Patents by Inventor Toshihiro Maki
Toshihiro Maki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7153589Abstract: A Mo—W material for the formation of wirings is discloses which, as viewed integrally, comprises 20 to 95% of tungsten and the balance of molybdenum and inevitable impurities by atomic percentage. The Mo—W material for wirings is a product obtained by compounding and integrating a Mo material and a W material as by the powder metallurgy technique or the smelting technique or a product obtained by arranging these materials in amounts calculated to account for the percentage composition mentioned above. The Mo—W material containing W in a proportion in the range of from 20 to 95% manifests low resistance and, at the same time, excels in workability and tolerance for etchants. The wiring thin film which is formed of the Mo—W alloy of this percentage composition is used as address wirings and others for liquid crystal display devices.Type: GrantFiled: October 6, 1998Date of Patent: December 26, 2006Assignee: Kabushiki Kaisha ToshibaInventors: Yasuo Kohsaka, Yoshiharu Fukasawa, Yoshiko Tsuji, Mitsushi Ikeda, Michio Sato, Toshihiro Maki
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Patent number: 6976889Abstract: In a method of connecting a terminal with a wire in which a core (2) of a wire is inserted into a tubular wire connecting portion (1) of a terminal, and the wire connecting portion is crimped in a radial direction of the wire, the wire connecting portion is compressed in a radial direction of the wire and uniformly over the whole circumference. While rotating dies (7?) by using a rotary swaging machine, the wire connecting portion is compressed by the dies in a radial direction of the wire and uniformly over the whole circumference. The wire connecting portion is compressed in a radial direction of the wire and uniformly over the whole circumference, and the outer periphery of a compressed part of the wire connecting portion has a true circular section shape.Type: GrantFiled: September 21, 2004Date of Patent: December 20, 2005Assignee: Yazaki CorporationInventors: Yasumichi Kuwayama, Toshihiro Maki, Masanori Onuma, Nobuyuki Asakura
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Patent number: 6893301Abstract: In a method of connecting a terminal with a wire in which a core (2) of a wire is inserted into a tubular wire connecting portion (1) of a terminal, and the wire connecting portion is crimped in a radial direction of the wire, the wire connecting portion is compressed in a radial direction of the wire and uniformly over the whole circumference. While rotating dies (7?) by using a rotary swaging machine, the wire connecting portion is compressed by the dies in a radial direction of the wire and uniformly over the whole circumference. The wire connecting portion is compressed in a radial direction of the wire and uniformly over the whole circumference, and the outer periphery of a compressed part of the wire connecting portion has a true circular section shape.Type: GrantFiled: August 29, 2003Date of Patent: May 17, 2005Assignee: Yazaki CorporationInventors: Yasumichi Kuwayama, Toshihiro Maki, Masanori Onuma, Nobuyuki Asakura
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Publication number: 20050037677Abstract: In a method of connecting a terminal with a wire in which a core (2) of a wire is inserted into a tubular wire connecting portion (1) of a terminal, and the wire connecting portion is crimped in a radial direction of the wire, the wire connecting portion is compressed in a radial direction of the wire and uniformly over the whole circumference. While rotating dies (7?) by using a rotary swaging machine, the wire connecting portion is compressed by the dies in a radial direction of the wire and uniformly over the whole circumference. The wire connecting portion is compressed in a radial direction of the wire and uniformly over the whole circumference, and the outer periphery of a compressed part of the wire connecting portion has a true circular section shape.Type: ApplicationFiled: September 21, 2004Publication date: February 17, 2005Inventors: Yasumichi Kuwayama, Toshihiro Maki, Masanori Onuma, Nobuyuki Asakura
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Publication number: 20040157505Abstract: A conductor portion (3) and an insulating sheath (4) of a wire (2) are inserted in a generally-cylindrical wire connection portion (32) of a terminal, and in this condition the wire connection portion (32) is compressively pressed radially uniformly over an entire periphery thereof, so that the conductor portion and the insulating sheath are held in intimate contact with an inner peripheral surface of the wire connection portion. The wire connection portion (32) has a smaller-diameter insertion hole for the conductor portion (3), and a larger-diameter insertion hole for the insulating sheath (4), the insertion holes being disposed in coaxial relation to each other.Type: ApplicationFiled: February 11, 2004Publication date: August 12, 2004Applicant: YAZAKI CORPORATIONInventors: Yasumichi Kuwayama, Toshihiro Maki
