Abstract: A semiconductor module includes a switching element, a molded body, and a motor terminal. The molded body having the switching element disposed therein. The motor terminal has a base portion and a connection portion having an insertion hole into which a motor wire is inserted and connected with the winding wire. The connection portion has a cutaway region that defines a slot. The winding wire of the motor and the semiconductor module are connected via the motor wire and the motor terminal, thereby reducing the number of components used for such connection compared with a connection that uses a connector, and achieving a volume reduction of the semiconductor module and a driver device using the same.

Abstract: In a semiconductor module, an upper arm switching element is integrated to a high-potential conductor coupled to a high-potential electrode of a power source, and a lower arm switching element is integrated to a load conductor coupled to a load. A first connecting conductor has a first end connected to the upper arm switching element and a second end connected to the load conductor. A second connecting conductor has a first end connected to the lower arm switching element and a second end connected to a low-potential conductor coupled to a low-potential electrode of the power source. At least one of the first connecting conductor and the second connecting conductor serves as a shunt resistor for detecting an electric current flowing in the at least one.

Abstract: A semiconductor device includes a semiconductor module and a pressing member pressing the semiconductor module to a heat radiation member. The semiconductor module includes heat generation elements generating heat by energization, three or more conductive members each of which mounted with at least one of the heat generation elements, and a molding part integrally molding the heat generation elements and the conductive members. The semiconductor module has a heat radiation possible region in which a forcing pressure by the pressing member is equal to or greater than a predetermined pressure. The conductive member mounted with the heat generation element disposed outside the heat radiation possible region has such a shape that at least a part of the conductive member is included in the heat radiation possible region.

Abstract: An information processing apparatus includes an obtaining unit, a specifying unit, a search processing unit, and an output unit. The obtaining unit obtains at least one content including a sound. The specifying unit receives a specification for specifying sound information, the sound information being in relation with an icon symbolizing a scene content and expressing the scene content, as a scene search condition. The search processing unit compares the sound information, the specification for specifying the sound information being received as the scene search condition, with the sound included in the at least one content, to thereby search a content including the sound information in the sound. The output unit outputs information on the content searched by the search processing unit.

Abstract: A semiconductor device includes a semiconductor module and a pressing member configured to press the semiconductor module to a heat radiation member. The semiconductor module includes switching elements, conductors, and a molded member. Each of the switching elements is mounted on a corresponding one of the conductors. The molded member covers the switching elements and the conductors. More than three of the switching elements are disposed around the pressing member. The switching elements are disposed in a region in which a pressure generated between the semiconductor module and the heat radiation member by pressing with the pressing member is greater than or equal to a predetermined pressure with which heat generated from the switching elements is releasable from the semiconductor module to the heat radiation member.

Abstract: A controller has a control board, a power module and a power board. MOS transistors, inverter input terminals, coil terminals, inverter ground terminals, control terminals, a control power input terminal and a control ground terminal are integrally molded in a molded portion of a power module. Electrical connections between the power module and the control and power boards are made through the terminals provided in the molded portion.

Abstract: A laser lighting module includes a base part, a laser diode which is a blue laser device, a substrate with which the laser diode is in contact, a ceramic phosphor which reflects light entering from the laser diode to thereby change a direction of the light and is excited by the light to generate yellow fluorescence, and a lens for adjusting luminous intensity distribution of light emitted from the ceramic phosphor. The substrate is formed of a material which is thin and has excellent thermal conductivity, and is in surface contact with the laser diode and the base part. In the laser lighting module, since the substrate serves as a device heat radiator, it is possible to easily remove the heat generated by the laser diode.

Abstract: A lighting apparatus includes a laser lighting module, an LED lighting module, and a sensor module. The laser lighting module includes a base part, a laser diode mounted on a substrate fixed on the base part, a ceramic phosphor upon which a blue laser light from the laser diode is incident, and a lens for adjusting luminous intensity distribution of light emitted from the ceramic phosphor, and is mounted on a module mount part of a mount body part. The LED lighting module and the sensor module are also mounted on other module mount parts of the mount body part, respectively. Thus, by mounting various combinations of the laser lighting modules and the LED lighting modules on the mount body part provided with a plurality of module mount parts, it is possible to manufacture lighting apparatuses for various uses at low cost.

Abstract: A wiring member includes a first leg portion, a second leg portion, a third leg portion, a first connecting wall and a second connecting wall. The first leg portion is electrically connected to a first conductive portion. The second leg portion is electrically connected to a second conductive portion. The third leg portion is electrically connected to a third conductive portion. The first connecting wall connects the first leg portion and the second leg portion. The second connecting wall connects the second leg portion and the third leg portion. The first leg portion, the second leg portion, and the third leg portion are non-linearly arranged.

Abstract: In a semiconductor module, a high-potential side conductor includes a wide section on which the high-potential side switching element is mounted, a high-potential side terminal coupled with a high potential source, and a narrow section extending from the wide section to the high-potential side terminal in a first direction. The wide section is wider than the narrow section in a second direction perpendicular to the first direction. The wide section has a first side and a second side opposite to the first side in the second direction. A distance between the first side of the wide section and a low-potential side conductor is shorter than a distance between the second side of the wide section and the low-potential side conductor. The narrow section extends from a portion of the wide section closer to the first side than the second side.

