Abstract: A ceramic electronic device includes an element body and an external electrode. The element body is formed by laminating a ceramic layer and an internal electrode layer. The external electrode is electrically connected to at least one end of the internal, electrode layer. The element body includes a boundary layer at an end of the ceramic layer. The ceramic layer includes a perovskite compound represented by ABO3 as a main component. The boundary layer includes Ba and Ti as a main component. The boundary layer includes 0.27-0.40 parts by mol of Ba, provided that a total of Ba and Ti included in the boundary layer is 1 part by mol.

Abstract: An electronic component includes an element body, an external electrode, and a metal terminal. In the metal terminal, a base includes a first surface and a second surface opposing each other, and a pair of third surfaces coupling the first surface and the second surface. A first metal layer is disposed on the first surface and connected to solder with which the external electrode and the metal terminal are connected together. A second metal layer is disposed on the second surface. A coating layer is disposed on each of the third surfaces. The first metal layer and the second metal layer each include an outermost layer containing Sn. Each of the coating layer includes an outermost layer lower in solder wettability than the respective outermost layers of the first metal layer and the second metal layer.

Abstract: An electronic component includes an element body, a pair of external electrodes respectively disposed at both ends of the element body in a first direction, and a pair of metal terminals respectively connected to the pair of external electrodes with solder. Each metal terminal includes a connection opposing the corresponding external electrode in the first direction and formed with a plurality of grooves and includes a leg extending from the connection. The connection includes a pair of end edges separated from each other in a third direction intersecting with a second direction where the leg extends from the connection. The grooves extend in a direction different from the second direction and intersecting with the third direction so that the grooves are separated from one of the pair of end edges. A surface included in the connection and defining each of the grooves is in contact with the solder.

Abstract: A ceramic electronic device includes an element body and an external electrode. The element body is formed by laminating a ceramic layer and an internal electrode layer. The external electrode is electrically connected to at least one end of the internal electrode layer. The external electrode includes a baked electrode layer. The baked electrode layer includes a first region and a second region. The first region is contacted with an end surface of the element body and located near a joint boundary with the element body. The second region is located outside the first region and constituting an outer surface of the baked electrode layer. The first region includes a first glass having a predetermined composition. The second region includes a second glass having a predetermined composition.

Abstract: A ceramic electronic device includes an element body and an external electrode. The element body is formed by laminating a ceramic layer and an internal electrode layer. The external electrode is electrically connected to at least one end of the internal electrode layer. At least a part of a joint boundary between the electrode layer and the ceramic layer includes an interface protrusion on the external electrode side. The interface protrusion is made of an oxide.

Abstract: A ceramic electronic device includes an element body and an external electrode. The element body includes a ceramic layer and an internal electrode layer. The external electrode is formed on an end surface of the element body and electrically connected to a part of the internal electrode layer. The ceramic layer includes a perovskite compound represented by ABO3 as a main component. The external electrode includes a baked electrode layer having a first region and a second region. The first region is contacted with the end surface of the element body and located near a joint boundary with the element body. The second region is located outside the first region and constitutes an outer surface of the baked electrode layer. The first region includes a glass frit including at least B, Zn, and Si. The second region includes an oxide having a higher melting point than Cu.

Abstract: A ceramic electronic device includes an element body and an external electrode. The element body includes a ceramic layer and an internal electrode layer. The external electrode is formed on an end surface of the element body and electrically connected to a part of the internal electrode layer. The ceramic layer includes a perovskite compound represented by ABO3 as a main component. The external electrode includes a conductor and a glass frit diffused in the conductor. The glass frit includes B, Si, Ba, and Zn. A boundary layer is present at an end of the ceramic layer in contact with the external electrode on the end surface of the element body and comprises an oxide including Ba, Zn, and Si.

Abstract: An electronic component according to the present invention is an electronic component including: a ceramic element body including an internal electrode; and an external electrode formed on an outer surface of the ceramic element body. The external electrode includes: a first electrode layer electrically connected to at least a part of the internal electrode; and a second electrode layer formed on an outside of the first electrode layer. The first electrode layer has a first conductor region containing copper, and the second electrode layer has a second conductor region including a matrix phase containing silver and palladium and copper particles dispersed in the matrix phase.

Abstract: Provided is a dielectric composition exhibiting a high strength and a high specific dielectric constant. The dielectric composition contains composite oxide particles having a composition formula represented by (SrxBa1-x)yNb2O5+y and an Al-based segregation phase. The Al segregation phase has niobium, aluminum, and oxygen.

