Patents by Inventor Toshiaki Masuda

Toshiaki Masuda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6340519
    Abstract: A water-based chipping-resistant paint which comprises 30 to 65 weight percent of solid matter and 0.1 to 10 weight percent of low-temperature volatility solvent as a water-based dispersion substance and wherein the solid matter contains 15 to 75 weight percent of film-formable resin, 0.2 to 25 weight percent of thermoexpandable microspheres, and 20 to 80 weight percent of chipping-resistant material, facilitates vaporization of water at the time of film formation owing to mixing of the low-temperature volatility solvent, can prevent cracking and blistering of a film due to water remaining in the film and vaporization of water remaining after the film formation, and readily form a thick film owing to an expansion effect of the thermoexpandable microspheres at the stage of baking after coating, and therefore is suitable for a chipping resistant underbody coating for automobiles.
    Type: Grant
    Filed: December 18, 1998
    Date of Patent: January 22, 2002
    Assignee: Matsumoto Yushi Seiyaku Co., Ltd.
    Inventors: Koji Tanaka, Kenichi Kitano, Toshiaki Masuda
  • Patent number: 6235800
    Abstract: The present invention relates to a heat-expandable microcapsule produced from acrylonitrile and N-substituted maleimide as the main polymerizable monomers, or further a monomer giving a hompolymer having a Tg of 50 to 200° C. and polymerizable unsaturated carboxylic acid (including anhydrides), resin foam using this, and a process for producing a foamed resin composite. The present invention can provide a heat-expandable microcapsule that is less apt to color even upon thermal expansion at 200° C. or higher, and a resin foam and a foamed resin composite capable of forming a processed surface, e.g., a matte surface giving a bulky feeling, by using this microcapsule.
    Type: Grant
    Filed: September 13, 2000
    Date of Patent: May 22, 2001
    Assignee: Matsumoto Yushi-Seiyaku Co., Ltd.
    Inventors: Seiji Kyuno, Toshiaki Masuda
  • Patent number: 5614311
    Abstract: An adhesive tape comprising a water impermeable, gas permeable tape substrate, a pressure-sensitive adhesive layer provided on one side of the tape substrate, and a porous sheet provided on a portion of the pressure-sensitive adhesive layer, the porous sheet being capable of expanding to have an apparent density of 0.01 to 0.20 g/cm.sup.3 when absorbing water to saturation. The adhesive tape prevents the accumulation of perspiration between the adhesive tape and the skin of a user on which the adhesive tape is being applied and, hence, is not readily peeled off from the skin. The porous sheet expands upon absorbing blood from a wound to press against the wound, resulting in an enhanced hemostasis effect.
    Type: Grant
    Filed: May 31, 1995
    Date of Patent: March 25, 1997
    Assignee: Nissho Corporation
    Inventors: Yasuhiko Morita, Toshiaki Masuda
  • Patent number: 4813210
    Abstract: A packaged medical device comprising a medical device; a gas-permeable sterile bag containing the medical device therein; a wrapping member made of oxygen-impermeable material and wherein said medical device-containing bag, previously subjected to radiation-sterilization, is sealed; and a deoxidizing agent contained in the wrapping member together with the medical device-containing bag. The packaged medical device does not give off an odor upon unsealing and is free from decrease in strength of plastic parts thereof.
    Type: Grant
    Filed: October 1, 1987
    Date of Patent: March 21, 1989
    Assignee: Nissho Corporation
    Inventors: Toshiaki Masuda, Hitoshi Omiya, Kiyoshi Fukui
  • Patent number: 4701922
    Abstract: An integrated circuit device comprises combinational circuits and sequential circuits. Each of the sequential circuits is provided with a (common) input control signal terminal for controlling the entry of main input terminal signals into the sequential circuit, a test data input/output terminal, a read/write signal terminal for controlling the transfer of the test data, and a latch circuit. The integrated circuit device is partitioned into sequential circuit groups, and combinational circuit groups used as partitioning test units, the main input/output terminal groups of which are connected with the sequential circuit groups through wiring layers. Test data are written into and read out from the sequential circuit groups under control of read/write signal lines through bus lines dedicated to testing. Thus, a higher fault-coverage ratio can be easily obtained with a smaller number of steps and a small test circuit area.
    Type: Grant
    Filed: August 26, 1985
    Date of Patent: October 20, 1987
    Assignees: Hitachi, Ltd., Hitachi Engineering Co., Ltd.
    Inventors: Shigeo Kuboki, Ikuro Masuda, Toshiaki Masuda, Terumine Hayashi