Abstract: The present invention is to provide a metallized film capacitor having a compact size, a large capacitance and a low inductance whereas number of parts is reduced. The metallized film capacitor comprises: a plurality of capacitor elements (1) provided with metallized contact electrodes (2) on both ends in the width direction; a bus-bar (3) to connect each of a plurality of electrodes (2) on one end; and a capacitor case (5) to house a plurality of capacitor elements (1), wherein a plurality of capacitor elements (1) are arranged in the capacitor case such that one side of electrodes (2) faces the opening surface of capacitor case (1) and each electrode (2) of one of both ends of each capacitor element (1) are positioned generally coplanarly.

Abstract: A metallized film capacitor is made by winding or laminating a both-side metallized polypropylene (PP) film and a non-metallized PP film. Limiting the heat shrinkage factor and the thickness of the PP films, the position of deposited electrodes, and the rate of the peeled area of the deposited electrodes to a certain range provides a metallized film capacitor having improved dieletric strength, tan ?, and charge-discharge characteristics.

Abstract: A metallized film capacitor made by winding or laminating a both-side metallized polypropylene (PP) film and a non-metallized PP film. Limiting the heat shrinkage factor and the thickness of the PP films, the position of deposited electrodes, and the rate of the peeled area of the deposited electrodes to a curtain range provides a metallized film capacitor having improved dielectric strength, tan &dgr;, and charge-discharge characteristics.

Abstract: The method of manufacturing double surface metallized insulating film of the present invention comprises vacuum depositing zinc or zinc-aluminum mixture on both sides of insulating film and winding the film to a product roll, wherein oxidizing gas is sprayed to an inner side deposited film when it is wound up. Also, during the deposition, oil layer is formed on at least one side of the film, and the deposited film on at least on one side is exposed to an oxygen-contained atmosphere, or oxygen-contained gas is sprayed to at least one side of the vacuum deposited film in the step of winding the film to a product roll, to form an oxide layer. According to the method of manufacturing of the present invention, the problem of a blocking that occurs as a sticking together and peeling off of the deposited films inside the product roll is avoided.

Abstract: A method of manufacturing a laminated electrolytic capacitor by forming a dielectric made of organic polymer or a composite dielectric made of organic polymer and an oxide of a conductive metal is disclosed. An insulating layer is formed on the conductor, and an electrode is formed on the dielectric layer to complete the capacitive element. Plural capacitor elements are laminated and bonded to outside connection terminals.

Abstract: An ignition coil device, which is mounted in a plug hole of an internal combustion engine, comprises a primary coil 1 wound to have larger diameter, a secondary coil 2 wound on a bobbin 2A and disposed inside the primary coil 1, an iron core 3 disposed inside the bobbin 2A, and a shielding case 10 disposed around the primary coil 1, a gap between the primary coil 1 and the secondary coil 2 being filled with an insulating resin 12. The primary coil 1 is made bobbinless so as to secure and increase the withstand voltages of the primary coil and the secondary coil.

Abstract: Through the formation of an organic polymer film on the surface of a bare graphite sheet by electrodeposition or through the application of a resin film to the surface thereof, a good-quality coated graphite sheet of uniform thickness which has excellent electric insulation and a low thermal resistance and prevents graphite powder from separating while retaining thermal conductivity and flexibility of the bare graphite sheet can be provided. The organic polymer film is formed by electrodeposition from a resin selected from the group consisting of an anionic electrodeposition resin, a cationic electrodeposition resin, a thermosetting electrodeposition resin and a UV curing electrodeposition resin or is formed of polyimide. The resin film is applied by a method selected from the group consisting of dipping, spin coating, screen printing, brushing and spraying, using at least one resin selected from the group consisting of an epoxy resin, a polyimide resin and a fluororesin.

Abstract: A capacitor of the present invention employs one of i) polyimide directly formed by electrodeposition, ii) organic high polymer having a specific structure formed by electrodeposition, and iii) a composite film of the organic high polymer and oxide film of a conductor as dielectrics formed on the surface-roughened conductor. The organic high polymer used in the present invention contains carboxylic radical in its molecular structure. The capacitor of the present invention further comprises an opposite electrode at least containing conductive high polymer on the dielectrics. This conductive high polymer is formed by chemical oxydation-polymerization or both chemical oxydation-polymerization and electro-polymerization. The capacitor element as configured above is strong to mechanical stress, and possible to apply pressure during lamination.

Abstract: A capacitor of the present invention employs one of i) polyimide directly formed by electrodeposition, ii) organic high polymer having a specific structure formed by electrodeposition, and iii) a composite film of the organic high polymer and oxide film of a conductor as dielectrics formed on the surface-roughened conductor. The organic high polymer used in the present invention contains carboxylic radical in its molecular structure. The capacitor of the present invention further comprises an opposite electrode at least containing conductive high polymer on the dielectrics. This conductive high polymer is formed by chemical oxydation-polymerization or both chemical oxydation-polymerization and electro-polymerization. The capacitor element as configured above is strong to mechanical stress, and possible to apply pressure during lamination.

Abstract: An ignition coil device, which is mounted in a plug hole of an internal combustion engine, comprises a primary coil 1 wound to have a first diameter, a secondary coil 2 wound on a bobbin 2A and disposed inside the primary coil 1, an iron core 3 disposed inside the bobbin 2A, and a shielding case 10 disposed around the primary coil 1, a gap between the primary coil 1 and the secondary coil 2 being filled with an insulating resin 12. The primary coil 1 is made bobbinless so as to secure and increase the withstand voltages of the primary coil and the secondary coil.

Abstract: A miniaturized, inexpensive flowmeter capable of accurately measuring a flow rate comprises a flow rate detector including a plurality of thermal type flow rate detector elements mounted on a support plate, a power source for applying power to the flow rate detector, and a signal processor for calculating the flow rate from supplied power.

Abstract: A plurality of flow velocity sensors are vertically installed in line at different positions in the same cross section in a gas flow passage in a pipe. Detection signals from the flow velocity sensors are inputted to a mean flow velocity computing unit which calculates a mean value of flow velocity measurements. The mean flow rate calculated at the mean flow velocity computing unit is converted into a flow rate by a flow rate computing unit to be displayed by a display. Regardless of flow velocity distribution in the pipe, which may change due to differences in the pipe shape, flow rates are accurately measured. As a result, flow rates are accurately measured over a wide range.

Abstract: A semiconductor integrated-circuit apparatus includes an electro-conductive layer formed on a substrate, a plurality of internal cells formed on the electro-conductive layer, a plurality of bonding pads arranged around the internal cells, and a plurality of bias cells which are common to the plurality of internal cells and which generate a predetermined voltage. A plurality of bias buffer circuits supply the predetermined voltage generated in the bias cells to the internal cells.

Abstract: A semiconductor integrated-circuit apparatus includes an electro-conductive layer formed on a substrate, a plurality of internal cells formed on the electro-conductive layer, a plurality of bonding pads arranged around the internal cells, and a plurality of bias cells which are common to the plurality of internal cells and which generate a predetermined voltage. A plurality of bias buffer circuits supply the predetermined voltage generated in the bias cells to the internal cells.

Abstract: A semiconductor integrated-circuit apparatus includes a electro-conductive layer formed on a substrate, a plurality of internal cells formed on the electro-conductive layer, a plurality of bonding pads arranged around the internal cells, and a plurality of bias cells which are common to the plurality of internal cells and which generate a predetermined voltage. A plurality of bias buffer circuits supply the predetermined voltage generated in the bias cells to the internal cells.