Abstract: A method for producing a vapor deposition mask capable of satisfying both enhancement in definition and reduction in weight even when a size increased, a method for producing a vapor deposition mask device capable of aligning the vapor deposition mask to a frame with high precision, and a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition are provided. A metal mask provided with a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows, are stacked.

Abstract: A method for producing a frame-equipped vapor deposition mask sequentially includes preparing a vapor deposition mask including a metal mask having a slit and a resin mask having an opening corresponding to a pattern to be produced by vapor deposition at a position overlapping the slit, the metal mask and the resin mask being stacked, retaining a part of the vapor deposition mask by a retainer and stretching the vapor deposition mask retained by the retainer outward, and fixing the vapor deposition mask in a state of being stretched to a frame having a through hole. During stretching, any one or both adjustments of a rotating adjustment and a moving adjustment of the vapor deposition mask are performed with respect to the vapor deposition mask in the state of being stretched or with the vapor deposition mask being stretched.

Abstract: A vapor deposition mask includes a metal mask and a resin mask having an opening. An inner wall surface for composing the opening has an inflection point in a thicknesswise cross section of the resin mask. When an intersection of a first surface, not facing the metal mask, of the resin mask and the inner wall surface is set to be a first intersection, an intersection of a second surface, facing the metal mask, of the resin mask and the inner wall surface is set to be a second intersection, and there is set a first inflection point first positioned from the first intersection toward the second intersection, an angle formed by a line connecting the first intersection and the first inflection point and the first surface is larger than an angle formed by a line connecting the first inflection point and the second intersection and the second surface.

Abstract: A method for producing a vapor deposition mask capable of satisfying both enhancement in definition and reduction in weight even when a size is increased, and a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition are provided. A vapor deposition mask is produced by the steps of preparing a metal plate with a resin layer in which a resin layer is provided on one surface of a metal plate, forming a metal mask with a resin layer by forming a slit that penetrates through only the metal plate, for the metal plate in the metal plate with a resin layer, and thereafter, forming a resin mask by forming openings corresponding to a pattern to be produced by vapor deposition in a plurality of rows lengthwise and crosswise in the resin layer by emitting a laser from the metal mask side.

Abstract: An element manufacturing method in which a section of a substrate that is irradiated with laser light can be covered efficiently. A plurality of protrusions of an intermediate product are lined up in a first direction on a substrate, and a sealing mechanism includes one pair of rollers that rotate around a rotational axis extending in a second direction orthogonal to the first direction. The paired rollers are lined up spacedly in the first direction. In a sealing step using the sealing mechanism, a section of a lid member that is being tensioned between the paired rollers is in close contact with a part of the intermediate product. In an irradiation step, light passes through the section of the lid member that is being tensioned between the paired rollers, and reaches the intermediate product.

Abstract: A top-emission organic EL display device includes a substrate, pixel electrodes, auxiliary electrode, insulating layer formed between the pixel electrodes and includes an opening to expose the auxiliary electrode, organic EL layer formed on the pixel electrodes and includes organic layers, at least one formed on the auxiliary electrode, a contact portion being an opening of the organic layer formed on the auxiliary electrode, and transparent electrode layer formed on the organic EL layer and the contact portion. When an insulating layer overlap distance between the contact portion and pixel electrode adjacent to the contact portion with respect to the pixel electrode is regarded as “a” and an insulating layer overlap distance between the contact portion and pixel electrode adjacent to the contact portion with respect to the auxiliary electrode is regarded as “b”, at least one of “a” and “b” is equal to or greater than 2 ?m.

Abstract: A top-emission organic EL display device including a substrate, pixel electrodes, auxiliary electrode, insulating layer which is formed between pixel electrodes to cover edge portions of the adjacent pixel electrodes and includes an opening to expose the auxiliary electrode, an organic EL layer which is formed on the pixel electrode, includes plurality of organic layers, and includes at least a light-emitting layer, the organic layer formed on the auxiliary electrode exposed from the opening of the insulating layer, a contact portion which is an opening of the organic layer formed on the auxiliary electrode exposed from the opening of the insulating layer, and a transparent electrode layer, wherein width of the insulating layer between the contact portion and the pixel electrode adjacent to the contact portion is equal to or greater than 6 ?m, and the transparent electrode layer is electrically connected to the auxiliary electrode in the contact portion.

