Patents by Inventor Toshiaki Kanemitsu

Toshiaki Kanemitsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8379003
    Abstract: A display device for displaying an image using matrix driving includes: an emission element corresponding to each pixel to be displayed, disposed on L lines, with the scanning direction as lines; a display portion whereby the M lines worth of the emission elements are simultaneously driven; and a connection unit for connecting an on-substrate wiring line extracted from the emission element of the display portion externally; with the connection units including connection terminals for connecting each of the on-substrate wiring lines externally, and at least a part of the connection terminals being arrayed two-dimensionally so as to make up M columns; and with each of the M columns worth of the connection terminals being connected with the on-substrate wiring lines which are thinned out (M?1) wiring lines at a time.
    Type: Grant
    Filed: July 31, 2008
    Date of Patent: February 19, 2013
    Assignee: Sony Corporation
    Inventors: Hidehiro Kawaguchi, Masato Doi, Toshiaki Kanemitsu, Makoto Natori
  • Patent number: 8101457
    Abstract: Provided is a mounting method making it possible to, when an object such as an element, or more particularly, a microscopic object is mounted on a substrate, achieve mounting readily and reliably with high positional precision by: forming an element holding layer 12, which is made of a material whose viscosity can be controlled, on a substrate 11; controlling the viscosity of a first part 12a of the element holding layer 12, which includes a mounting region for an element, into a viscosity making the element naturally movable, and controlling the viscosity of a second part 12b of the element holding layer 12 outside the first part 12a into a viscosity making the element naturally immovable; and after mounting one element 13 in the first part 12a, controlling the viscosity of the first part 12a into the viscosity making the element 13 naturally immovable.
    Type: Grant
    Filed: June 25, 2007
    Date of Patent: January 24, 2012
    Assignee: Sony Corporation
    Inventors: Katsuhiro Tomoda, Masato Doi, Toshiya Takagishi, Toshiaki Kanemitsu
  • Patent number: 8087169
    Abstract: A sheet metal-made cup-shaped material including a circular base plate portion and a cylindrical portion extends from an outer peripheral edge portion of the base plate portion in one direction along the axis of the base plate portion. An annular groove is formed in an upper end portion of the cylindrical portion, whereby an annular projection that projects in a direction opposite to a direction along which the cylindrical portion extends is formed in the cylindrical portion. The annular projection and the cylindrical portion are clampingly pressed to a degree at which the annular groove at least disappears, whereby the outer circumferential face of the projection and the outer circumferential face of the cylindrical portion are flush with each other. Therefore, the axial length of a sheet metal-made back face pulley is increased, and the whole of the increased axial length can be used as the effective length.
    Type: Grant
    Filed: December 10, 2004
    Date of Patent: January 3, 2012
    Assignee: Kanemitsu Corporation
    Inventors: Toshiaki Kanemitsu, Kunihiro Harada, Naoki Fujii
  • Patent number: 7988834
    Abstract: Conductive catalytic particles which are composed of a conductive powder and a catalytic material adhering to the surface thereof are provided. The catalytic material is an alloy of a noble metal material with an additive material which is thermally solid-insoluble in the noble metal material, or an alloy of MI and MII, where MI denotes at least one species selected from noble metal elements, and MII denotes at least one specifies selected from Fe, Co, Ni, Cr, Al, Cu, Hf, Zr, Ti, V, Nb, Ta, W, Ga, Sn, Ge, Si, Re, Os, Pb, Bi, Sb, Mo, Mn, O, N, C, Zn, In, and rare earth elements. The conductive catalytic particles are produced by causing the noble metal material and the additive material or MI and MII to adhere at the same time to the surface of a conductive powder by physical vapor deposition. The conductive catalytic particles are not susceptible to sintering and are used for a gas-diffusing catalytic electrode and an electrochemical device provided therewith.
    Type: Grant
    Filed: May 24, 2002
    Date of Patent: August 2, 2011
    Assignee: Sony Corporation
    Inventors: Kenji Katori, Toshiaki Kanemitsu, Katsuya Shirai
  • Patent number: 7849724
    Abstract: The outer side of a pair of curved parts 3d of a longitudinal annular blank is pressed and energized towards the curved part 3d of the opponent side with a molding outer die 14 of a shaping device 13 to press and widen each curved part 3d to a large curved part of large curvature radius, and a half-finished article 17 is molded, and thereafter, the half-finished article 17 is pressed and widened by cooperative operation of a finishing inner die of the shaping device and a window part of a perfect circle functioning as an outer die to manufacture a ring-shaped member. Therefore, a yield rate or a percentage of the weight of the ring-shaped member with respect to the weight of the raw material and the yield rate or the percentage of the ring-shaped member with respect to the blank can be improved, and the cost can be reduced.
