Patents by Inventor Toshihiko Takeda

Toshihiko Takeda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11903167
    Abstract: A vapor chamber in which an enclosed space is formed, and a working fluid is sealed in this space, the enclosed space including: a plurality of condensate flow paths through which a fluid that is the working fluid in a condensing state flows; and vapor flow paths through which a vapor that is the working fluid in a vaporizing state flows, wherein each of projecting parts with which each of the vapor flow paths is provided has a projecting amount varying in an extending direction of the vapor flow paths; a pitch for opening parts that allow the vapor flow paths and the condensate flow paths to communicate varies in the extending direction of the vapor flow paths; or wall parts that separate the flow paths each have a given relationship with a transverse cross section of a given flow path.
    Type: Grant
    Filed: May 30, 2019
    Date of Patent: February 13, 2024
    Assignee: DAI NIPPON PRINTING CO., LTD.
    Inventors: Shinichiro Takahashi, Takayuki Ota, Kazunori Oda, Toshihiko Takeda, Kiyotaka Takematsu, Terutoshi Momose, Yoko Nakamura
  • Patent number: 11859913
    Abstract: A wick sheet for a vapor chamber is sandwiched between a first sheet and a second sheet of the vapor chamber that encloses a working fluid. The wick sheet for a vapor chamber includes a sheet body having a first body surface and a second body surface, a penetration space that penetrates the sheet body, a first groove assembly that is disposed on the second body surface and that communicates with the penetration space, and the second groove assembly that is disposed on the first body surface and that communicates with the penetration space. The flow channel cross-sectional area of a second mainstream groove of the second groove assembly is greater than the flow channel cross-sectional area of a first mainstream groove of the first groove assembly.
    Type: Grant
    Filed: September 9, 2020
    Date of Patent: January 2, 2024
    Assignee: DAI NIPPON PRINTING CO., LTD.
    Inventors: Kazunori Oda, Toshihiko Takeda, Shinichiro Takahashi, Takayuki Ota
  • Publication number: 20230026517
    Abstract: A wick sheet for a vapor chamber includes a sheet body having a first body surface and a second body surface, a first vapor flow channel portion, a liquid flow channel portion provided on the second body surface, and the second vapor flow channel portion provided on the first body surface. The sheet body includes a land portion having the longitudinal direction being a first direction, and the first vapor flow channel portion is disposed around the land portion. The second vapor flow channel portion includes a vapor flow channel groove extending from one of side edges of the land portion to the other side edge in a second direction orthogonal to the first direction.
    Type: Application
    Filed: January 8, 2021
    Publication date: January 26, 2023
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Kazunori ODA, Toshihiko TAKEDA, Shinichiro TAKAHASHI, Takayuki OTA
  • Publication number: 20230006139
    Abstract: A step of preparing a resin plate-equipped metal mask including a metal mask in which a slit is provided and a resin plate, and a step of laser irradiation from the metal mask side to form an opening corresponding to a pattern to be produced by vapor deposition in the resin plate are included, wherein in the step of forming the opening, by using a laser mask in which an opening region corresponding to the opening and an attenuating region that is positioned in a periphery of the opening region and attenuates energy of the laser, the opening corresponding to the pattern to be produced by vapor deposition is formed with respect to the resin plate with the laser that passes through the opening region, and a thin part is formed in a periphery of the opening of the resin plate with the laser that passes through the attenuating region.
    Type: Application
    Filed: September 7, 2022
    Publication date: January 5, 2023
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Yoshiko MIYADERA, Takayoshi NIRENGI, Toshihiko TAKEDA
  • Patent number: 11511301
    Abstract: A method for producing a vapor deposition mask capable of satisfying both enhancement in definition and reduction in weight even when a size increased, a method for producing a vapor deposition mask device capable of aligning the vapor deposition mask to a frame with high precision, and a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition are provided. A metal mask provided with a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows, are stacked.
