Abstract: A manufacturing process system includes: a plurality of processing devices which processes workpieces, with respective equipment associated with the plurality of processing devices; a transfer device which transfers the workpieces to the plurality of processing devices; a host computer which performs creating a transfer plan including information of timings at which the workpieces are carried in and out by the transfer device and acquiring an operation schedule including information of maintenance time from the plurality of processing devices; and a processing device group controller which performs acquiring the transfer plan and the operation schedule from the host computer, comparing the transfer plan and the operation schedule of each processing device, specifying the last process before maintenance for each processing device, detecting the end timing of the specified process, and instructing each processing device to be switched to an idle state at the end timing along with the associated equipment.

Abstract: There is provided a production processing system including: a production efficiency improvement device configured to select a processing apparatus that processes workpieces in consideration of a position of each of a plurality of processing apparatuses arranged along a transfer path; and a transfer control device configured to move a transfer apparatus that transfers workpieces from a predetermined position on the transfer path to the selected processing apparatus.

Abstract: A processing indicating device to improve the efficiency of processing on an object. The device includes a first communication unit which communicates information with a plurality of processing devices for processing the object and a second communication unit which communicates information with a conveyance controlling device controlling conveying of the object to the plurality of processing devices. An arrival time predicting unit predicts on the basis of information received by the second communication unit, the time when the conveying device arrives at one of the processing devices. In addition, a finish time predicting unit receives information and predicts the time when the processing on the object in the one processing device finishes. A processing indicating unit causes processing control information that orders the execution of device state improvement treatment to be transmitted to the one processing device on the basis of the predicted respective times.

Abstract: A processing indicating device to improve the efficiency of processing on an object. The device includes a first communication unit which communicates information with a plurality of processing devices for processing the object and a second communication unit which communicates information with a conveyance controlling device controlling conveying of the object to the plurality of processing devices. An arrival time predicting unit predicts on the basis of information received by the second communication unit, the time when the conveying device arrives at one of the processing devices. In addition, a finish time predicting unit receives information and predicts the time when the processing on the object in the one processing device finishes. A processing indicating unit causes processing control information that orders the execution of device state improvement treatment to be transmitted to the one processing device on the basis of the predicted respective times.

Abstract: A method for correcting inclination of a wafer chuck includes obtaining in advance a correction amount for each of the semiconductor chips which corrects the inclination of the wafer chuck in the case of applying a contact load to at least each one of the semiconductor chips and storing each of the correction amounts in a data storage unit; calculating a total correction amount for correcting the inclination of the wafer chuck by calculating the correction amount of each of the semiconductor chips bringing into contact with the probes when the semiconductor wafer comes into electrical contact with the probes and adding the calculated correction amounts; and correcting the inclination of the wafer chuck based on the total correction amount.

Abstract: There is provided a production processing system including: a production efficiency improvement device configured to select a processing apparatus that processes workpieces in consideration of a position of each of a plurality of processing apparatuses arranged along a transfer path; and a transfer control device configured to move a transfer apparatus that transfers workpieces from a predetermined position on the transfer path to the selected processing apparatus.

Abstract: A processing device group controller includes: a storage unit which stores an operation schedule including information of maintenance time for a plurality of processing devices for processing workpieces, with respective equipment associated with the plurality of processing devices, and a transfer plan including information of timings at which the workpieces are carried in and out of the plurality of processing devices; a detecting unit which performs a step of comparing the transfer plan and the operation schedule of each processing device, a step of specifying the last process before maintenance for each processing device, and a step of detecting the end timing of the specified process; and an instruction unit which instructs each processing device to be switched to an idle state at the end timing along with the associated equipment.

Abstract: Disclosed is a pre-alignment method and a computer-readable medium storing a pre-alignment program capable of reducing pre-alignment time and transfer time of a semiconductor wafer.

Abstract: A substrate transfer system includes a substrate storing apparatus for storing therein one or more substrates; at least one substrate processing apparatus for performing a predetermined processing on the substrate; and a substrate transfer apparatus for transferring the substrate by moving between the substrate storing apparatus and the substrate processing apparatus, the substrate transfer apparatus including at least one substrate transfer unit for supporting the substrate, unloading the substrate from the substrate storing apparatus or the substrate processing apparatus, and loading the substrate into the substrate storing apparatus of the substrate processing apparatus. The substrate transfer apparatus moves while supporting the substrate by the substrate transfer unit.

Abstract: A method for correcting inclination of a wafer chuck includes obtaining in advance a correction amount for each of the semiconductor chips which corrects the inclination of the wafer chuck in the case of applying a contact load to at least each one of the semiconductor chips and storing each of the correction amounts in a data storage unit; calculating a total correction amount for correcting the inclination of the wafer chuck by calculating the correction amount of each of the semiconductor chips bringing into contact with the probes when the semiconductor wafer comes into electrical contact with the probes and adding the calculated correction amounts; and correcting the inclination of the wafer chuck based on the total correction amount.

Abstract: Disclosed is a pre-alignment method and a computer-readable medium storing a pre-alignment program capable of reducing pre-alignment time and transfer time of a semiconductor wafer.

