Patents by Inventor Toshiaki Takai

Toshiaki Takai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190080262
    Abstract: A work determination system includes: a biological signal obtaining unit obtaining a biological signal of a worker from a sensor attached to the worker during work; a feature extraction computation unit computing a feature extraction of the obtained biological signal of the worker; a work determination unit determining a work of the worker on the basis of a comparison result between the computed feature extraction of the biological signal of the worker and learning data generated in advance; and a learning unit generating the learning data, wherein the learning unit generates a musculoskeletal model corresponding to each worker, generates a quasi biological signal by reproducing a work of a determination target with the musculoskeletal model, computes a feature extraction of the quasi biological signal, and generates the learning data by associating, with each worker, the work of the determination target and a feature extraction distribution of the quasi biological signal.
    Type: Application
    Filed: July 9, 2018
    Publication date: March 14, 2019
    Inventors: Toru YAZAKI, Yutaka UEMATSU, Toshiaki TAKAI, Tsuyoshi TAMAKI
  • Patent number: 9470863
    Abstract: The present invention achieves a way of mounting plural optical modules onto a wiring board more simply and more densely. There is provided an optical module assembly for mounting plural optical modules onto a wiring board. The optical module assembly includes the optical modules to which optical wiring has been connected and a module case to accommodate the optical modules. The optical modules and the module case are unified. The module case is provided with a floating mechanism for making the optical modules floating, when accommodated therein. The floating mechanism is comprised of plate springs or the like.
    Type: Grant
    Filed: April 1, 2015
    Date of Patent: October 18, 2016
    Assignee: Hitachi Metals, Ltd.
    Inventors: Toshiaki Takai, Yoshinori Sunaga, Masataka Sato, Kinya Yamazaki, Norio Chujo, Naoki Matsushima
  • Publication number: 20150286017
    Abstract: The present invention achieves a way of mounting plural optical modules onto a wiring board more simply and more densely. There is provided an optical module assembly for mounting plural optical modules onto a wiring board. The optical module assembly includes the optical modules to which optical wiring has been connected and a module case to accommodate the optical modules. The optical modules and the module case are unified. The module case is provided with a floating mechanism for making the optical modules floating, when accommodated therein. The floating mechanism is comprised of plate springs or the like.
    Type: Application
    Filed: April 1, 2015
    Publication date: October 8, 2015
    Applicant: Hitachi Metals, Ltd.
    Inventors: Toshiaki TAKAI, Yoshinori SUNAGA, Masataka SATO, Kinya YAMAZAKI, Norio CHUJO, Naoki MATSUSHIMA
  • Patent number: 8889441
    Abstract: The invention provides a wafer-bonded semiconductor device wherein warpage generated when wafers are bonded is reduced at a low cost ad through a simple process. In a method for manufacturing a wafer-bonded semiconductor device by bonding a first wafer substrate and a second wafer substrate together, the method of the invention includes a first step of forming in advance bonding members having a bonding function when heated on the wafer-bonded surface sides of the first wafer substrate and the second wafer substrate, respectively; a second step of supplying flux paste containing two or more kinds of powdery materials having reactivity to the surfaces of the bonding members formed in the first step; and a third step of causing excitation to have the flux paste supplied in the second step start reacting.
    Type: Grant
    Filed: October 27, 2010
    Date of Patent: November 18, 2014
    Assignee: Hitachi, Ltd.
    Inventors: Toshiaki Takai, Yukio Sakigawa
  • Publication number: 20140023315
    Abstract: An optical module achieving optical coupling at a low cost and by a simple and convenient process is intended to be provided. For attaining the purpose, a transparent member sealing an optical device and an optical transmission channel are connected as an optical coupling structure. Specifically, optical coupling is achieved in an optical module having an optical device, a first substrate having the optical device mounted thereon, and a second substrate or a transparent resin provided over the first substrate so as to hermetically seal the optical device by connecting an optical transmission channel over the second substrate or the transparent resin at a portion in which light from the optical device is transmitted.