Abstract: An inverter input terminal, a coil terminal for a U-phase coil, and an inverter ground terminal are arranged in this order and neighboring to one another to form a U-phase terminal group. An inverter input terminal, a coil terminal for a V-phase coil, and the inverter ground terminal are arranged in this order and neighboring to one another to forma V-phase terminal group. The inverter input terminal, a coil terminal for a W-phase coil, and an inverter ground terminal are arranged in this order and neighboring to one another to form a W-phase terminal group. Flow directions of electric current in the neighboring terminals are opposite to each other, so that inductance of inverter circuits can be decreased.

Abstract: A sheet peeling device includes: a feeder that feeds a material sheet and a peeling unit that peels the adhesive sheet from the peeling sheet. The peeling unit includes: a peeling member having a bending edge for folding back the peeling sheet; and a following unit that forms an anti-bending area with irregularities at least on the adhesive sheet in the feeding direction. The peeling member includes a guide surface continuous to the bending edge and guides the material sheet; and a first irregularity formed on the guide surface in the feeding direction and is open on the bending edge. The following unit includes a guide member interposing the material sheet with the peeling member and having a second irregularity to fit to the first irregularity. The second irregularity includes a convex portion that extends to the bending edge in the feeding direction corresponding to the first irregularity.

Abstract: In a semiconductor module, a high-potential side conductor includes a wide section on which the high-potential side switching element is mounted, a high-potential side terminal coupled with a high potential source, and a narrow section extending from the wide section to the high-potential side terminal in a first direction. The wide section is wider than the narrow section in a second direction perpendicular to the first direction. The wide section has a first side and a second side opposite to the first side in the second direction. A distance between the first side of the wide section and a low-potential side conductor is shorter than a distance between the second side of the wide section and the low-potential side conductor. The narrow section extends from a portion of the wide section closer to the first side than the second side.

Abstract: A semiconductor device includes a semiconductor module and a pressing member configured to press the semiconductor module to a heat radiation member. The semiconductor module includes switching elements, conductors, and a molded member. Each of the switching elements is mounted on a corresponding one of the conductors. The molded member covers the switching elements and the conductors. More than three of the switching elements are disposed around the pressing member. The switching elements are disposed in a region in which a pressure generated between the semiconductor module and the heat radiation member by pressing with the pressing member is greater than or equal to a predetermined pressure with which heat generated from the switching elements is releasable from the semiconductor module to the heat radiation member.

Abstract: A motor case is formed in a tubular shape. A semiconductor module includes a semiconductor chip of switching elements, a resin part and a coil terminal. The resin part embeds the semiconductor chip therein. The coil terminal is protruded from the resin part and directly connected to a coil. A connection part between the coil terminal and the coil is arranged at a position, which is between a top wall surface and a bottom wall surface of the resin part facing each other in the axial direction of a motor.

Abstract: An inverter input terminal, a coil terminal for a U-phase coil, and an inverter ground terminal are arranged in this order and neighboring to one another to form a U-phase terminal group. An inverter input terminal, a coil terminal for a V-phase coil, and the inverter ground terminal are arranged in this order and neighboring to one another to forma V-phase terminal group. The inverter input terminal, a coil terminal for a W-phase coil, and an inverter ground terminal are arranged in this order and neighboring to one another to form a W-phase terminal group. Flow directions of electric current in the neighboring terminals are opposite to each other, so that inductance of inverter circuits can be decreased.

Abstract: A controller has a control board, a power module and a power board. MOS transistors, inverter input terminals, coil terminals, inverter ground terminals, control terminals, a control power input terminal and a control ground terminal are integrally molded in a molded portion of a power module. Electrical connections between the power module and the control and power boards are made through the terminals provided in the molded portion.

Abstract: An information processing apparatus includes an obtaining unit, a specifying unit, a search processing unit, and an output unit. The obtaining unit obtains at least one content including a sound. The specifying unit receives a specification for specifying sound information, the sound information being in relation with an icon symbolizing a scene content and expressing the scene content, as a scene search condition. The search processing unit compares the sound information, the specification for specifying the sound information being received as the scene search condition, with the sound included in the at least one content, to thereby search a content including the sound information in the sound. The output unit outputs information on the content searched by the search processing unit.

Abstract: A motor case is formed in a tubular shape. A semiconductor module includes a semiconductor chip of switching elements, a resin part and a coil terminal. The resin part embeds the semiconductor chip therein. The coil terminal is protruded from the resin part and directly connected to a coil. A connection part between the coil terminal and the coil is arranged at a position, which is between a top wall surface and a bottom wall surface of the resin part facing each other in the axial direction of a motor.

Abstract: A label sticking device is provided with a suction head 50 which holds a label L peeled off from a release liner S in the process of paying out a raw sheet M, a camera 15 which inspects a position of the sucked label, a label-positioning device 16 which adjusts a positional deviation of the label when the deviation is detected, a printing device 17 which prints on an adhesive layer of the label, a shifter 18 which shifts the label printed toward an object to be stuck with the label, and a controller 20 which controls these devices.