Abstract: A wireless communication device includes a first housing including a first opening part; a second housing including a second opening part facing the first opening part, the second housing being arranged to face the first housing; a first resonance device including a first resonator, the first resonance device being arranged inside the first housing such that the first resonator is facing outside from the first opening part; and a second resonance device including a second resonator, the second resonance device being arranged inside the second housing such that the second resonator is facing outside from the second opening part and is facing the first resonator.

Abstract: A communication apparatus includes: a switching device which modulates at least one of a first signal with a first frequency and passed through a first communication device and a second signal not passed through the first communication device at a second frequency lower than the first frequency; a signal combiner which combines together the first and second signals, at least one of which is modulated, to generate a composite signal containing a switching frequency component with an amplitude in response to the phase difference between the first and second signals at the second frequency; and a control unit which, based on the switching frequency component, obtains as a reference phase adjustment amount a phase adjustment amount applied by a phase adjuster in the first communication device.

Abstract: A phase adjustment device includes: a detection signal generator configured to generate a pair of first and second detection signals for detecting a phase difference between two signals whose phases have been adjusted by two phase adjusters, respectively, a maximum sensitivity phase difference of one of the first and second detection signals being not overlap with that of the other, and detection sensitivity of the phase difference becoming maximum at the maximum sensitivity phase difference; a detection signal selector configured to select one of the first and second detection signals whose predetermined range around the maximum sensitivity phase difference covers a preset phase difference; and a phase controller configured to control an amount of phase-adjusting by at least one of the two phase adjusters based on a difference between the phase difference detected within the predetermined range using the selected detection signal and the preset phase difference.

Abstract: An electronic circuit, includes: a first oscillator configured to generate a reference signal; a plurality of phase synchronization circuits, each including a second oscillator configured to generate an output signal having a frequency corresponding to an input, and a phase comparator configured to input, to the second oscillator, a signal corresponding to a phase difference between the output signal generated by the second oscillator and the reference signal generated by the first oscillator; and a controller configured to control relative phases of the reference signals input to the phase synchronization circuits from the first oscillator, based on the signals input to the corresponding second oscillators from the phase comparators in the phase synchronization circuits.

Abstract: A communication apparatus includes: a switching device which modulates at least one of a first signal with a first frequency and passed through a first communication device and a second signal not passed through the first communication device at a second frequency lower than the first frequency; a signal combiner which combines together the first and second signals, at least one of which is modulated, to generate a composite signal containing a switching frequency component with an amplitude in response to the phase difference between the first and second signals at the second frequency; and a control unit which, based on the switching frequency component, obtains as a reference phase adjustment amount a phase adjustment amount applied by a phase adjuster in the first communication device.

Abstract: A wireless communication device includes a first housing including a first opening part; a second housing including a second opening part facing the first opening part, the second housing being arranged to face the first housing; a first resonance device including a first resonator, the first resonance device being arranged inside the first housing such that the first resonator is facing outside from the first opening part; and a second resonance device including a second resonator, the second resonance device being arranged inside the second housing such that the second resonator is facing outside from the second opening part and is facing the first resonator.

Abstract: A waveguide converter includes a waveguide including a hollow section through which a signal is transmitted and a first opening formed on a cross section of the hollow section in a direction orthogonal to a transmission direction of the signal, and a circuit board including on a same surface a signal line, a conductor patch connected to the signal line, and a second opening surrounding the conductor patch. The waveguide is fixed onto the circuit board. The first opening surrounds the second opening. The conductor patch includes a rectangular section which has short sides in parallel with short sides of the first opening, and has a first long side and a second long side connected to the signal line in parallel with long sides of the first opening, and protruding portions which are provided so as to touch the short sides near both ends of the second long side, respectively.