    Type: Application
    Filed: November 18, 2011
    Publication date: January 23, 2014
    Applicant: Hitachi Ltd
    Inventors: Toshiaki Takai, Norio Chujo, Saori Hamamura
  • Patent number: 8449204
    Abstract: An optical module in a simple configuration is provided which can suppress optical crosstalk due to leakage light without causing characteristics deterioration and reliability decrease of light-emitting elements to thereby obtain appropriate light receiving sensitivity. In an optical module in which a plurality of light-emitting elements 11 and light-receiving elements 12 are mounted on an optical-element mounting substrate 1, a light-absorbing resin 6 to absorb light with a light-emission wavelength of the light-emitting elements 11 is arranged to cover side surfaces of the light-emitting elements 11 and a non-adhesive layer 7 including a material not adhesive to the light-absorbing resin 6 is arranged between the light-absorbing resin 6 and the optical-element mounting substrate 1.
    Type: Grant
    Filed: June 11, 2009
    Date of Patent: May 28, 2013
    Assignee: Hitachi, Ltd.
    Inventors: Toshiaki Takai, Yukio Sakigawa, Shohei Hata
  • Patent number: 8380075
    Abstract: There are provided a downsized and low-cost optical module used as a terminal for wavelength multiplexing optical transmission and one-core bidirectional optical transmission which transmits lights of plural wavelengths through one optical fiber, and a method of manufacturing the optical module. A base on which plural optical elements are mounted, and an optical multiplexer and demultiplexer having wavelength selection filters and mirrors formed on both surfaces of a substrate are prepared. Those two parts are packed into a package so that an optical element mounted surface and a filter surface are substantially parallel to each other, and the optical elements are arranged to emit or receive lights obliquely to the base. With this configuration, because the optical multiplexer and demultiplexer can be mounted in parallel to an X-Y plane, a package can be easily machined by using a lathe, thereby enabling a reduction in the costs.
    Type: Grant
    Filed: November 24, 2009
    Date of Patent: February 19, 2013
    Assignee: Hitachi, Ltd.
    Inventors: Yukio Sakigawa, Toshiaki Takai, Shohei Hata
  • Publication number: 20130029438
    Abstract: The invention provides a wafer-bonded semiconductor device wherein warpage generated when wafers are bonded is reduced at a low cost ad through a simple process. In a method for manufacturing a wafer-bonded semiconductor device by bonding a first wafer substrate and a second wafer substrate together, the method of the invention includes a first step of forming in advance bonding members having a bonding function when heated on the wafer-bonded surface sides of the first wafer substrate and the second wafer substrate, respectively; a second step of supplying flux paste containing two or more kinds of powdery materials having reactivity to the surfaces of the bonding members formed in the first step; and a third step of causing excitation to have the flux paste supplied in the second step start reacting.
    Type: Application
    Filed: October 27, 2010
    Publication date: January 31, 2013
    Inventors: Toshiaki Takai, Yukio Sakigawa
  • Patent number: 8358172
    Abstract: A peaking circuit for adjusting peaking of a high-frequency signal, comprises: a first inductor; a second inductor which is electromagnetically coupled with the first inductor; a signal input section which receives an input signal; a transistor which adjusts electric current passing through the second inductor according to the input signal inputted via the signal input section; and a signal output section which outputs a signal whose peaking has been adjusted by the first inductor. Mutual inductance of the electromagnetically coupled first and second inductors is changed by the adjustment of the electric current passing through the second inductor, according to the input signal inputted via the signal input section, with the use of the transistor, thereby adjusting the peaking of signal waveform of electric current passing through the first inductor, and the signal subjected to the peaking adjustment is outputted from the signal output section.
    Type: Grant
    Filed: February 9, 2011
    Date of Patent: January 22, 2013
    Assignee: Hitachi, Ltd.
    Inventors: Norio Chujo, Tsuneo Kawamata, Toshiaki Takai
  • Publication number: 20110243512
    Abstract: An optical module in a simple configuration is provided which can suppress optical crosstalk due to leakage light without causing characteristics deterioration and reliability decrease of light-emitting elements to thereby obtain appropriate light receiving sensitivity. In an optical module in which a plurality of light-emitting elements 11 and light-receiving elements 12 are mounted on an optical-element mounting substrate 1, a light-absorbing resin 6 to absorb light with a light-emission wavelength of the light-emitting elements 11 is arranged to cover side surfaces of the light-emitting elements 11 and a non-adhesive layer 7 including a material not adhesive to the light-absorbing resin 6 is arranged between the light-absorbing resin 6 and the optical-element mounting substrate 1.
    Type: Application
    Filed: June 11, 2009
    Publication date: October 6, 2011
    Applicant: HITACHI, LTD.