    Type: Grant
    Filed: November 18, 2020
    Date of Patent: November 29, 2022
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Yoshinori Hirobe, Yutaka Matsumoto, Masato Ushikusa, Toshihiko Takeda, Hiroyuki Nishimura, Katsunari Obata, Takashi Takekoshi
  • Patent number: 11437578
    Abstract: A method for producing a frame-equipped vapor deposition mask sequentially includes preparing a vapor deposition mask including a metal mask having a slit and a resin mask having an opening corresponding to a pattern to be produced by vapor deposition at a position overlapping the slit, the metal mask and the resin mask being stacked, retaining a part of the vapor deposition mask by a retainer and stretching the vapor deposition mask retained by the retainer outward, and fixing the vapor deposition mask in a state of being stretched to a frame having a through hole. During stretching, any one or both adjustments of a rotating adjustment and a moving adjustment of the vapor deposition mask are performed with respect to the vapor deposition mask in the state of being stretched or with the vapor deposition mask being stretched.
    Type: Grant
    Filed: July 8, 2020
    Date of Patent: September 6, 2022
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Katsunari Obata, Toshihiko Takeda, Yoshiyuki Honma, Hideyuki Okamoto
  • Publication number: 20220279678
    Abstract: Included are a plurality of first flow paths, and second flow paths arranged between adjacent ones of the first flow paths; and a layer including grooves constituting the first flow paths and the second flow paths, and a layer laminated on the insides of the grooves, and constituting inner surfaces of the first flow paths and the second flow paths.
    Type: Application
    Filed: September 4, 2020
    Publication date: September 1, 2022
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Shinichiro TAKAHASHI, Takayuki OTA, Kazunori ODA, Toshihiko TAKEDA, Kiyotaka TAKEMATSU, Terutoshi MOMOSE
  • Patent number: 11404640
    Abstract: A vapor deposition mask includes a metal mask and a resin mask having an opening. An inner wall surface for composing the opening has an inflection point in a thicknesswise cross section of the resin mask. When an intersection of a first surface, not facing the metal mask, of the resin mask and the inner wall surface is set to be a first intersection, an intersection of a second surface, facing the metal mask, of the resin mask and the inner wall surface is set to be a second intersection, and there is set a first inflection point first positioned from the first intersection toward the second intersection, an angle formed by a line connecting the first intersection and the first inflection point and the first surface is larger than an angle formed by a line connecting the first inflection point and the second intersection and the second surface.
    Type: Grant
    Filed: September 30, 2020
    Date of Patent: August 2, 2022
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Toshihiko Takeda, Katsunari Obata, Hiroshi Kawasaki
  • Publication number: 20220120509
    Abstract: A vapor chamber having an enclosure which a working fluid is sealed in, the enclosure including: a first flow path; and a fluid flow path part that is adjacent to the first flow path.
    Type: Application
    Filed: March 11, 2020
    Publication date: April 21, 2022
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Toshihiko TAKEDA, Kazunori ODA, Takayuki OTA, Kiyotaka TAKEMATSU, Shinichiro TAKAHASHI, Terutoshi MOMOSE, Yohei TSUGANEZAWA, Yoko NAKAMURA
  • Publication number: 20210392781
    Abstract: A wick sheet for a vapor chamber is sandwiched between a first sheet and a second sheet of the vapor chamber that encloses a working fluid. The wick sheet for a vapor chamber includes a sheet body having a first body surface and a second body surface, a penetration space that penetrates the sheet body, a first groove assembly that is disposed on the second body surface and that communicates with the penetration space, and the second groove assembly that is disposed on the first body surface and that communicates with the penetration space. The flow channel cross-sectional area of a second mainstream groove of the second groove assembly is greater than the flow channel cross-sectional area of a first mainstream groove of the first groove assembly.
    Type: Application
    Filed: September 9, 2020
    Publication date: December 16, 2021
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Kazunori ODA, Toshihiko TAKEDA, Shinichiro TAKAHASHI, Takayuki OTA
  • Publication number: 20210269913
    Abstract: There are provided a vapor deposition mask capable of satisfying both high definition and lightweight in upsizing and forming a vapor deposition pattern with high definition while securing strength, a method for producing a vapor deposition mask and a vapor deposition mask preparation body capable of simply producing the vapor deposition mask, and furthermore, a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition. A metal mask 10 in which a plurality of slits 15 are provided and a resin mask 20 are stacked. Openings 25 required for composing a plurality of screens are provided in the resin mask 20. The openings 25 correspond to a pattern to be produced by vapor deposition. Each of the slits 15 is provided at a position of overlapping with an entirety of at least one screen.
