Abstract: A capacitor includes: a capacitor element; an insulation coated lead wire connected to an electrode of a capacitor element; and a resin covering the capacitor element and the insulation coated lead wire in a state that one end of the insulation coated lead wire is exposed from the resin. The insulation coated lead wire includes: a stranded wire in which a plurality of conductive wires are twisted with each other; and an insulator covering the stranded wire. An exposed part of the stranded wire is connected to the electrode of the capacitor element. The exposed part is a part exposed from the insulator at another end of the insulation coated lead wire. The exposed part is entirely covered with solder.

Abstract: A semiconductor device is provided which can detect a fluctuation of a power supply voltage. The semiconductor device includes a counter circuit that outputs a signal when a period during which a power supply voltage of a system to be monitored is lower than or equal to a first voltage value exceeds a predetermined time, a first flag circuit that sets a first flag based on the signal, a second flag circuit that sets a second flag when the power supply voltage becomes a second voltage value or lower, and a circuit that outputs a reset signal that resets the system when both the first and the second flags are set. The first voltage value and the second voltage value are higher than a minimum voltage that guarantees normal operation of the system. The first voltage value is higher than the second voltage value.

Abstract: A capacitor includes: a capacitor element; an insulation coated lead wire connected to an electrode of a capacitor element; and a resin covering the capacitor element and the insulation coated lead wire in a state that one end of the insulation coated lead wire is exposed from the resin. The insulation coated lead wire includes: a stranded wire in which a plurality of conductive wires are twisted with each other; and an insulator covering the stranded wire. An exposed part of the stranded wire is connected to the electrode of the capacitor element. The exposed part is a part exposed from the insulator at another end of the insulation coated lead wire. The exposed part is entirely covered with solder.

Abstract: A semiconductor device is provided which can detect a fluctuation of a power supply voltage. The semiconductor device includes a counter circuit that outputs a signal when a period during which a power supply voltage of a system to be monitored is lower than or equal to a first voltage value exceeds a predetermined time, a first flag circuit that sets a first flag based on the signal, a second flag circuit that sets a second flag when the power supply voltage becomes a second voltage value or lower, and a circuit that outputs a reset signal that resets the system when both the first and the second flags are set. The first voltage value and the second voltage value are higher than a minimum voltage that guarantees normal operation of the system. The first voltage value is higher than the second voltage value.

Abstract: A case mold type capacitor is formed of multiple metalized film capacitors connected together in parallel and rigidly accommodated with molding resin within a case. The multiple metalized film capacitors are divided into a first block and a second block, and P-poles of each block confront each other, and N-poles thereof also confront each other. Bus-bars including a connection terminal for external connection at an end are connected to respective P-poles and N-poles of each block. The bus-bars connected to the P-poles are coupled together, and the bus-bars connected to the N-poles are coupled together. Each one of the bus-bars includes a section located on the opening side of the case with respect to the blocks. The bus-bars connected to the P-poles overlap in part, and the bus-bars connected to the N-poles also overlap in part.

Abstract: A case mold type capacitor is formed of multiple metalized film capacitors connected together in parallel and rigidly accommodated with molding resin within a case. The multiple metalized film capacitors are divided into a first block and a second block, and P-poles of each block confront each other, and N-poles thereof also confront each other. Bus-bars including a connection terminal for external connection at an end are connected to respective P-poles and N-poles of each block. The bus-bars connected to the P-poles are coupled together, and the bus-bars connected to the N-poles are coupled together. Each one of the bus-bars includes a section located on the opening side of the case with respect to the blocks. The bus-bars connected to the P-poles overlap in part, and the bus-bars connected to the N-poles also overlap in part.

Abstract: The case mold type capacitor has a capacitor element, a pair of terminals, and molding resin. Each terminal of the pair is connected to a first electrode and a second electrode of the capacitor element, respectively. The capacitor element is embedded in the molding resin in a manner that a terminal section disposed at an end of each of terminals are partially exposed to outside. The molding resin has epoxy resin containing inorganic filler and a moisture absorbent mixed in the epoxy resin.

