Patents by Inventor Toshichika Takei

Toshichika Takei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Substrate processing apparatus and substrate processing method
    Publication number: 20010053508
    Abstract: A heating processing chamber has a plate for holding a wafer and a heater heating the plate portion. The plate portion is composed of a plurality of divided plates separated from each other, and thereby the plate is hard to break even through a drastic change in temperature, thus making it possible to increase the durability of the plate.
    Type: Application
    Filed: June 19, 2001
    Publication date: December 20, 2001
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Eiichi Shirakawa, Toshichika Takei
  • Hot plate cooling method and heat processing apparatus
    Publication number: 20010038988
    Abstract: In a heat processing apparatus structured to heat a wafer on a hot plate, a black plate at least the rear face of which practically has a color with a JIS lightness of 0V to 4V is positioned above the hot plate. Moreover, cooling air is blown out from nozzles onto the rear face of the hot plate. Thus, the temperature of the hot plate can be cooled rapidly.
    Type: Application
    Filed: April 12, 2001
    Publication date: November 8, 2001
    Applicant: Tokyo Electron Limited
    Inventors: Tetsuya Oda, Mitsuhiro Tanoue, Toshichika Takei, Eiichi Shirakawa