    Type: Application
    Filed: May 24, 2021
    Publication date: September 2, 2021
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Toshihiko Takeda, Katsunari Obata, Hiromitsu Ochiai
  • Publication number: 20210207258
    Abstract: There are provided a vapor deposition mask capable of satisfying both high definition and lightweight in upsizing and forming a vapor deposition pattern with high definition while securing strength, a vapor deposition mask preparation body capable of simply producing the vapor deposition mask and a method for producing a vapor deposition mask, and furthermore, a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition. A metal mask 10 in which a slit 15 is provided and a resin mask 20 in which openings 25 corresponding to a pattern to be produced by vapor deposition are provided at a position of overlapping with the slit 15 are stacked, and the metal mask 10 has a general region 10a in which the slit 15 is provided and a thick region 10b larger in thickness than the general region.
    Type: Application
    Filed: March 19, 2021
    Publication date: July 8, 2021
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Katsunari OBATA, Toshihiko TAKEDA, Hiroshi KAWASAKI, Hiroyuki NISHIMURA, Atsushi MAKI, Hiromitsu OCHIAI, Yoshinori HIROBE
  • Patent number: 11041237
    Abstract: There are provided a vapor deposition mask capable of satisfying both high definition and lightweight in upsizing and forming a vapor deposition pattern with high definition while securing strength, a method for producing a vapor deposition mask and a vapor deposition mask preparation body capable of simply producing the vapor deposition mask, and furthermore, a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition. A metal mask 10 in which a plurality of slits 15 are provided and a resin mask 20 are stacked. Openings 25 required for composing a plurality of screens are provided in the resin mask 20. The openings 25 correspond to a pattern to be produced by vapor deposition. Each of the slits 15 is provided at a position of overlapping with an entirety of at least one screen.
    Type: Grant
    Filed: February 19, 2018
    Date of Patent: June 22, 2021
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Toshihiko Takeda, Katsunari Obata, Hiromitsu Ochiai
  • Publication number: 20210168969
    Abstract: A vapor chamber in which an enclosed space is formed, and a working fluid is sealed in this space, the enclosed space including: a plurality of condensate flow paths through which a fluid that is the working fluid in a condensing state flows; and vapor flow paths through which a vapor that is the working fluid in a vaporizing state flows, wherein each of projecting parts with which each of the vapor flow paths is provided has a projecting amount varying in an extending direction of the vapor flow paths; a pitch for opening parts that allow the vapor flow paths and the condensate flow paths to communicate varies in the extending direction of the vapor flow paths; or wall parts that separate the flow paths each have a given relationship with a transverse cross section of a given flow path.
    Type: Application
    Filed: May 30, 2019
    Publication date: June 3, 2021
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Shinichiro TAKAHASHI, Takayuki OTA, Kazunori ODA, Toshihiko TAKEDA, Kiyotaka TAKEMATSU, Terutoshi MOMOSE, Yoko NAKAMURA
  • Publication number: 20210167290
    Abstract: A vapor deposition mask capable of correctly performing confirmation of whether a shape pattern of openings formed in a resin mask is normal or similar confirmation while satisfying both high definition and lightweight, a vapor deposition mask preparation body for obtaining the vapor deposition mask, a frame-equipped vapor deposition mask including the vapor deposition mask, and a method for producing an organic semiconductor element using the frame-equipped vapor deposition mask. The aforementioned problem is solved by using, in a vapor deposition mask including a metal mask in which a through hole is formed and a resin mask in which an opening corresponding to a pattern to be produced by vapor deposition is formed at a position overlapping with the through hole, the metal mask and the resin mask being stacked, wherein the resin mask has about 40% or less of light ray transmittance at a wavelength of about 550 nm.
    Type: Application
    Filed: January 20, 2021
    Publication date: June 3, 2021
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Toshihiko TAKEDA, Hiroshi KAWASAKI, Katsunari OBATA
  • Publication number: 20210156020
    Abstract: In a method for forming a vapor deposition pattern using a vapor deposition mask provided with a plurality of openings corresponding to a pattern that is produced by vapor deposition, and forming a vapor deposition pattern in a vapor deposition target, the method includes a close contact step of disposing the vapor deposition mask on one surface side of the vapor deposition target, disposing a pressing member and a magnetic plate in layer in this order on the other surface side of the vapor deposition target, and bringing the vapor deposition target and the vapor deposition mask into close contact with each other by using magnetism of the magnetic plate, and a vapor deposition pattern forming step of causing a vapor deposition material released from a vapor deposition source to adhere to the vapor deposition target through openings after the close contact step, and forming the vapor deposition pattern in the vapor deposition target.