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Patent number: 6770817Abstract: A conductor portion (3) and an insulating sheath (4) of a wire (2) are inserted in a generally-cylindrical wire connection portion (32) of a terminal, and in this condition the wire connection portion (32) is compressively pressed radially uniformly over an entire periphery thereof, so that the conductor portion and the insulating sheath are held in intimate contact with an inner peripheral surface of the wire connection portion. The wire connection portion (32) has a smaller-diameter insertion hole for the conductor portion (3), and a larger-diameter insertion hole for the insulating sheath (4), the insertion holes being disposed in coaxial relation to each other.Type: GrantFiled: January 17, 2002Date of Patent: August 3, 2004Assignee: Yazaki CorporationInventors: Yasumichi Kuwayama, Toshihiro Maki
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Patent number: 6749457Abstract: In a crimp terminal for crimping at least one bare conductor of at least one sheathed electric wire, the at least one bare conductor is placed on a bottom plate. A pair of crimp craws extend from the bottom plate to crimp the at least one bare conductor placed on the bottom plate. A plurality of serrations are formed at least on an inner face of the bottom plate to bite the at least one bare conductor crimped by the crimp claws. At least one of the serrations has a depth different from a depth of each another serration.Type: GrantFiled: July 12, 2002Date of Patent: June 15, 2004Assignee: Yazaki CorporationInventors: Tadahisa Sakaguchi, Toshihiro Maki
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Patent number: 6739899Abstract: In a method of connecting a terminal with a wire in which a core (2) of a wire is inserted into a tubular wire connecting portion (1) of a terminal, and the wire connecting portion is crimped in a radial direction of the wire, the wire connecting portion is compressed in a radial direction of the wire and uniformly over the whole circumference. While rotating dies (7′) by using a rotary swaging machine, the wire connecting portion is compressed by the dies in a radial direction of the wire and uniformly over the whole circumference. The wire connecting portion is compressed in a radial direction of the wire and uniformly over the whole circumference, and the outer periphery of a compressed part of the wire connecting portion has a true circular section shape.Type: GrantFiled: June 27, 2002Date of Patent: May 25, 2004Assignee: Yazaki CorporationInventors: Yasumichi Kuwayama, Toshihiro Maki, Masanori Onuma, Nobuyuki Asakura
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Patent number: 6734359Abstract: Conductor portions (11) of a total of two or more wires (2) are compressively pressed uniformly over an entire periphery within one or a plurality of tubular portions (13) of a terminal (19, and are connected thereto. The terminal (1) has the pair of tubular portions (13) formed respectively at opposite sides thereof, and the conductor portions (11) of one or more wires (2) are compressively pressed uniformly over the entire periphery within each of the tubular portions, and are connected thereto. Alternatively, the terminal has one tubular portion, and the conductor portions (11) of the plurality of wires (2) are compressively pressed uniformly over the entire periphery within the tubular portion in such a manner that the conductor portions are combined together. Conductor portions (11) of a total of two or more wires (2) are inserted into one or a plurality of tubular portions (13) of a terminal (1), and the tubular portion is compressively pressed uniformly over an entire periphery thereof.Type: GrantFiled: January 18, 2002Date of Patent: May 11, 2004Assignee: Yazaki CorporationInventors: Hisashi Hanazaki, Takashi Ishii, Toshihiro Maki
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Publication number: 20040040150Abstract: In a method of connecting a terminal with a wire in which a core (2) of a wire is inserted into a tubular wire connecting portion (1) of a terminal, and the wire connecting portion is crimped in a radial direction of the wire, the wire connecting portion is compressed in a radial direction of the wire and uniformly over the whole circumference. While rotating dies (7′) by using a rotary swaging machine, the wire connecting portion is compressed by the dies in a radial direction of the wire and uniformly over the whole circumference. The wire connecting portion is compressed in a radial direction of the wire and uniformly over the whole circumference, and the outer periphery of a compressed part of the wire connecting portion has a true circular section shape.Type: ApplicationFiled: August 29, 2003Publication date: March 4, 2004Applicant: YAZAKI CORPORATIONInventors: Yasumichi Kuwayama, Toshihiro Maki, Masanori Onuma, Nobuyuki Asakura
