Patents by Inventor Toshiaki Takenaka

Toshiaki Takenaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210068237
    Abstract: Lighting system includes light source that includes at least one light-emitting device and emits first light (laser light); wavelength conversion member that converts part of the first light into second light having a different wavelength from that of the first light; an optical system (light guide member) where the first light enters and that applies the first light to wavelength conversion member; optical sensor that receives part of the second light as monitor light and outputs monitor signal corresponding to the intensity of monitor light; and output control circuit that controls light source and optical sensor. Output control circuit performs an optical system inspection of conditions of the optical system and wavelength conversion member and a light source inspection of a condition of light source in accordance with monitor signal, using a time division method.
    Type: Application
    Filed: August 26, 2020
    Publication date: March 4, 2021
    Inventors: Toshiaki Takenaka, Hirofumi KONISHI
  • Publication number: 20210068234
    Abstract: Lighting system includes light source that includes a plurality of light-emitting devices and emits first light; wavelength conversion member that converts part of the first light into second light; an optical system that applies the first light to wavelength conversion member; optical sensor that output monitor signal corresponding to the intensity of the second light; and output control circuit that controls light source and optical sensor. Output control circuit performs a light source inspection of a condition of light source and an optical system inspection of conditions of the optical system and wavelength conversion member in accordance with monitor signal. In the light source inspection, the output control circuit inspects each of light-emitting devices in sequence, and after having inspected one of light-emitting devices, suspends the light source inspection and performs the optical system inspection before inspection of another one of the light emitting devices.
    Type: Application
    Filed: August 26, 2020
    Publication date: March 4, 2021
    Inventors: Hirofumi KONISHI, Toshiaki TAKENAKA
  • Patent number: 10768590
    Abstract: A plant operation support device for simulating an operation of a plant based on information obtained from the plant, includes: an operation condition setting part that sets an operation condition of the plant and a timing for applying the operation condition; and a transient state prediction part that predicts a transient state of the plant from a specific time point to the future in a case in which the operation condition of the plant set by the operation condition setting part is applied at the timing.
    Type: Grant
    Filed: June 8, 2016
    Date of Patent: September 8, 2020
    Assignee: Yokogawa Electric Corporation
    Inventors: Ryosuke Kashiwa, Azusa Takenaka, Toshiaki Omata, Shin Ishimaru, Makoto Nakaya
  • Publication number: 20200001665
    Abstract: In a tire 22, a length from a center PM in an axial direction of a boundary 60 between a core 48 and an apex 50 to an outer edge PA of the apex 50 is not less than 10 mm and not greater than 15 mm. In a state where the tire 22 is mounted on a normal rim and an internal pressure of the tire 22 is adjusted to 10% of a normal internal pressure, a main body portion 54 of a carcass ply 52 extending along an inner surface 62 of the apex 50 is tilted relative to the axial direction, and an angle of the main body portion 54 relative to the axial direction is not less than 40° and not greater than 60°.
    Type: Application
    Filed: June 24, 2019
    Publication date: January 2, 2020
    Applicant: Sumitomo Rubber Industries, Ltd.
    Inventors: Toshiaki HAMADA, Masahiro TATSUTA, Hiroki UNO, Hiroto TAKENAKA
  • Patent number: 9488899
    Abstract: A strobe device is provided with a light-emitting unit rotatably coupled to a strobe body unit detachable from a bracket together with an imaging apparatus, a variable mechanism configured to allow a change in an angle of orientation of the light-emitting unit with respect to the strobe body unit, a driving unit configured to drive the variable mechanism, and a control section configured to control the driving unit. The control section has a control mode to restrain the light-emitting unit from moving to a region in which the imaging apparatus is located when it is detected that the strobe body unit is attached to the bracket. As a result, the strobe device whose the light-emitting unit does not bump against the imaging apparatus can be realized.