    Type: Application
    Filed: February 5, 2021
    Publication date: May 27, 2021
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Toshihiko TAKEDA, Yoshinori HIROBE, Yoshiko MIYADERA, Katsunari OBATA, Naoto YAMADA
  • Publication number: 20210159414
    Abstract: A step of preparing a resin plate-equipped metal mask including a metal mask in which a slit is provided and a resin plate, and a step of laser irradiation from the metal mask side to form an opening corresponding to a pattern to be produced by vapor deposition in the resin plate are included, wherein in the step of forming the opening, by using a laser mask in which an opening region corresponding to the opening and an attenuating region that is positioned in a periphery of the opening region and attenuates energy of the laser, the opening corresponding to the pattern to be produced by vapor deposition is formed with respect to the resin plate with the laser that passes through the opening region, and a thin part is formed in a periphery of the opening of the resin plate with the laser that passes through the attenuating region.
    Type: Application
    Filed: February 3, 2021
    Publication date: May 27, 2021
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Yoshiko MIYADERA, Takayoshi NIRENGI, Toshihiko TAKEDA
  • Patent number: 10982317
    Abstract: There are provided a vapor deposition mask capable of satisfying both high definition and lightweight in upsizing and forming a vapor deposition pattern with high definition while securing strength, a vapor deposition mask preparation body capable of simply producing the vapor deposition mask and a method for producing a vapor deposition mask, and furthermore, a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition. A metal mask 10 in which a slit 15 is provided and a resin mask 20 in which openings 25 corresponding to a pattern to be produced by vapor deposition are provided at a position of overlapping with the slit 15 are stacked, and the metal mask 10 has a general region 10a in which the slit 15 is provided and a thick region 10b larger in thickness than the general region.
    Type: Grant
    Filed: February 11, 2020
    Date of Patent: April 20, 2021
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Katsunari Obata, Toshihiko Takeda, Hiroshi Kawasaki, Hiroyuki Nishimura, Atsushi Maki, Hiromitsu Ochiai, Yoshinori Hirobe
  • Patent number: 10978641
    Abstract: A vapor deposition mask capable of correctly performing confirmation of whether a shape pattern of openings formed in a resin mask is normal or similar confirmation while satisfying both high definition and lightweight, a vapor deposition mask preparation body for obtaining the vapor deposition mask, a frame-equipped vapor deposition mask including the vapor deposition mask, and a method for producing an organic semiconductor element using the frame-equipped vapor deposition mask. The aforementioned problem is solved by using, in a vapor deposition mask including a metal mask in which a through hole is formed and a resin mask in which an opening corresponding to a pattern to be produced by vapor deposition is formed at a position overlapping with the through hole, the metal mask and the resin mask being stacked, wherein the resin mask has about 40% or less of light ray transmittance at a wavelength of about 550 nm.
    Type: Grant
    Filed: January 13, 2020
    Date of Patent: April 13, 2021
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Toshihiko Takeda, Hiroshi Kawasaki, Katsunari Obata
  • Publication number: 20210098702
    Abstract: A vapor deposition mask preparation body in which a metal mask is provided on one surface of a resin plate for obtaining a resin mask, and a protective sheet with peel strength not less than about 0.0004 N/10 mm and less than about 0.2 N/10 mm in conformity with JIS Z-0237:2009 is provided on the other surface of the resin plate is prepared, with respect to the vapor deposition mask preparation body, the resin plate is irradiated with laser light from the metal mask side to form a resin mask opening corresponding to a pattern to be produced by vapor deposition in the resin plate, and the protective sheet is peeled off from the resin mask in which the resin mask opening corresponding to the pattern to be produced by vapor deposition is formed.
    Type: Application
    Filed: November 9, 2020
    Publication date: April 1, 2021
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Toshihiko TAKEDA, Kumiko HOKARI, Yasuko SONE, Katsunari OBATA