Abstract: A transfer method employs a transfer system including a semiconductor handling device and an automatic transfer device. The semiconductor handling device includes a first transfer mechanism and a first optically coupled parallel I/O communications interface. The automatic transfer device includes a second transfer mechanism and a second optically coupled parallel I/O communications interface. The transfer method includes a successive transfer notifying step wherein the automatic transfer device and the semiconductor handling device notify each other that a successive transfer is possible via an optical communications between the first and the second optically coupled parallel I/O communications interface in case where a plurality of objects to be processed are able to be successively transferred one by one between the first and the second transfer mechanism; and a successive transfer step wherein the objects are transferred one by one between the first and the second transfer mechanism.

Abstract: In a substrate transfer apparatus, an adaptor unit 25 includes a box-shaped main body 40 having three open sides; and a plurality of stage arms 41 disposed in the main body 40, serving as substrate mounting members. Each of the stage arms 41 has a disc-shaped wafer supporting portion 411 disposed at an approximately central portion of the main body 40 and a flat body 412 disposed in the main body 40 so as not to interfere with the moving paths of transfer arms 241 and 341. Formed at a connecting portion of the wafer supporting portion 411 and the body 412 are cutout portions 413 for preventing interference between the stage arms 41 and two prongs of leading end portions of the transfer arms 241 and 341 introduced into the main body 40.

Abstract: The present invention relates to conveyance method for transporting a plurality of unprocessed/processed objects between an automatic transporting device (AGV) and a semiconductor manufacturing device (prober). The prober has a load port to/from which the objects are delivered from/to the AGV. The method comprises the steps of: making a communication between the AGV and the prober to decide respective timings of deliveries of the objects to/from the load port; and transporting the objects between the AGV and the prober via the load port, with the timings of the deliveries of the objects to/from the load port shifted from each other by using a holding site for provisionally holding the object. The holding site is at least one of components of the AGV and the prober other than the load port.

Abstract: There is a jump in the number of devices formed on a single wafer, and it takes a lot of time to inspect a single wafer. In addition, if wafers are inspected every lot, detected wafers remain in staying in a prober until the inspection of all of the wafers is completed. Therefore, the time required to transfer the wafers of each lot to the subsequent step is delayed. As a result, it is difficult to shorten TAT (Turn-Around-Time), and it is difficult to flexibly operate the prober. A transfer system E according to the present invention includes: a host computer 1; a plurality of probers 2 under the control of the host computer 1; a plurality of RGVs 4 for delivering a wafer W to each of the probers 2, one by one, at its request; and a transfer operating unit 5, associated with the host computer, for operating the RGVs 4.

Abstract: The present invention relates to conveyance method for transporting a plurality of unprocessed/processed objects between an automatic transporting device (AGV) and a semiconductor manufacturing device (prober). The prober has a load port to/from which the objects are delivered from/to the AGV. The method comprises the steps of: making a communication between the AGV and the prober to decide respective timings of deliveries of the objects to/from the load port; and transporting the objects between the AGV and the prober via the load port, with the timings of the deliveries of the objects to/from the load port shifted from each other by using a holding site for provisionally holding the object. The holding site is at least one of components of the AGV and the prober other than the load port.

Abstract: A substrate transfer system includes a substrate storing apparatus for storing therein one or more substrates; at least one substrate processing apparatus for performing a predetermined processing on the substrate; and a substrate transfer apparatus for transferring the substrate by moving between the substrate storing apparatus and the substrate processing apparatus, the substrate transfer apparatus including at least one substrate transfer unit for supporting the substrate, unloading the substrate from the substrate storing apparatus or the substrate processing apparatus, and loading the substrate into the substrate storing apparatus of the substrate processing apparatus. The substrate transfer apparatus moves while supporting the substrate by the substrate transfer unit.

Abstract: In a substrate transfer apparatus, an adaptor unit 25 includes a box-shaped main body 40 having three open sides; and a plurality of stage arms 41 disposed in the main body 40, serving as substrate mounting members. Each of the stage arms 41 has a disc-shaped wafer supporting portion 411 disposed at an approximately central portion of the main body 40 and a flat body 412 disposed in the main body 40 so as not to interfere with the moving paths of transfer arms 241 and 341. Formed at a connecting portion of the wafer supporting portion 411 and the body 412 are cutout portions 413 for preventing interference between the stage arms 41 and two prongs of leading end portions of the transfer arms 241 and 341 introduced into the main body 40.

Abstract: A transfer method employs a transfer system including a semiconductor handling device and an automatic transfer device. The semiconductor handling device includes a first transfer mechanism and a first optically coupled parallel I/O communications interface. The automatic transfer device includes a second transfer mechanism and a second optically coupled parallel I/O communications interface. The transfer method includes a successive transfer notifying step wherein the automatic transfer device and the semiconductor handling device notify each other that a successive transfer is possible via an optical communications between the first and the second optically coupled parallel I/O communications interface in case where a plurality of objects to be processed are able to be successively transferred one by one between the first and the second transfer mechanism; and a successive transfer step wherein the objects are transferred one by one between the first and the second transfer mechanism.

Abstract: A conveyance system E for wafers W includes a host computer 1 for carrying out the management of the production of semiconductor devices, a plurality of probers 2 for inspecting the electric characteristics of the wafers W under the administration of the host computer 1, an AGV 3 for automatically transporting the wafers W in block of a carrier in order to deliver the wafers W one by one to these probers 2 according to respective demands and an AGV controller 4 for controlling the operation of the AGV 3 under the administration of the host computer 1.