that is bonded to the one surface side of the channel formation substrate via an adhesive layer, and is provided with a driving circuit for driving the piezo element, in which the piezo element and the driving circuit are electrically connected to each other via a bump which is provided on any one of the channel formation substrate and the driving circuit board, and in which the bump and the adhesive layer are provided above the piezoelectric layer of the piezo element.