Patents by Inventor Toshihiro Shimura

Toshihiro Shimura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Radio-frequency module for communication and method of manufacturing the same
    Publication number: 20060202312
    Abstract: A communication radio-frequency module is provided that has a semiconductor device to which an antenna element is connected. This communication radio-frequency module includes: a supporting body that has a waveguide formed therein; a wiring board that is fixed onto a surface of the supporting body; the semiconductor device that is flip-chip mounted onto the wiring board by ultrasonic bonding; and the antenna element that is disposed on the other surface of the supporting body. In this module, the wiring board includes a board core member that is made of a resin material, and the supporting body includes a supporting body core member that is also made of a resin material.
    Type: Application
    Filed: July 25, 2005
    Publication date: September 14, 2006
    Applicant: FUJITSU LIMITED
    Inventors: Shinya Iijima, Tomoyuki Abe, Nobuyuki Hayashi, Yoji Ohashi, Toshihiro Shimura
  • Millimeter wave module having probe pad structure and millimeter wave system using plurality of millimeter wave modules
    Patent number: 6867661
    Abstract: A millimeter wave system includes a plurality of millimeter wave modules, each of which comprises a substrate; a microstrip conductor formed on one surface side of the substrate; a ground plate formed on the other surface side of the substrate; and conductive pads which are disposed on both sides of a strip conductor portion which extends from said microstrip conductor via a tapered portion, and which are connected to the ground potential of said ground plate through a via hole, wherein the strip conductors of this plurality of millimeter wave modules are connected to each other using conductive ribbon. Moreover, when a plurality of millimeter wave modules is connected to form a millimeter wave system, the effect produced by the interaction between the unnecessary conductive pads connected to the ground potential and the strip conductor can be reduced.
    Type: Grant
    Filed: September 4, 2002
    Date of Patent: March 15, 2005
    Assignee: Fujitsu Limited
    Inventors: Debasis Dawn, Yoji Ohashi, Toshihiro Shimura
  • High-frequency integrated circuit module
    Patent number: 6807063
    Abstract: A high-frequency integrated circuit (IC) module comprising a multilayer mounting board on which an integrated circuit with a plurality of high-frequency signal terminals is mounted, and IC connecting portions disposed on one surface of the multilayer mounting board and respectively connected with the high-frequency signal terminals. The high-frequency IC module further comprises external connection terminal portions disposed at wider intervals than those between the high-frequency signal terminals, high-frequency signal lines provided within the multilayer mounting board, first through holes for connecting the inner ends of the high-frequency signal lines with the IC connecting portions, and second through holes for connecting the outer ends of the high-frequency signal lines with the external connection terminal portions.
    Type: Grant
    Filed: October 22, 2002
    Date of Patent: October 19, 2004
    Assignee: Fujitsu Limited
    Inventors: Toshihiro Shimura, Yoji Ohashi
  • High-frequency integrated circuit module
    Publication number: 20030174479
    Abstract: A high-frequency integrated circuit (IC) module comprising a multilayer mounting board on which an integrated circuit with a plurality of high-frequency signal terminals is mounted, and IC connecting portions disposed on one surface of the multilayer mounting board and respectively connected with the high-frequency signal terminals. The high-frequency IC module further comprises external connection terminal portions disposed at wider intervals than those between the high-frequency signal terminals, high-frequency signal lines provided within the multilayer mounting board, first through holes for connecting the inner ends of the high-frequency signal lines with the IC connecting portions, and second through holes for connecting the outer ends of the high-frequency signal lines with the external connection terminal portions.
    Type: Application
    Filed: October 22, 2002
    Publication date: September 18, 2003
    Inventors: Toshihiro Shimura, Yoji Ohashi
  • Millimeter wave module having probe pad structure and millimeter wave system using plurality of millimeter wave modules
    Publication number: 20030030506
    Abstract: A millimeter wave system includes a plurality of millimeter wave modules, each of which comprises a substrate; a microstrip conductor formed on one surface side of the substrate; a ground plate formed on the other surface side of the substrate; and conductive pads which are disposed on both sides of a strip conductor portion which extends from said microstrip conductor via a tapered portion, and which are connected to the ground potential of said ground plate through a via hole, wherein the strip conductors of this plurality of millimeter wave modules are connected to each other using conductive ribbon. Moreover, when a plurality of millimeter wave modules is connected to form a millimeter wave system, the effect produced by the interaction between the unnecessary conductive pads connected to the ground potential and the strip conductor can be reduced.
    Type: Application
    Filed: September 4, 2002
    Publication date: February 13, 2003
    Inventors: Debasis Dawn, Yoji Ohashi, Toshihiro Shimura