Abstract: A metalized film capacitor capable of exhibiting stable performance in a wide temperature range is provided. The metalized film capacitor has an elliptical cross sectional shape having a major axis of 60 mm or above. In this capacitor, offset for shifting in the width direction of a pair of metalized film is set to 1.2 mm or above. Since the bonding state between metal vapor-deposited electrode and metal sprayed electrode formed on the end surface is stable, a stable contact between metal sprayed electrode and dielectric film is maintained, thereby preferably maintaining tan ?and exhibiting excellent performance even if the use temperature range is increased and the thermal stress is increased.

Abstract: The case mold type capacitor has a capacitor element, a pair of terminals, and molding resin. Each terminal of the pair is connected to a first electrode and a second electrode of the capacitor element, respectively. The capacitor element is embedded in the molding resin in a manner that a terminal section disposed at an end of each of terminals are partially exposed to outside. The molding resin has epoxy resin containing inorganic filler and a moisture absorbent mixed in the epoxy resin.

Abstract: A case molded capacitor has a metallized film capacitor, a pair of bus bars, a resin-made internal case, molding resin, a metal external case, and a buffer material layer. The bus bars are each connected to respective one of electrodes of the metallized film capacitor. The internal case contains the metallized film capacitor. The metallized film capacitor is submerged with molding resin in the internal case so as to expose parts of the bus bars. The external case contains the internal case and both cases are connected at a connecting part. A buffer material layer is put in a gap made at least at a part between the internal case and the external case.

Abstract: A film capacitor suited to car-mount application, excellent in heat cycle tolerance and humidity resistance, and high in productivity, while maintaining low heat generation and low inductance characteristic is provided. The film capacitor comprises a film capacitor element, a bus bar as metal terminal connected to electrode of this film capacitor element, and a case for containing them, in which the film capacitor element and bus bar are packed within the case by plural layers of epoxy resin compositions, and the plural layers of epoxy resin compositions are composed so that the coefficient of linear expansion is smallest in the composition disposed in the uppermost layer.

Abstract: A metalized film capacitor capable of exhibiting stable performance in a wide temperature range is provided. The metalized film capacitor has an elliptical cross sectional shape having a major axis of 60 mm or above. In this capacitor, offset for shifting in the width direction of a pair of metalized film is set to 1.2 mm or above. Since the bonding state between metal vapor-deposited electrode and metal sprayed electrode formed on the end surface is stable, a stable contact between metal sprayed electrode and dielectric film is maintained, thereby preferably maintaining tan ? and exhibiting excellent performance even if the use temperature range is increased and the thermal stress is increased.

Abstract: A film capacitor suited to car-mount application, excellent in heat cycle tolerance and humidity resistance, and high in productivity, while maintaining low heat generation and low inductance characteristic is provided. The film capacitor comprises a film capacitor element, a bus bar as metal terminal connected to electrode of this film capacitor element, and a case for containing them, in which the film capacitor element and bus bar are packed within the case by plural layers of epoxy resin compositions, and the plural layers of epoxy resin compositions are composed so that the coefficient of linear expansion is smallest in the composition disposed in the uppermost layer.

Abstract: A film capacitor suited to car-mount application, excellent in heat cycle tolerance and humidity resistance, and high in productivity, while maintaining low heat generation and low inductance characteristic is provided. The film capacitor comprises a film capacitor element, a bus bar as metal terminal connected to electrode of this film capacitor element, and a case for containing them, in which the film capacitor element and bus bar are packed within the case by plural layers of epoxy resin compositions, and the plural layers of epoxy resin compositions are composed so that the coefficient of linear expansion is smallest in the composition disposed in the uppermost layer.