Abstract: An electronic circuit, includes: a first oscillator configured to generate a reference signal; a plurality of phase synchronization circuits, each including a second oscillator configured to generate an output signal having a frequency corresponding to an input, and a phase comparator configured to input, to the second oscillator, a signal corresponding to a phase difference between the output signal generated by the second oscillator and the reference signal generated by the first oscillator; and a controller configured to control relative phases of the reference signals input to the phase synchronization circuits from the first oscillator, based on the signals input to the corresponding second oscillators from the phase comparators in the phase synchronization circuits.

Abstract: A signal converter configured to convert a signal between a substrate unit and a hollow waveguide includes a substrate unit, including a first conductor layer formed on one face of a dielectric substrate, and a second conductor layer formed on another face of the dielectric substrate, a plurality of conduction units that penetrate the dielectric substrate and provide conduction between the first conductor layer and the second conductor layer, an dielectric waveguide formed by the dielectric substrate, the first and second conductor layers, and the conduction units, and a conversion unit that converts the signal between the hollow waveguide and the dielectric waveguide, the conversion unit including a conductor patch having a separator region between itself and the first conductor layer, with the conductor patch being disposed on the substrate unit within an aperture of the hollow waveguide.

Abstract: A signal converter includes: a dielectric substrate; a first conductor layer disposed on one of opposite sides of the dielectric substrate, while including an input section receiving high-frequency signals inputted thereto; a second conductor layer disposed on the other of the opposite sides of the dielectric substrate; and plural first conducting sections penetrating the dielectric substrate for electrically connecting the first and second conductor layers, while forming a waveguide in the inside of the dielectric substrate with the first and second conductor layers. The first conductor layer is disposed on the dielectric substrate without occupying a separator section disposed on the dielectric substrate. The separator section includes first and second sections extend from the input section towards the waveguide. The first and second sections are separated away from each other for gradually increasing their interval in proportion to a distance away from the input section towards the waveguide.

Abstract: A signal converter includes: a dielectric substrate; a first conductor layer disposed on one of opposite sides of the dielectric substrate, while including an input section receiving high-frequency signals inputted thereto; a second conductor layer disposed on the other of the opposite sides of the dielectric substrate; and plural first conducting sections penetrating the dielectric substrate for electrically connecting the first and second conductor layers, while forming a waveguide in the inside of the dielectric substrate with the first and second conductor layers. The first conductor layer is disposed on the dielectric substrate without occupying a separator section disposed on the dielectric substrate. The separator section includes first and second sections extend from the input section towards the waveguide. The first and second sections are separated away from each other for gradually increasing their interval in proportion to a distance away from the input section towards the waveguide.

Abstract: A signal converter configured to convert a signal between a substrate unit and a hollow waveguide includes a substrate unit, including a first conductor layer formed on one face of a dielectric substrate, and a second conductor layer formed on another face of the dielectric substrate, a plurality of conduction units that penetrate the dielectric substrate and provide conduction between the first conductor layer and the second conductor layer, an dielectric waveguide formed by the dielectric substrate, the first and second conductor layers, and the conduction units, and a conversion unit that converts the signal between the hollow waveguide and the dielectric waveguide, the conversion unit including a conductor patch having a separator region between itself and the first conductor layer, with the conductor patch being disposed on the substrate unit within an aperture of the hollow waveguide.

Abstract: A waveguide converter includes a waveguide configured with an opening, a patch disposed inside the opening of the waveguide, a first ground conductor provided substantially along the opening of the waveguide and a port that opens in a side surface of the waveguide through which a signal line connected to the patch extends.

Abstract: In a circuit module for a high frequency, a resistance film is formed on a side of a semiconductor circuit chip, mounted above a dielectric substrate through ground metal layers, opposite to the dielectric substrate. A distance from the ground metal layer to the resistance film is a ¼ wavelength at a predetermined frequency, and the resistance film has a sheet resistance equal to a characteristic impedance of air. A second dielectric substrate with the metal layer formed on a side opposite to the resistance film can be mounted. When being adhered to the second dielectric substrate, the resistance film has a characteristic impedance determined by a permittivity of a material of the semiconductor circuit chip. When being formed in space from the semiconductor circuit chip, the resistance film has a sheet resistance equal to a characteristic impedance of air. The thickness of the second dielectric substrate is a ¼ wavelength in a desired frequency.