    Type: Grant
    Filed: August 19, 2013
    Date of Patent: November 8, 2016
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Kazuhiko Ooyama, Yutaro Matsui, Shinya Maeda, Takashi Umehara, Toshiaki Takenaka
  • Publication number: 20150261068
    Abstract: A strobe device of the present invention has a strobe body unit, a light-emitting unit rotatably coupled to the strobe body unit, a variable mechanism configured to change an angle and an orientation of the light-emitting unit with respect to the strobe body unit, a driving unit configured to drive the variable mechanism, and a control section configured to control the driving unit. The control section includes modes for selecting a particular one from among a plurality of reflective objects, and an arithmetic operation unit configured to calculate a bounce angle of the light-emitting unit with respect to the reflective object selected by using the modes. The control section controls the driving unit to cause an angle of the light-emitting unit to be the bounce angle. As a result, the strobe device which is ready to perform bounce photography without missing a chance for a good shot can be realized.
    Type: Application
    Filed: August 19, 2013
    Publication date: September 17, 2015
    Inventors: Kazuhiko Ooyama, Toshiaki Takenaka
  • Publication number: 20150185589
    Abstract: A strobe device is provided with a light-emitting unit rotatably coupled to a strobe body unit detachable from a bracket together with an imaging apparatus, a variable mechanism configured to allow a change in an angle of orientation of the light-emitting unit with respect to the strobe body unit, a driving unit configured to drive the variable mechanism, and a control section configured to control the driving unit. The control section has a control mode to restrain the light-emitting unit from moving to a region in which the imaging apparatus is located when it is detected that the strobe body unit is attached to the bracket. As a result, the strobe device whose the light-emitting unit does not bump against the imaging apparatus can be realized.
    Type: Application
    Filed: August 19, 2013
    Publication date: July 2, 2015
    Applicant: Panasonic Intellectual Property Management Co., Lt
    Inventors: Kazuhiko Ooyama, Yutaro Matsui, Shinya Maeda, Takashi Umehara, Toshiaki Takenaka
  • Publication number: 20150109754
    Abstract: The present invention relates to a strobe device including: a strobe main body; a light emitter rotatably coupled to the strobe main body; a variable mechanism capable of changing an illumination direction angle of the light emitter; and a driver-that drives the variable mechanism. The driver includes: a detector that detects that abnormal force is applied to the variable mechanism and a detection responsive controller that controls the driver based on the abnormal force detected by the detector. This can achieve the strobe device that can prevent the light emitter from colliding with an obstacle and prevent the driver from being damaged.
    Type: Application
    Filed: April 18, 2013
    Publication date: April 23, 2015
    Applicant: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Toshiaki Takenaka, Kazuhiko Ooyama, Yoshimi Fukuda
  • Patent number: 8230891
    Abstract: A highly reliable and productive manufacturing method of boards and a manufacturing apparatus are provided. The manufacturing apparatus includes heater-punches (4a) and (4b) disposed above and under pressuring holes (24) provided on positioning stage (6) which positions and laminates board materials. The apparatus also includes a supplying and discharging means of a mold-releasing sheet, and the means is formed of supply reel (22), take-up reel (23), and guide rolls (25a) and (25b). The sheet is supplied and discharged passing between heater-punches (4a) placed above pressuring holes (24) and heater-punches (4b) placed under pressuring holes (24).
    Type: Grant
    Filed: May 26, 2009
    Date of Patent: July 31, 2012
    Assignee: Panasonic Corporation
    Inventors: Kunio Kishimoto, Toshiaki Takenaka, Yukihiro Hiraishi
  • Patent number: 8211494
    Abstract: A mask film, where squeegee cleaning part has been formed at a predetermined position, and another mask film are attached to both sides of a substrate. A through-hole is formed by using a laser, and conductive paste is filled into the through-hole by using a squeezing method. As discussed above, a paste-residue can be prevented on the through-hole, so that a circuit board having high quality of connection can be obtained.