Abstract: A method for producing top-emission organic EL display device, in which, using cover material having flexibility such as resin film, space between organic EL layer-side substrate and cover material is made into decompressed state, thereafter, adhesion properties between organic EL layer-side substrate and cover material is maintained by retaining decompressed state in the space between organic EL layer-side substrate and cover material when adhering organic EL layer-side substrate and cover material by adjusting pressure of space on opposite side to the organic EL layer-side substrate, in relation to cover material so that deterioration in display properties can be restrained by preventing organic layer on auxiliary electrode removed by laser light from being scattered on pixel area. In the method for producing top-emission organic EL display device described above, resin film including barrier property with oxygen permeability of 100 cc/m2·day or less is used as the cover material.

Abstract: To provide an element manufacturing method and element manufacturing apparatus for efficiently manufacturing an element such as an organic semiconductor element. First, an intermediate product, which includes a substrate and a protrusion extending in a normal direction of the substrate, is formed. Next, the intermediate product is covered, at a side where the protrusion is provided, with a first surface of a lid member. After the covering of the intermediate product, a gas is injected into an enclosed space formed at a side of a second surface of the lid member that is present on an opposite side of the first surface. This enhances an internal pressure of the enclosed space, thus bringing the first surface of the lid member into close contact with the intermediate product.

Abstract: A power supply control apparatus monitors a high voltage, an intermediate voltage and a low voltage and detects voltage variation amounts of those voltages. When an absolute value of the voltage variation amount is greater than a predetermined variation amount, the power supply control apparatus corrects the voltage of large variation by controlling a DC-DC converter based on the voltage variation amount. The power supply control apparatus further estimates voltage variation amounts of the voltages other than the voltage of large variation based on the voltage variation amount of large variation and corrects the voltage of estimated large variation by controlling the DC-DC converter based on the estimated voltage variation amount.

Abstract: An intermediate product includes a substrate and a plurality of protrusions disposed on the substrate. A lid member with a first surface is set in place for the first surface to be oriented toward the protrusions of the intermediate product. In a lid member pressing step, on the first surface of the lid member, a shape curved to protrude toward the intermediate product is formed and a section of the lid member that is formed with the curved shape is brought into close contact with a part of the intermediate product.

Abstract: A method for producing a vapor deposition mask capable of satisfying both enhancement in definition and reduction in weight even when a size is increased, and a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition are provided. A vapor deposition mask is produced by the steps of preparing a metal plate with a resin layer in which a resin layer is provided on one surface of a metal plate, forming a metal mask with a resin layer by forming a slit that penetrates through only the metal plate, for the metal plate in the metal plate with a resin layer, and thereafter, forming a resin mask by forming openings corresponding to a pattern to be produced by vapor deposition in a plurality of rows lengthwise and crosswise in the resin layer by emitting a laser from the metal mask side.

Abstract: An element manufacturing method and apparatus for efficiently manufacturing an element such as an organic semiconductor element. First, an intermediate product that includes a substrate and a protrusion extending in a normal direction of the substrate is provided. Next, in a stacking chamber conditioned to a vacuum environment, a stacked structure is formed by continuously stacking a lid member on the intermediate product at a side where the protrusion is provided. After this operation, the stacked structure is transported from the stacking chamber to a first pressure chamber coupled to the stacking chamber and conditioned to a first pressure higher than the pressure in the vacuum environment. Next, the stacked structure is further transported from the first pressure chamber to a separation chamber coupled to the first pressure chamber and conditioned to a vacuum environment, and then the stacked structure is separated into the intermediate product and the lid member.