Abstract: A waveguide substrate has improved signal conversion characteristic to a cavity waveguide at a post wall waveguide less suffering a manufacturing error occurring at a portion leading the signal to the cavity waveguide. The waveguide substrate has a converting part provided at a position shutting off an end of the waveguide, waveguide shutting-off conducting posts penetrating a dielectric plate to electrically conduct between conductor layers on the both surfaces of the dielectric plate, and two slit-like regions, in which no conductor layer is formed, arranged in parallel in the upper stream and the lower stream with respect to a direction of propagation of a high-frequency signal from the waveguide toward the waveguide shutting-off conducting posts.

Abstract: A communication radio-frequency module is provided that has a semiconductor device to which an antenna element is connected. This communication radio-frequency module includes: a supporting body that has a waveguide formed therein; a wiring board that is fixed onto a surface of the supporting body; the semiconductor device that is flip-chip mounted onto the wiring board by ultrasonic bonding; and the antenna element that is disposed on the other surface of the supporting body. In this module, the wiring board includes a board core member that is made of a resin material, and the supporting body includes a supporting body core member that is also made of a resin material.

Abstract: A high-frequency module includes a stiffener (a support substrate), a resin base member of which one surface is fixed to the stiffener, a first conductive pattern formed on said one surface of the resin base member, a second conductive pattern formed on the other surface of the resin base member for constituting a waveguide in combination with the first conductive pattern to pass a high-frequency signal through the resin base member and including a window for allowing the high-frequency signal to pass therethrough, a cap for covering a semiconductor element and for absorbing or reflecting the high-frequency signal, an adopter (a waveguide tube) fixed onto the second conductive pattern such that one open end thereof surrounds the window, and an antenna fixed to the other open end of the adaptor.

Abstract: In a circuit module for a high frequency, a resistance film is formed on a side of a semiconductor circuit chip, mounted above a dielectric substrate through ground metal layers, opposite to the dielectric substrate. A distance from the ground metal layer to the resistance film is a ¼ wavelength at a predetermined frequency, and the resistance film has a sheet resistance equal to a characteristic impedance of air. A second dielectric substrate with the metal layer formed on a side opposite to the resistance film can be mounted. When being adhered to the second dielectric substrate, the resistance film has a characteristic impedance determined by a permittivity of a material of the semiconductor circuit chip. When being formed in space from the semiconductor circuit chip, the resistance film has a sheet resistance equal to a characteristic impedance of air. The thickness of the second dielectric substrate is a ¼ wavelength in a desired frequency.

Abstract: A high-frequency module includes a stiffener (a support substrate), a resin base member of which one surface is fixed to the stiffener, a first conductive pattern formed on said one surface of the resin base member, a second conductive pattern formed on the other surface of the resin base member for constituting a waveguide in combination with the first conductive pattern to pass a high-frequency signal through the resin base member and including a window for allowing the high-frequency signal to pass therethrough, a cap for covering a semiconductor element and for absorbing or reflecting the high-frequency signal, an adopter (a waveguide tube) fixed onto the second conductive pattern such that one open end thereof surrounds the window, and an antenna fixed to the other open end of the adaptor.

Abstract: A waveguide substrate has improved signal conversion characteristic to a cavity waveguide at a post wall waveguide less suffering a manufacturing error occurring at a portion leading the signal to the cavity waveguide. The waveguide substrate has a converting part provided at a position shutting off an end of the waveguide, waveguide shutting-off conducting posts penetrating a dielectric plate to electrically conduct between conductor layers on the both surfaces of the dielectric plate, and two slit-like regions, in which no conductor layer is formed, arranged in parallel in the upper stream and the lower stream with respect to a direction of propagation of a high-frequency signal from the waveguide toward the waveguide shutting-off conducting posts.