    Type: Grant
    Filed: December 15, 2004
    Date of Patent: July 3, 2012
    Assignee: Panasonic Corporation
    Inventors: Toshiaki Takenaka, Toshikazu Kondou, Yukihiro Hiraishi, Kunio Kishimoto
  • Patent number: 8007629
    Abstract: A method of manufacturing a multi-layer circuit board including preparing a laminated member formed of (i) a core circuit board having a circuit pattern thereon and (ii) a prepreg sheet having a through-hole filled with conductive paste, forming a laminated structure such that the laminated member is sandwiched by lamination plates, and applying heat and pressure to the laminated structure. According to this method, selecting a lamination plate that has a thermal expansion coefficient that is equivalent to that of a core circuit board will protect the conductive paste from distortion, thereby offering a high-quality multi-layer circuit board having a reliable connection resistance.
    Type: Grant
    Filed: September 30, 2005
    Date of Patent: August 30, 2011
    Assignee: Panasonic Corporation
    Inventors: Toshiaki Takenaka, Yoshihiro Kawakita, Tadashi Tojyo, Yuichiro Sugita
  • Patent number: 7828924
    Abstract: An intermediate material which is adapted to manufacture a circuit board includes a prepreg sheet having a through-hole provided therein, a first film provided on a surface of the prepreg sheet and having a first hole communicating with the through-hole, a second film provided on another surface of the prepreg sheet and having a second hole communicating with the through-hole, and a conductive paste filling the though-hole, the first hole, and the second hole. The thickness t1 of the prepreg sheet, the minimum diameter rmin of the through-hole, the thickness tf1 of the first film, the diameter rf1 of the first hole, the thickness tf2 of the second film, the diameter rf2 of the second hole satisfy a relation: rf1/tf1?3, rf2/tf2?3, and rmin/(t1+tf1+tf2)?1.5. This intermediate material provides a circuit board having a fine via-conductor connected to a metal foil securely and stably.
    Type: Grant
    Filed: December 6, 2006
    Date of Patent: November 9, 2010
    Assignee: Panasonic Corporation
    Inventors: Yoshihiro Kawakita, Toshiaki Takenaka
  • Patent number: 7816611
    Abstract: After disposing metallic foils on either surface of a prepreg sheet of low compressibility having conducting holes filled with conductive paste, the prepreg sheet is compressed in a state of being kept at a relatively low temperature, and after that, the temperature is raised under pressure to melt and harden the resin in the prepreg sheet, and thereby, the connecting resistance is stabilized, and a high-quality circuit board can be obtained.
    Type: Grant
    Filed: January 4, 2007
    Date of Patent: October 19, 2010
    Assignee: Panasonic Corporation
    Inventors: Toshiaki Takenaka, Yoshihiro Kawakita, Tadashi Tojo, Kiyohide Tatsumi
  • Publication number: 20090229762
    Abstract: A highly reliable and productive manufacturing method of boards and a manufacturing apparatus are provided. The manufacturing apparatus includes heater-punches (4a) and (4b) disposed above and under pressuring holes (24) provided on positioning stage (6) which positions and laminates board materials. The apparatus also includes a supplying and discharging means of a mold-releasing sheet, and the means is formed of supply reel (22), take-up reel (23), and guide rolls (25a) and (25b). The sheet is supplied and discharged passing between heater-punches (4a) placed above pressuring holes (24) and heater-punches (4b) placed under pressuring holes (24).
    Type: Application
    Filed: May 26, 2009
    Publication date: September 17, 2009
    Inventors: Kunio Kishimoto, Toshiaki Takenaka, Yukihiro Hiraishi
  • Publication number: 20090178839
    Abstract: Through hole (3) for product, through holes (7a, 7b) for laminate recognition marks, through holes (8a, 8b) for an X-ray recognition marks are formed on prepreg sheet (1) having mold release films (2a, 2b) attached to the front and back surfaces thereof. By masking through holes (7a, 7b) for laminate recognition mark, conductive paste (4) is filled in through hole (3) for product and through holes (8a, 8b) for X-ray recognition marks. Thereafter, mold release films (2a, 2b) are removed so as to manufacture a circuit board. Since conductive paste (4) is not filled in through holes (7a, 7b) for laminate recognition marks, a recognition mark with high laminating accuracy can be easily obtained, and a high density and high quality circuit formation substrate having improved laminating accuracy can be obtained.