    Type: Grant
    Filed: October 13, 2005
    Date of Patent: December 14, 2010
    Assignee: Kanemitsu Corporation
    Inventors: Toshiaki Kanemitsu, Shuji Kanemitsu, Misao Oda, Masataka Ohnishi, Naoki Fujii, Kazuyuki Oda
  • Patent number: 7838457
    Abstract: A process for production of conductive catalyst particles, a process for production of a catalyst electrode capable of gas diffusion, an apparatus for production of conductive catalyst particles, and a vibrating apparatus. The process can effectively and uniformly coat the particles of a conductive powder with a catalytic substance.
    Type: Grant
    Filed: March 28, 2007
    Date of Patent: November 23, 2010
    Assignee: Sony Corporation
    Inventors: Kenji Katori, Toshiaki Kanemitsu
  • Publication number: 20100083725
    Abstract: A method of producing a ring-shaped member is provided in which a material loss is eliminated, the process cost can be reduced, and a ring-shaped member can be easily obtained from a pipe member by a small number of steps. The method includes steps of: inwardly projectingly shaping a flange portion 1c on an end portion of a metal-made pipe member 1; and cutting off the flange portion 1c from the pipe member 1, thereby obtaining a ring-shaped member 10.
    Type: Application
    Filed: March 12, 2007
    Publication date: April 8, 2010
    Applicant: Kanemitsu Corporation
    Inventors: Toshiaki Kanemitsu, Katsuhiko Nakayama, Naoki Fuji, Kazuyuki Oda
  • Publication number: 20100083727
    Abstract: A yield which is a ratio of the weight of a ring-shaped member to that of a stock material, and a yield which is a ratio of the ring-shaped member to a blank are improved, and the cost is reduced. In a method of producing a ring-shaped member in which a ring-shaped member is obtained from a longitudinally elongated annular blank 3, a pair of linking portions 3b, 3c are outward expanded from the inner side of the blank 3, and a pair of arcuate portions 3d are pressed from the outer side toward the inner side to be pressingly expanded, thereby shaping into a ring-shaped member.
    Type: Application
    Filed: March 12, 2007
    Publication date: April 8, 2010
    Inventors: Toshiaki Kanemitsu, Katsuhiko Nakayama, Naoki Fuji, Kazuyuki Oda
  • Publication number: 20090290337
    Abstract: Provided is a mounting method making it possible to, when an object such as an element, or more particularly, a microscopic object is mounted on a substrate, achieve mounting readily and reliably with high positional precision by: forming an element holding layer 12, which is made of a material whose viscosity can be controlled, on a substrate 11; controlling the viscosity of a first part 12a of the element holding layer 12, which includes a mounting region for an element, into a viscosity making the element naturally movable, and controlling the viscosity of a second part 12b of the element holding layer 12 outside the first part 12a into a viscosity making the element naturally immovable; and after mounting one element 13 in the first part 12a, controlling the viscosity of the first part 12a into the viscosity making the element 13 naturally immovable.
    Type: Application
    Filed: June 25, 2007
    Publication date: November 26, 2009
    Applicant: SONY CORPORATION
    Inventors: Katsuhiro Tomoda, Masato Doi, Toshiya Takagishi, Toshiaki Kanemitsu
  • Publication number: 20090255318
    Abstract: The outer side of a pair of curved parts 3d of a longitudinal annular blank is pressed and energized towards the curved part 3d of the opponent side with a molding outer die 14 of a shaping device 13 to press and widen each curved part 3d to a large curved part of large curvature radius, and a half-finished article 17 is molded, and thereafter, the half-finished article 17 is pressed and widened by cooperative operation of a finishing inner die of the shaping device and a window part of a perfect circle functioning as an outer die to manufacture a ring-shaped member. Therefore, a yield rate or a percentage of the weight of the ring-shaped member with respect to the weight of the raw material and the yield rate or the percentage of the ring-shaped member with respect to the blank can be improved, and the cost can be reduced.
    Type: Application
    Filed: October 13, 2005
    Publication date: October 15, 2009
    Applicant: Kanemitsu Corporation
    Inventors: Toshiaki Kanemitsu, Shuji Kanemitsu, Misao Oda, Masataka Ohnishi, Naoki Fujii, Kazuyuki Oda
  • Patent number: 7572649
    Abstract: A device transferring system includes a first substrate support portion on which to mount a first substrate, a second substrate support portion for supporting a second substrate opposed to the first substrate, a swinging unit for regulating the position of the first substrate support portion so that a device on the first substrate makes contact with the second substrate side in parallel to the second substrate, a movable stage for supporting and moving the swinging unit, a sensor unit for sensing the condition where the device on the first substrate has made contact with the second substrate side, the sensor unit being provided between the first substrate support portion and a sensor support portion formed in the swinging unit, and a measuring unit 61 for measuring the position of stop of a motion of the first substrate due to the contact of the first substrate with the second substrate, and for measuring the moving amount of the swinging unit after the approaching motion of the first substrate is stopped.
