Abstract: With a scanning probe microscope, if a plurality of sample properties are measured using a scanning scheme of allowing a probe to approach and withdraw from a sample, the sample properties need to be accurately and reliably detected in the minimum required measurement time. Further, the acting force between the probe and the sample varies depending on the type of the probe and the wear condition of a probe tip. Thus, disadvantageously, property values acquired using different probes cannot be compared with one another unless the artifactual effect of the measuring probes are eliminated. In accordance with the present invention, with a scanning probe microscope, the probe is brought into intermittent contact with the sample, while driving means repeatedly allows the probe to approach and withdraw from the sample with a variable amplitude. The sample property is thus acquired at a high speed.

Abstract: In a displacement measurement apparatus using light interference, a probe light path is spatially separated from a reference light path. Therefore, when a temperature or refractive index distribution by a fluctuation of air or the like, or a mechanical vibration is generated, an optical path difference fluctuates between both of the optical paths, and a measurement error is generated. In the solution, an optical axis of probe light is brought close to that of reference light by a distance which is not influenced by any disturbance, a sample is irradiated with the probe light, a reference surface is irradiated with the reference light, reflected light beams are allowed to interfere with each other, and a displacement of the sample is obtained from the resultant interference light to thereby prevent the measurement error from being generated by the fluctuation of the optical path difference.

Abstract: A method and apparatus for detecting defects are provided for detecting harmful defects or foreign matter with high sensitivity on an object to be inspected with a transparent film, such as an oxide film, by reducing noise due to a circuit pattern. The apparatus for detecting defects includes a stage part on which a substrate specimen is put and which is arbitrarily movable in each of the X-Y-Z-? directions, an illumination system for irradiating the circuit pattern with light from an inclined direction, and an image-forming optical system for forming an image of an irradiated detection area on a detector from the upward and oblique directions. With this arrangement, diffracted light and scattered light caused on the circuit pattern through the illumination by the illumination system is collected. Furthermore, a spatial filter is provided on a Fourier transform surface for blocking the diffracted light from a linear part of the circuit pattern.

Abstract: The present invention provides a displacement measurement method, an apparatus thereof, a probe microscope. which make it possible to stably measure an amount of displacement and a moving distance of an object under measurement with an accuracy of the sub-nanometer order or below without being affected by disturbances such as fluctuations of air, mechanical vibration. Specifically, with the present invention, a pulsed beam is split into two; one beam is reflected by an object under measurement and then inputted to a delay optical path equivalent to one pulse period; and the other beam is sent through the same delay optical path in the opposite direction up to the object under measurement with a delay of one pulse period, and then reflected by the object under measurement. Then, an optical phase variation caused by the movement of the object under measurement is obtained by subjecting the two pulsed beams to interference.

Abstract: A scanning probe microscope capable of measuring accurate 3-D shape information of a sample with high through-put without damaging a sample. In a method for acquiring an accurate 3-D shape of a sample without imparting damage to the sample by bringing a probe into contact at only a measurement point, once pulling up and retracting the probe when it moves towards a next measurement point, moving the probe towards the next measurement point and allowing it to approach, a deflection signal of the probe and its twist signal area analyzed so that measurement can be made at a minimum necessary retraction distance. Control for minimizing residual oscillation at the time of transverse movement is made so that a measurement frequency can be raised and high speed measurement can be accomplished.

Abstract: In the case of measuring a pattern having a steep side wall, a probe adheres to the side wall by the van der Waals forces acting between the probe and the side wall when approaching the pattern side wall, and an error occurs in a measured profile of the side wall portion. When a pattern having a groove width almost equal to a probe diameter is measured, the probe adheres to both side walls, the probe cannot reach the groove bottom, and the groove depth cannot be measured. When the probe adheres to a pattern side wall in measurements of a microscopic high-aspect ratio pattern using an elongated probe, the probe is caused to reach the side wall bottom by detecting the adhesion of the probe to the pattern side wall, and temporarily increasing a contact force between the probe and the sample. Also, by obtaining the data of the amount of torsion of a cantilever with the shape data of the pattern, a profile error of the side wall portion by the adhesion is corrected by the obtained data of the amount of torsion.

Abstract: A method and apparatus for detecting defects are provided for detecting harmful defects or foreign matter with high sensitivity on an object to be inspected with a transparent film, such as an oxide film, by reducing noise due to a circuit pattern. The apparatus for detecting defects includes a stage part on which a substrate specimen is put and which is arbitrarily movable in each of the X-Y-Z-? directions, an illumination system for irradiating the circuit pattern with light from an inclined direction, and an image-forming optical system for forming an image of an irradiated detection area on a detector from the upward and oblique directions. With this arrangement, diffracted light and scattered light caused on the circuit pattern through the illumination by the illumination system is collected. Furthermore, a spatial filter is provided on a Fourier transform surface for blocking the diffracted light from a linear part of the circuit pattern.

Abstract: A semiconductor device manufacturing technique measures simultaneously a plurality of points on a sample to realize a high-speed three-dimensional shape measurement and reflects it to setting of a processing condition in a semiconductor device process, thereby making it possible to realize stable device manufacture with high precision. A three-dimensional shape measuring apparatus loaded on a processing apparatus such as an etcher, a coater-developer, a baking machine, or a lithography machine measures a plurality of points (500) on a sample (300) at high speed by arranging a plurality of measurement heads (100) for measuring a three-dimensional shape of the sample and by combining it with movement of an loader/stage (200) loading the sample (300). By using this measurement result, feeding back for correcting a processing condition with respect to the subsequent sample (300) and feeding forward for correcting a processing condition in the next step are realized.