    Type: Application
    Filed: March 12, 2008
    Publication date: July 16, 2009
    Inventors: Toshiaki Takenaka, Yukihiro Hiraishi, Takao Okamoto, Masaya Mada
  • Publication number: 20090114338
    Abstract: An intermediate material which is adapted to manufacture a circuit board includes a prepreg sheet having a through-hole provided therein, a first film provided on a surface of the prepreg sheet and having a first hole communicating with the through-hole, a second film provided on another surface of the prepreg sheet and having a second hole communicating with the through-hole, and a conductive paste filling the though-hole, the first hole, and the second hole. The thickness t1 of the prepreg sheet, the minimum diameter rmin of the through-hole, the thickness tf1 of the first film, the diameter rf1 of the first hole, the thickness tf2 of the second film, the diameter rf2 of the second hole satisfy a relation: rf1/tf1?3, rf2/tf2?3, and rmin/(t1+tf1+tf2)?1.5. This intermediate material provides a circuit board having a fine via-conductor connected to a metal foil securely and stably.
    Type: Application
    Filed: December 6, 2006
    Publication date: May 7, 2009
    Inventors: Yoshihiro Kawakita, Toshiaki Takenaka
  • Publication number: 20080251193
    Abstract: A method of manufacturing a multi-layer circuit board having the following steps: preparing a laminated member formed of a core circuit board having a circuit pattern thereon and a prepreg sheet having a through-hole filled with conductive paste; forming a laminated structure in a manner that the laminated member is sandwiched by lamination plates; and applying heat and pressure to the laminated structure. According to the method, selecting a lamination plate so as to have thermal expansion coefficient equivalent to that of a core circuit board can protect conductive paste from distortion, thereby offering a high-quality multi-layer circuit board with reliable connection resistance.
    Type: Application
    Filed: September 30, 2005
    Publication date: October 16, 2008
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Toshiaki Takenaka, Yoshihiro Kawakita, Tadashi Tojyo, Yuichiro Sugita
  • Patent number: 7281325
    Abstract: A pre-preg sheet includes a substrate and a resin impregnated in the substrate. A first metal foil is placed on the pre-preg sheet to provide a laminated body. The laminated body is put in a heating device having a temperature maintained at a temperature close to a softening temperature of the resin. The laminated body is compressed at the temperature at a predetermined pressure. The first metal foil is bonded to the pre-preg sheet of the laminated body and hardening the resin, thus providing a circuit board. This method provides a stable resistance of a conductive paste filing a through-hole in the pre-preg sheet to be compressed at a small rate.
    Type: Grant
    Filed: November 30, 2004
    Date of Patent: October 16, 2007
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Yoshihiro Kawakita, Toshiaki Takenaka, Tadashi Tojyo
  • Publication number: 20070107931
    Abstract: After disposing metallic foils on either surface of a prepreg sheet of low compressibility having conducting holes filled with conductive paste, the prepreg sheet is compressed in a state of being kept at a relatively low temperature, and after that, the temperature is raised under pressure to melt and harden the resin in the prepreg sheet, and thereby, the connecting resistance is stabilized, and a high-quality circuit board can be obtained.
    Type: Application
    Filed: January 4, 2007
    Publication date: May 17, 2007
    Applicant: Matsushita Electric Industrial Co., Ltd.
    Inventors: Toshiaki Takenaka, Yoshihiro Kawakita, Tadashi Tojo, Kiyohide Tatsumi
  • Patent number: 7181839
    Abstract: After disposing metallic foils on either surface of a prepreg sheet of low compressibility having conducting holes filled with conductive paste, the prepreg sheet is compressed in a state of being kept at a relatively low temperature, and after that, the temperature is raised under pressure to melt and harden the resin in the prepreg sheet, and thereby, the connecting resistance is stabilized, and a high-quality circuit board can be obtained.
    Type: Grant
    Filed: December 26, 2003
    Date of Patent: February 27, 2007
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Toshiaki Takenaka, Yoshihiro Kawakita, Tadashi Tojo, Kiyohide Tatsumi