    Type: Grant
    Filed: May 17, 2006
    Date of Patent: August 11, 2009
    Assignee: Sony Corporation
    Inventors: Toshiaki Kanemitsu, Yuji Nishi, Katsuhiro Tomoda, Masato Doi
  • Publication number: 20090158803
    Abstract: The yield rate or the percentage of the weight of the ring-shaped member with respect to the weight of the raw material and the yield rate or the percentage of the ring-shaped member with respect to the blank are improved to achieve the cost reduction. A half-finished article 18 having large curved parts 3D obtained by widening the curved parts 3d so as to have a curvature radius larger than the initial curvature radius, and bulge-out parts 3E curved to a circular arc shape at a curvature radius larger than the curvature radius of the curved parts 3d at the linear parts 3b, 3c is molded, and thereafter, the half-finished article 18 is molded into an annular shape to obtain the ring-shaped member 1.
    Type: Application
    Filed: October 11, 2006
    Publication date: June 25, 2009
    Applicant: Kanemitsu Corporation
    Inventors: Toshiaki Kanemitsu, Shuji Kanemitsu, Misao Oda, Masataka Ohnishi, Naoki Fujii, Kazuyuki Oda
  • Publication number: 20090158808
    Abstract: The yield rate or the percentage of the weight of the ring-shaped member with respect to the weight of the raw material is improved to achieve the cost reduction of the ring-shaped member. A plurality of longitudinal annular blanks 3 is punched out from a raw material 2 of a predetermined width, and the longitudinal annular blank 3 is molded into an annular ring-shaped member 1.
    Type: Application
    Filed: October 11, 2006
    Publication date: June 25, 2009
    Applicant: Kanemitsu Corporation
    Inventors: Toshiaki Kanemitsu, Shuji Kanemitsu, Misao Oda, Masataka Ohnishi, Naoki Fujii, Kazuyuki Oda
  • Patent number: 7490503
    Abstract: The method according to the present invention comprises: a first curving step of curving a plate-like metallic blank (1) such that the blank (1) is convexed; a bending step of bending, with the outer peripheral edge portion (1e) of the blank (1) restrained from radially outwardly extending, the resulting arcuate portion (1b) of the curved blank (1) in the direction opposite to the convex direction thereof, so that a boss (6) is formed; and a second curving step of pushing the inner peripheral portion of a flat portion (5) of the blank (1) in the direction opposite to the boss projecting direction. Through the steps above-mentioned, the blank (1) is provided at the center thereof with the case-like boss (6) projecting in one direction from one lateral side of the blank (1) and at the outer periphery thereof with a peripheral wall (7) projecting in the same direction in which the boss (6) projects.
    Type: Grant
    Filed: August 15, 2000
    Date of Patent: February 17, 2009
    Assignee: Kanemitsu Corporation
    Inventors: Toshiaki Kanemitsu, Kazuyuki Oda
  • Publication number: 20090033644
    Abstract: A display device for displaying an image using matrix driving includes: an emission element corresponding to each pixel to be displayed, disposed on L lines, with the scanning direction as lines; a display portion whereby the M lines worth of the emission elements are simultaneously driven; and a connection unit for connecting an on-substrate wiring line extracted from the emission element of the display portion externally; with the connection units including connection terminals for connecting each of the on-substrate wiring lines externally, and at least a part of the connection terminals being arrayed two-dimensionally so as to make up M columns; and with each of the M columns worth of the connection terminals being connected with the on-substrate wiring lines which are thinned out (M?1) wiring lines at a time.
    Type: Application
    Filed: July 31, 2008
    Publication date: February 5, 2009
    Applicant: SONY CORPORATION
    Inventors: Hidehiro Kawaguchi, Masato Doi, Toshiaki Kanemitsu, Makoto Natori
  • Patent number: D580464
    Type: Grant
    Filed: March 22, 2006
    Date of Patent: November 11, 2008
    Assignee: Kabushiki Kaisha Kanemitsu
    Inventor: Toshiaki Kanemitsu
  • Patent number: D598480
    Type: Grant
    Filed: April 6, 2005
    Date of Patent: August 18, 2009
    Assignee: Kabushiki Kaisha Kanemitsu
    Inventor: Toshiaki Kanemitsu
  • Patent number: D624103
    Type: Grant
    Filed: June 5, 2009
    Date of Patent: September 21, 2010
    Assignee: Kabushiki Kaisha Kanemitsu
    Inventor: Toshiaki Kanemitsu
  • Patent number: D643702
    Type: Grant
    Filed: October 23, 2009
    Date of Patent: August 23, 2011
    Assignee: Kanemitsu Corporation
    Inventors: Toshiaki Kanemitsu, Kazuyuki Oda
  • Patent number: D645334
    Type: Grant
    Filed: October 23, 2009
    Date of Patent: September 20, 2011
    Assignee: Kanemitsu Corporation
    Inventors: Toshiaki Kanemitsu, Kazuyuki Oda