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Patent number: 6625884Abstract: A method of determining whether a metal terminal including a conductor clamping section for clamping a wire is satisfactorily connected to the wire. First, a first metal terminal including a first conductor clamping section for clamping a first wire thereto is provided. Next, one of a dimensional variation and a ratio of a dimensional change of the first conductor clamping section in an axial direction of the first metal terminal, which are caused by clamping the first conductor clamping section, is calculated. Compressibility comparison data is prepared by calculating, from a section of the first conductor clamping section after clamping the first conductor clamping section, compressibility of the first wire with respect to the first conductor clamping section based on the one of the dimensional variation and the ratio of the dimensional change.Type: GrantFiled: July 31, 2000Date of Patent: September 30, 2003Assignee: Yazaki CorporationInventors: Yoshihiro Fukase, Toshihiro Maki
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Patent number: 6626711Abstract: To provide a press-clamping terminal in which a press-clamped condition can be easily examined, an examination mark (14), which can be deformed upon press-deforming of a barrel (11), is impressed on or stamped in an outer surface of a bottom portion (12) of a press-clamping terminal (10). (See FIG. 8.) To provide a press-clamping terminal in which an examination can be easily carried out with the need for using a bulky apparatus and tools, grooves (160), serving as a criterion for confirming a press-clamped condition, are impressed on or stamped in an outer surface of a bottom portion (120) of a barrel (110). Also, a mark (170), indicating a press-clamping position, is formed or impressed in this outer surface. (See FIG. 24.Type: GrantFiled: June 8, 2001Date of Patent: September 30, 2003Assignee: Yazaki CorporationInventors: Hironori Kitagawa, Naoki Ito, Tsutomu Takayama, Toshihiro Maki
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Publication number: 20030022562Abstract: In a method of connecting a terminal with a wire in which a core (2) of a wire is inserted into a tubular wire connecting portion (1) of a terminal, and the wire connecting portion is crimped in a radial direction of the wire, the wire connecting portion is compressed in a radial direction of the wire and uniformly over the whole circumference. While rotating dies (7′) by using a rotary swaging machine, the wire connecting portion is compressed by the dies in a radial direction of the wire and uniformly over the whole circumference. The wire connecting portion is compressed in a radial direction of the wire and uniformly over the whole circumference, and the outer periphery of a compressed part of the wire connecting portion has a true circular section shape.Type: ApplicationFiled: June 27, 2002Publication date: January 30, 2003Applicant: YAZAKI CORPORATIONInventors: Yasumichi Kuwayama, Toshihiro Maki, Masanori Onuma, Nobuyuki Asakura
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Publication number: 20030013353Abstract: In a crimp terminal for crimping at least one bare conductor of at least one sheathed electric wire, the at least one bare conductor is placed on a bottom plate. A pair of crimp craws extend from the bottom plate to crimp the at least one bare conductor placed on the bottom plate. A plurality of serrations are formed at least on an inner face of the bottom plate to bite the at least one bare conductor crimped by the crimp claws. At least one of the serrations has a depth different from a depth of each another serration.Type: ApplicationFiled: July 12, 2002Publication date: January 16, 2003Applicant: YAZAKI CORPORATIONInventors: Tadahisa Sakaguchi, Toshihiro Maki
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Publication number: 20020096353Abstract: Conductor portions (11) of a total of two or more wires (2) are compressively pressed uniformly over an entire periphery within one or a plurality of tubular portions (13) of a terminal (19, and are connected thereto. The terminal (1) has the pair of tubular portions (13) formed respectively at opposite sides thereof, and the conductor portions (11) of one or more wires (2) are compressively pressed uniformly over the entire periphery within each of the tubular portions, and are connected thereto. Alternatively, the terminal has one tubular portion, and the conductor portions (11) of the plurality of wires (2) are compressively pressed uniformly over the entire periphery within the tubular portion in such a manner that the conductor portions are combined together. Conductor portions (11) of a total of two or more wires (2) are inserted into one or a plurality of tubular portions (13) of a terminal (1), and the tubular portion is compressively pressed uniformly over an entire periphery thereof.Type: ApplicationFiled: January 18, 2002Publication date: July 25, 2002Applicant: YAZAKI CORPORATIONInventors: Hisashi Hanazaki, Takashi Ishii, Toshihiro Maki