Abstract: An inspection apparatus and method includes a light source which emits an ultraviolet laser beam, an illuminating unit having a polarization controller and an object lens for illuminating a specimen with light emitted from the light source and passed through the polarization controller and the object lens, a detection unit having a sensor for detecting light from the specimen illuminated by the illuminating unit, a processor which processes a signal output from the sensor so as to detect a defect on the specimen, and a display which displays information output from the processor. The processor processes an image formed from the signal output from the sensor in which the image is reduced in speckle pattern.

Abstract: In measuring the displacement of an object using the phase-shifting light interference, since three beam splitters were used for generating the four phase-shifting optical paths, an interferometer was increased in size, whereby the application objects were limited.

Abstract: A method and apparatus for inspecting defects includes emitting an ultraviolet light from an ultraviolet light source, illuminating a specimen with the ultraviolet light in which a polarization condition of the ultraviolet light is controlled, controlling a polarization condition of light reflected from the specimen which is illuminated by the polarization condition controlled ultraviolet light, detecting the light reflected from the specimen, processing the detected light so as to detect defects, and outputting information about the defects. The ultraviolet light source is disposed in a clean environment supplied with clean gas and separated from outside.

Abstract: An inspecting apparatus and method including first and second illuminating units for illuminating a surface of a specimen to be inspected with different incident angles and first and second detecting optical units arranged at different elevation angle directions to the surface of the specimen for detecting images of the specimen illuminated by the first and second illuminating units.

Abstract: An Inspection apparatus and method includes utilizing an emitter which emits a light beam, an illumination optical system, a detection optical system, and a processor. The illumination optical system includes a polarization controller, a coherence reducer, and an objective lens, for illuminating a specimen with a polarization condition controlled and coherency reduced light beam through the objective lens. The detection optical system includes an imaging lens and a sensor for detecting an image of the specimen illuminated by the light beam through the illumination optical system. The processor processes a signal outputted from the sensor and detects a defect on the specimen.

Abstract: An apparatus for inspecting defects including a table which mounts a specimen to be inspected and which is movable in a plane, an ultraviolet light source for emitting ultraviolet light, an illuminating unit for illuminating the specimen mounted on the table with light emitted from the ultraviolet light source, a detecting unit for forming an image of the specimen illuminated by the illuminating unit and for detecting the image with an image sensor, and an image processing unit for processing the image detected by the image sensor and for outputting information about defects detected on the specimen. The illuminating unit and detecting unit are disposed in a clean environment which is supplied therein with clean gas and which is separated from outside by a wall.

Abstract: The invention provides a scanning probe microscope capable of performing highly accurate three-dimensional profile measurement in a state in which no sliding of the probe or deformation of the sample substantially occurs.

Abstract: A scanning probe microscope, capable of performing shape measurement not affected by electrostatic charge distribution of a sample, which: monitors an electrostatic charge state by detecting a change in a flexure or vibrating state of a cantilever due to electrostatic charges in synchronization with scanning during measurement with relative scanning between the probe and the sample, and makes potential adjustment so as to cancel an influence of electrostatic charge distribution, thus preventing damage of the probe or the sample due to discharge and achieving reduction in measurement errors due to electrostatic charge distribution.

Abstract: The present invention provides a method of using an accurate three-dimensional shape without damaging a sample by making a probe contact the sample only at a measuring point, lifting and retracting the probe when moving to the next measuring point and making the probe approach the sample after moving to the next measuring point, wherein high frequency/minute amplitude cantilever excitation and vibration detection are performed and further horizontal direction excitation or vertical/horizontal double direction excitation are performed to improve the sensitivity of contacting force detection on a slope of steep inclination. The method uses unit for inclining the probe in accordance with the inclination of a measurement target and a structure capable of absorbing or adjusting the orientation of the light detecting the condition of contact between the probe and sample after reflection on the cantilever, which varies a great deal depending on the inclination of the probe.

Abstract: A defects inspecting apparatus having: a scanning stage for running into a predetermined direction while mounting an inspection target substrate thereon; an illumination optic system for irradiating an illumination light beam upon a surface of the inspection target substrate at a predetermined angle inclined thereto; a detection optic system including, an upper-directed photo-detector for receiving upper-directed reflected/scattered lights emitting upwards from the inspection target substrate, thereby converting them into an upper-directed image signal, and a side-directed photo-detector for receiving side-directed reflected/scattered lights emitting for the inspection target substrate into an inclined direction, so as to flatly intersects the illumination light beam, and thereby converting into a side-directed image signal; and a signal processing system-for detecting defects upon basis of the upper-directed image signal and the side-directed image signal.

Abstract: A TFT device having a pixel portion and a driving circuit portion formed on a glass substrate; wherein at least the active layer (active region) of a transistor constituting said driving circuit comprises polycrystalline silicon including crystals that do not have crystal grain boundaries which cross the direction of current flow.

Abstract: Making it possible to execute the detection of the particles floating inside a processing chamber with the use of an optical system including one observing window and one unit (An object of the present invention is, by using an optical system including one observing window and one unit, to make it possible to execute the detection of the particles floating inside a processing chamber.) Also, in order to be able to detect exceedingly feeble particle scattered-lights with a high-accuracy, when performing a desired thin-film forming or thin-film processing treatment toward a to-be-processed target inside the processing chamber, the following method is employed: First, the irradiation with a beam is executed into the processing chamber through the observing window.