Patents by Inventor Toshiaki Komukai

Toshiaki Komukai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device and manufacturing method of semiconductor device
    Publication number: 20020121703
    Abstract: A semiconductor device, which is comprised of a copper wiring layer which is formed above a semiconductor substrate, a pad electrode layer which conducts electrically to the copper wiring layer and has an alloy, which contains copper and a metal whose oxidation tendency is higher than copper, formed to extend to the bottom surface, and an insulating protective film which has an opening extended to the pad electrode layer, is provided.
    Type: Application
    Filed: February 28, 2002
    Publication date: September 5, 2002
    Applicant: KABUSHI KAISHA TOSHIBA
    Inventors: Hiroshi Toyoda, Mitsuhiro Nakao, Masahiko Hasunuma, Hisashi Kaneko, Atsuko Sakata, Toshiaki Komukai