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Publication number: 20020096352Abstract: A conductor portion (3) and an insulating sheath (4) of a wire (2) are inserted in a generally-cylindrical wire connection portion (32) of a terminal, and in this condition the wire connection portion (32) is compressively pressed radially uniformly over an entire periphery thereof, so that the conductor portion and the insulating sheath are held in intimate contact with an inner peripheral surface of the wire connection portion. The wire connection portion (32) has a smaller-diameter insertion hole for the conductor portion (3), and a larger-diameter insertion hole for the insulating sheath (4), the insertion holes being disposed in coaxial relation to each other.Type: ApplicationFiled: January 17, 2002Publication date: July 25, 2002Applicant: YAZAKI CORPORATIONInventors: Yasumichi Kuwayama, Toshihiro Maki
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Patent number: 6352628Abstract: A refractory metal silicide target is characterized by comprising a fine mixed structure composed of MSi2 (where M: refractory metal) grains and Si grains, wherein the number of MSi2 grains independently existing in a cross section of 0.01 mm2 of the mixed structure is not greater than 15, the MSi2 grains have an average grain size not greater than 10 &mgr;m, whereas free Si grains existing in gaps of the MSi2 grains have a maximum grain size not greater than 20 &mgr;m. The target has a high density, high purity fine mixed structure with a uniform composition and contains a small amount of impurities such as oxygen etc. The employment of the target can reduce particles produced in sputtering, the change of a film resistance in a wafer and the impurities in a film and improve yield and reliability when semiconductors are manufactured.Type: GrantFiled: May 2, 2001Date of Patent: March 5, 2002Assignee: Kabushiki Kaisha ToshibaInventors: Michio Sato, Takashi Yamanobe, Tohru Komatsu, Yoshiharu Fukasawa, Noriaki Yagi, Toshihiro Maki, Hiromi Shizu
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Publication number: 20020022414Abstract: To provide a press-clamping terminal in which a press-clamped condition can be easily examined, an examination mark (14), which can be deformed upon press-deforming of a barrel (11), is impressed on or stamped in an outer surface of a bottom portion (12) of a press-clamping terminal (10). (See FIG. 8.) To provide a press-clamping terminal in which an examination can be easily carried out with the need for using a bulky apparatus and tools, grooves (160), serving as a criterion for confirming a press-clamped condition, are impressed on or stamped in an outer surface of a bottom portion (120) of a barrel (110). Also, a mark (170), indicating a press-clamping position, is formed or impressed in this outer surface. (See FIG. 24.Type: ApplicationFiled: June 8, 2001Publication date: February 21, 2002Inventors: Hironori Kitagawa, Naoki Ito, Tsutomu Takayama, Toshihiro Maki
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Patent number: RE41975Abstract: An interconnector line of thin film comprising 0.001 to 30 at % of at least one kind of a first element capable of constituting an intermetallic compound of aluminum and/or having a higher standard electrode potential than aluminum, for example, at least one kind of the first element selected from Y, Sc, La, Ce, Nd, Sm, Gd, Tb, Dy, Er, Th, Sr, Ti, Zr, V, Nb, Ta, Cr, Mo, W, Mn, Tc, Re, Fe, Co, Ni, Pd, Ir, Pt, Cu, Ag, Au, Cd, Si, Pb and B; and one kind of a second element selected from C, O, N and H in a proportion of 0.01 at ppm to 50 at % of the first element, with the balance comprising substantially Al. In addition to having low resistance, such an Al interconnector line of thin film can prevent the occurrence of hillocks and the electrochemical reaction with an ITO electrode. The interconnector line of thin film can be obtained by sputtering in a dust-free manner by using a sputter target having a similar composition.Type: GrantFiled: October 14, 1996Date of Patent: November 30, 2010Assignee: Kabushiki Kaisha ToshibaInventors: Takashi Ishigami, Koichi Watanabe, Akihisa Nitta, Toshihiro Maki, Noriaki Yagi
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Patent number: RE45481Abstract: An interconnector line of thin film comprising 0.001 to 30 at % of at least one kind of a first element capable of constituting an intermetallic compound of aluminum and/or having a higher standard electrode potential than aluminum, for example, at least one kind of the first element selected from Y, Sc, La, Ce, Nd, Sm, Gd, Tb, Dy, Er, Th, Sr, Ti, Zr, V, Nb, Ta, Cr, Mo, W, Mn, Tc, Re, Fe, Co, Ni, Pd, Ir, Pt, Cu, Ag, Au, Cd, Si, Pb and B; and one kind of a second element selected from C, O, N and H in a proportion of 0.01 at ppm to 50 at % of the first element, with the balance comprising substantially Al. In addition to having low resistance, such an Al interconnector line of thin film can prevent the occurrence of hillocks and the electrochemical reaction with an ITO electrode. The interconnector line of thin film can be obtained by sputtering in a dust-free manner by using a sputter target having a similar composition.Type: GrantFiled: March 22, 2006Date of Patent: April 21, 2015Assignee: Kabushiki Kaisha ToshibaInventors: Takashi Ishigami, Koichi Watanabe, Akihisa Nitta, Toshihiro Maki, Noriaki Yagi