    Inventors: Toshiaki Takai, Yukio Sakigawa, Shohei Hata
  • Publication number: 20110241778
    Abstract: A peaking circuit for adjusting peaking of a high-frequency signal, comprises: a first inductor; a second inductor which is electromagnetically coupled with the first inductor; a signal input section which receives an input signal; a transistor which adjusts electric current passing through the second inductor according to the input signal inputted via the signal input section; and a signal output section which outputs a signal whose peaking has been adjusted by the first inductor. Mutual inductance of the electromagnetically coupled first and second inductors is changed by the adjustment of the electric current passing through the second inductor, according to the input signal inputted via the signal input section, with the use of the transistor, thereby adjusting the peaking of signal waveform of electric current passing through the first inductor, and the signal subjected to the peaking adjustment is outputted from the signal output section.
    Type: Application
    Filed: February 9, 2011
    Publication date: October 6, 2011
    Inventors: Norio CHUJO, Tsuneo Kawamata, Toshiaki Takai
  • Patent number: 8027553
    Abstract: An optical element amounted structure includes an optical element having an electrode such as a bump formed on a surface thereof, and a substrate having an electrode that is joined to the optical element formed on the surface. The structure of the electrode of the substrate has a substantially ring configuration or a substantially ring configuration a part of which is notched, and the optical element and the substrate are joined to each other in a configuration where a joining material such as a bump is inserted into an opening portion.
    Type: Grant
    Filed: August 6, 2007
    Date of Patent: September 27, 2011
    Assignee: Hitachi Cable, Ltd.
    Inventors: Toshiaki Takai, Naoki Matsushima, Koki Hirano, Hiroki Yasuda
  • Patent number: 7991251
    Abstract: A filter element includes a first glass substrate having a pair of parallel surfaces and a band pass filter arranged on one of the parallel surfaces, a pair of single-crystal substrates (Si wafers) each including a primary surface formed with a depression having an inclined surface with respect to the primary surface occupying at least one half of the opening of the depression, and a second glass substrate having an optical element. The primary surfaces of the single-crystal substrate pair are bonded to a pair of the surfaces of the glass substrate. The depressions are faced through the glass substrate and surround the band pass filter. By this configuration, the filter element can be mass produced with a high accuracy and a low cost by the wafer-level process.
    Type: Grant
    Filed: June 30, 2009
    Date of Patent: August 2, 2011
    Assignee: Hitachi, Ltd.
    Inventors: Shohei Hata, Naoki Matsushima, Toshiaki Takai, Yukio Sakigawa, Satoshi Arai
  • Patent number: 7948059
    Abstract: In a semiconductor device comprising a ceramic substrate, a surface mount component, and sealing resin and obtained by division into pieces, the ceramic substrate is composed of a multiple piece substrate provided with dividing grooves for the division into pieces on both front and rear surfaces in advance, a plurality of the surface mount components are mounted on the multiple piece substrate and sealed collectively by the sealing resin, and the substrate is divided along the dividing grooves. Further, when the shortest distance from an end on the front surface of the ceramic substrate to an end of the surface mount component is set to “a” ?m, a thickness of the ceramic substrate is set to “b” ?m, and sum of depths of the dividing grooves on the front and rear surfaces of the ceramic substrate is set to “c” ?m, a relationship of a?269×c/b+151 is established.
    Type: Grant
    Filed: December 29, 2006
    Date of Patent: May 24, 2011
    Assignee: Hitachi Metals, Ltd.
    Inventors: Yoshio Ozeki, Toshiaki Takai, Makoto Ohta, Takahiro Umeyama
  • Publication number: 20110080657
    Abstract: There is provided means of achieving the improvement of optical coupling efficiency between a surface receiving/emitting element and an optical transmission path with a simple structure and low cost. An optical element and a substrate having an optical waveguide layer and electric wiring are connected with each other through a lens having a Fresnel lens shape. A through via is provided in the lens, and the optical element and the electric wiring in the substrate are electrically connected with each other through the through via. Instead of the lens, a unit in which a lens is mounted inside an optical-element mounting substrate may be used.