Abstract: In order to provide a dielectric composition having high density even when fired at a relatively low temperature, the main component of a dielectric composition includes tantalum and at least one of barium or strontium, and the subcomponent of the dielectric composition includes at least one element selected from the group consisting of vanadium, titanium, and aluminum.

Abstract: In order to provide a dielectric composition having high relative permittivity at a wide range of temperatures, the main component of a dielectric composition includes strontium and tantalum.

Abstract: A dielectric ceramic composition contains dielectric particles containing a main component represented by a composition formula (Ba1-x-ySrxCay)m(Ti1-zZrz)O3 and grain boundaries present between the dielectric particles. The values of m, x, y, and z in the composition formula are all molar ratios. In the composition formula, 0.9?m?1.4, 0?x<1.0, 0<y?1.0, 0.9?(x+y)?1.0, and 0.9?z?1.0 are satisfied. The dielectric particles contain specific structural particles having a predetermined intragranular structure, and each of the specific structural particles intragranularly includes a first region and a second region having different Ca concentrations from each other. C2/C1 is less than 0.8 in which C1 is an average value of the Ca concentration in the first region and C2 is an average value of the Ca concentration in the second region.

Abstract: A dielectric composition includes a main phase and a Ca—Zr—Si—O segregation phase. The main phase includes a main component expressed by ABO3. “A” includes at least one selected from calcium and strontium. “B” includes at least one selected from zirconium, titanium, hafnium, and manganese. The Ca—Zr—Si—O segregation phase includes at least calcium, zirconium, and silicon. The Ca—Zr—Si—O segregation phase includes 0.12-0.50 parts by mol of zirconium, provided that a total of calcium, strontium, silicon, and zirconium included in the Ca—Zr—Si—O segregation phase is 1 part by mol.

Abstract: To provide a multilayer electronic component of which a reliability is not compromised and also a crack is suppressed from forming even when the multilayer electronic component is made thinner. A multilayer electronic component including an element body in which at least one dielectric layer and at least one internal electrode layer are stacked in an alternating manner, wherein a thickness variation of the at least one internal electrode layer is larger than a thickness variation of the at least one dielectric layer.

Abstract: An electronic component includes an element body including a side surface and an end surface adjacent to each other, and an external electrode disposed on the side surface and the end surface. The external electrode includes a metal layer disposed on the side surface and the end surface and made of sintered copper, a conductive resin layer that is disposed on the metal layer in such a manner that a partial region of the metal layer is exposed and contains a plurality of copper particles and a resin, and a plating layer disposed on the partial region of the metal layer and the conductive resin layer. The conductive resin includes a first portion located on the side surface. The plating layer includes a second portion located on the side surface. A thickness of the first portion is smaller than a thickness of the second portion.

Abstract: A multilayer ceramic electronic component includes a ceramic element body formed by alternately laminating dielectric layers and internal electrode layers. The dielectric layers include a main component containing barium titanate and a sub-component containing boron oxide and/or lithium oxide. The internal electrode layers include a main component of copper and/or silver. A coverage ratio of the internal electrode layers to the dielectric layers is 98% or less.

Abstract: Provided is a dielectric composition exhibiting a high specific dielectric constant and a high resistivity even when fired in a reducing atmosphere. The dielectric composition contains a composite oxide having a composition represented by (SrxBa1-x)yNb2O5+y, the crystal system of the composite oxide is tetragonal, and y in the composition formula is smaller than 1.

Abstract: A dielectric composition includes dielectric particles. At least one of the dielectric particles include a main phase and a secondary phase. The main phase has a main component of barium titanate. The secondary phase exists inside the main phase and has a higher barium content than the main phase.

Abstract: An electronic component includes an element body, a pair of external electrodes respectively disposed at both ends of the element body in a first direction, and a pair of metal terminals respectively connected to the pair of external electrodes with solder. Each metal terminal includes a connection opposing the corresponding external electrode in the first direction and formed with a plurality of grooves and includes a leg extending from the connection. The connection includes a pair of end edges separated from each other in a third direction intersecting with a second direction where the leg extends from the connection. The grooves extend in a direction different from the second direction and intersecting with the third direction so that the grooves are separated from one of the pair of end edges. A surface included in the connection and defining each of the grooves is in contact with the solder.

Abstract: An electronic device includes chip components, a case, conductive terminals, and a fuse. The chip components each include a terminal electrode. The case includes accommodation recesses for accommodating the chip components. The conductive terminals are fixed to the case and respectively connected to the terminal electrodes of the chip components. The fuse electrically connects the chip components.