Abstract: A case molded capacitor has a metallized film capacitor, a pair of bus bars, a resin-made internal case, molding resin, a metal external case, and a buffer material layer. The bus bars are each connected to respective one of electrodes of the metallized film capacitor. The internal case contains the metallized film capacitor. The metallized film capacitor is submerged with molding resin in the internal case so as to expose parts of the bus bars. The external case contains the internal case and both cases are connected at a connecting part. A buffer material layer is put in a gap made at least at a part between the internal case and the external case.

Abstract: A method of manufacturing a both-side metallized insulation film comprises steps of: depositing zinc or a blend of zinc and aluminum onto both sides of an insulation film; and winding this metallized film into a product roll. The method is characterized in spraying an oxidizing gas onto a deposited layer on an inner side of the insulation film to be wound, during the winding step. During a vacuum deposition step, an oil layer is formed on at least one side of the metallized film. In addition, an oxide layer is formed by exposing a deposited layer on at least one side to oxygen, or by spraying an oxygen-containing gas onto the deposited layer on at least one side during the winding of the metallized film into the product roll.

Abstract: The present invention is to provide a metallized film capacitor having a compact size, a large capacitance and a low inductance whereas number of parts is reduced. The metallized film capacitor comprises: a plurality of capacitor elements (1) provided with metallized contact electrodes (2) on both ends in the width direction; a bus-bar (3) to connect each of a plurality of electrodes (2) on one end; and a capacitor case (5) to house a plurality of capacitor elements (1), wherein a plurality of capacitor elements (1) are arranged in the capacitor case such that one side of electrodes (2) faces the opening surface of capacitor case (1) and each electrode (2) of one of both ends of each capacitor element (1) are positioned generally coplanarly.

Abstract: The invention provides a film capacitor and its manufacturing method suited to car-mount application, excellent in heat cycle tolerance and humidity resistance, and high in productivity, while maintaining low heat generation and low inductance characteristic. A film capacitor comprises a film capacitor element 1, a bus bar 3 as metal terminal connected to electrode 2 of this film capacitor element 1, and a case 8 for containing them, in which the film capacitor element 1 and bus bar 3 are packed within the case 8 by plural layers of epoxy resin compositions 6, 7, and the plural layers of epoxy resin compositions 6, 7 are formed in layers, and are composed so that the coefficient of linear expansion may be smallest in the epoxy resin composition 7 disposed in the uppermost layer, and therefore resin cracks can be prevented at the time of heat cycle, and a film capacitor of high reliability excellent inhumidity resistance is obtained.

Abstract: A metallized-film capacitor includes a slit (5a) at approx. center of the width (W) of an effective electrode which actually forms a capacitance of a pair of deposited electrodes (110, 210). Divisional electrodes (2a, 2b) exist at a place between the center and insulation margins (4a, 4b), and the electrodes (2a, 2b) are coupled in parallel to each other by fuses (7a, 7b) disposed away from metallized contacts (6a, 6b). Such a structure as placing fuses (7a, 7b) away from the contacts (6a, 6b) allows reducing a current supplied from the contacts (6a, 6b) and running through fuses (7a, 7b), thereby lowering heat generated from fuses (7a, 7b). As a result, a temperature rise in the metallized-film capacitor can be suppressed.

Abstract: A metallized-film capacitor includes a slit (5a) at approx. center of the width (W) of an effective electrode which actually forms a capacitance of a pair of deposited electrodes (110, 210). Divisional electrodes (2a, 2b) exist at a place between the center and insulation margins (4a, 4b), and the electrodes (2a, 2b) are coupled in parallel to each other by fuses (7a, 7b) disposed away from metallized contacts (6a, 6b). Such a structure as placing fuses (7a, 7b) away from the contacts (6a, 6b) allows reducing a current supplied from the contacts (6a, 6b) and running through fuses (7a, 7b), thereby lowering heat generated from fuses (7a, 7b). As a result, a temperature rise in the metallized-film capacitor can be suppressed.