Abstract: There are provided a vapor deposition mask capable of satisfying both high definition and lightweight in upsizing and forming a vapor deposition pattern with high definition while securing strength, a method for producing a vapor deposition mask and a vapor deposition mask preparation body capable of simply producing the vapor deposition mask, and furthermore, a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition. A metal mask 10 in which a plurality of slits 15 are provided and a resin mask 20 are stacked. Openings 25 required for composing a plurality of screens are provided in the resin mask 20. The openings 25 correspond to a pattern to be produced by vapor deposition. Each of the slits 15 is provided at a position of overlapping with an entirety of at least one screen.

Abstract: A method for producing a multiple-surface imposition vapor deposition mask enhances definition and reduces weight even when a size is increased. Each of multiple masks in an open space in a frame is configured by a metal mask having a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows. In formation of the plurality of masks, after each of the metal masks and a resin film material for producing the resin mask are attached to the frame, the resin film material is processed, and the openings corresponding to the pattern to be produced by vapor deposition are formed in a plurality of rows lengthwise and crosswise, whereby the multiple-surface imposition vapor deposition mask of the above described configuration is produced.

Abstract: A method for producing a multiple-surface imposition vapor deposition mask enhances definition and reduces weight even when a size is increased. Each of multiple masks in an open space in a frame is configured by a metal mask having a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows. In formation of the plurality of masks, after each of the metal masks and a resin film material for producing the resin mask are attached to the frame, the resin film material is processed, and the openings corresponding to the pattern to be produced by vapor deposition are formed in a plurality of rows lengthwise and crosswise, whereby the multiple-surface imposition vapor deposition mask of the above described configuration is produced.

Abstract: There are provided a vapor deposition mask capable of satisfying both high definition and lightweight in upsizing and forming a vapor deposition pattern with high definition while securing strength, a vapor deposition mask preparation body capable of simply producing the vapor deposition mask and a method for producing a vapor deposition mask, and furthermore, a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition. A metal mask 10 in which a slit 15 is provided and a resin mask 20 in which openings 25 corresponding to a pattern to be produced by vapor deposition are provided at a position of overlapping with the slit 15 are stacked, and the metal mask 10 has a general region 10a in which the slit 15 is provided and a thick region 10b larger in thickness than the general region.

Abstract: A method for producing a vapor deposition mask capable of satisfying both enhancement in definition and reduction in weight even when a size is increased, and a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition are provided. A vapor deposition mask is produced by the steps of preparing a metal plate with a resin layer in which a resin layer is provided on one surface of a metal plate, forming a metal mask with a resin layer by forming a slit that penetrates through only the metal plate, for the metal plate in the metal plate with a resin layer, and thereafter, forming a resin mask by forming openings corresponding to a pattern to be produced by vapor deposition in a plurality of rows lengthwise and crosswise in the resin layer by emitting a laser from the metal mask side.

Abstract: A method for producing a vapor deposition mask capable of satisfying both enhancement in definition and reduction in weight even when a size is increased, and a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition are provided. A vapor deposition mask is produced by the steps of preparing a metal plate with a resin layer in which a resin layer is provided on one surface of a metal plate, forming a metal mask with a resin layer by forming a slit that penetrates through only the metal plate, for the metal plate in the metal plate with a resin layer, and thereafter, forming a resin mask by forming openings corresponding to a pattern to be produced by vapor deposition in a plurality of rows lengthwise and crosswise in the resin layer by emitting a laser from the metal mask side.

Abstract: Provided are: a vapor deposition mask which can be light weight and have high definition even when the size is increased; a method for producing a vapor deposition mask device whereby it is possible to accurately position the aforementioned vapor mask on a frame; and a method for producing an organic semiconductor element whereby it is possible to produce a high-definition organic semiconductor element. A metal mask on which slits are disposed, and a resin mask which is positioned on the surface of the metal mask and on which multiple openings corresponding to the pattern formed by means of vapor deposition are horizontally and vertically arranged in rows are laminated.