    Type: Application
    Filed: August 30, 2010
    Publication date: April 7, 2011
    Inventors: Toshiaki Takai, Eiji Sakamoto, Shohei Hata
  • Publication number: 20100209103
    Abstract: There are provided a downsized and low-cost optical module used as a terminal for wavelength multiplexing optical transmission and one-core bidirectional optical transmission which transmits lights of plural wavelengths through one optical fiber, and a method of manufacturing the optical module. A base on which plural optical elements are mounted, and an optical multiplexer and demultiplexer having wavelength selection filters and mirrors formed on both surfaces of a substrate are prepared. Those two parts are packed into a package so that an optical element mounted surface and a filter surface are substantially parallel to each other, and the optical elements are arranged to emit or receive lights obliquely to the base. With this configuration, because the optical multiplexer and demultiplexer can be mounted in parallel to an X-Y plane, a package can be easily machined by using a lathe, thereby enabling a reduction in the costs.
    Type: Application
    Filed: November 24, 2009
    Publication date: August 19, 2010
    Applicant: HITACHI, LTD.
    Inventors: Yukio SAKIGAWA, Toshiaki TAKAI, Shohei HATA
  • Patent number: 7750310
    Abstract: The present invention provides a semiconductor radioactive ray detector having the excellent energy resolution or time precision, a radioactive detection module, and a nuclear medicine diagnosis apparatus. The semiconductor radioactive ray detector has a structure in which plate-like elements made of cadmium telluride and conductive members are alternately laminated and the plate-like element made of cadmium telluride and the conductive member are adhered to each other with a conductive adhesive agent, and the Young's modulus of the conductive adhesive agent is in the range from 350 MPa to 1000 MPa, while the conductive members are made from a material with the linear expansion coefficient of the conductive members in the range from 5×10?6/° C. to 7×10?6/° C.
    Type: Grant
    Filed: August 10, 2006
    Date of Patent: July 6, 2010
    Assignee: Hitachi, Ltd.
    Inventors: Tomoyuki Seino, Norihito Yanagita, Toshiaki Takai, Chiko Yorita, Naoki Matsushima
  • Publication number: 20100002987
    Abstract: A filter element includes a first glass substrate having a pair of parallel surfaces and a band pass filter arranged on one of the parallel surfaces, a pair of single-crystal substrates (Si wafers) each including a primary surface formed with a depression having an inclined surface with respect to the primary surface occupying at least one half of the opening of the depression, and a second glass substrate having an optical element. The primary surfaces of the single-crystal substrate pair are bonded to a pair of the surfaces of the glass substrate. The depressions are faced through the glass substrate and surround the band pass filter. By this configuration, the filter element can be mass produced with a high accuracy and a low cost by the wafer-level process.
    Type: Application
    Filed: June 30, 2009
    Publication date: January 7, 2010
    Applicant: HITACHI, LTD.
    Inventors: Shohei HATA, Naoki MATSUSHIMA, Toshiaki TAKAI, Yukio SAKIGAWA, Satoshi ARAI
  • Publication number: 20090180732
    Abstract: The present invention provides a junction structure between an optical element and a substrate. The junction structure is formed by supplying an under-fill resin not containing a filler to a portion functioning as a light path for light emitted from or incoming into the optical element on the substrate, then jointing a conductive bump of the optical element to electric wiring on the substrate, and then thermally hardening the under-fill resin not containing a filler to bond the resin not containing a filler to the optical element and to the substrate so that the under-fill resin containing a filler will not enter a space between the optical element and the substrate when the under-fill resin containing a filler is filled in portions other than the light path between the optical element and the substrate.
    Type: Application
    Filed: October 24, 2008
    Publication date: July 16, 2009
    Inventors: Toshiaki TAKAI, Akiko Mizushima, Naoki Matsushima
  • Patent number: 7520683
    Abstract: To provide a small-sized and reliable optical module in which a light emitting element and an optical function element respectively remarkably different in a coefficient of thermal expansion are mounted in the same casing, in the invention, the optical function element is mounted on the casing made of first material substantially equal in a coefficient of thermal expansion to the optical function element, a light emitting element unit including the light emitting element (for example, a thermoelectric module over which the light emitting element is mounted) is mounted on a member (base material) made of second material different from the first material and matched with the light emitting element unit in a coefficient of thermal expansion, and the member is, for example, embedded in the bottom of the casing.
    Type: Grant
    Filed: August 3, 2005
    Date of Patent: April 21, 2009
    Assignee: Opnext Japan, Inc.
    Inventors: Toshiaki Takai, Kenji Yoshimoto, Hiroyasu Sasaki, Masanobu Okayasu, Naoki Matsushima