Abstract: The present invention relates to a high dielectric constant paste composition comprising (A) inorganic particles having a perovskite crystal structure or a complex perovskite crystal structure, (B) a compound represented by any one of the general formulas (1) to (4) shown below, and (C) an organic solvent. The present invention provides a high dielectric constant paste composition for producing a high dielectric constant dielectric composition which has high insulation reliability and exhibits satisfactory resistance in a high-temperature high-humidity bias test.

Abstract: Disclosed is a photosensitive adhesive composition including: (A) an epoxy compound, (B) a soluble polyimide having a residue of the diamine represented by the general formula (2), (C) a photopolymerizable compound, and (D) a photopolymerization initiator, wherein the epoxy compound (A) contains an epoxy compound represented by the general formula (1), and also the soluble polyimide (B) has a residue of diamine represented by the general formula (2): The present invention provides a photosensitive adhesive composition which can be developed with an alkali developing solution after exposure, and exhibits high adhesive strength in case of thermocompression bonding on a substrate, and is also excellent in insulation stability.

Abstract: Disclosed is a process which comprises bringing an acidic organic substance or phosphoric acid into contact with a metal to form, on the surface of the metal, a layer that contains either an organic acid salt formed from both the acidic organic substance and the metal or a phosphoric acid salt formed from both the phosphoric acid and the metal. In the process, the layer can be selectively formed only on the surface of the metal. When the process is applied to the production of core-shell particles, neither agglomeration of the particles nor viscosity increase of the fluid occurs, while when the process is applied to the production of a covered metal-wiring circuit board, the layer can be selectively formed only in the metal area to be covered.

Abstract: Provided is an adhesive composition having both excellent storability and excellent connection reliability. The adhesive composition comprises (a) a polyimide soluble in organic solvents, (b) an epoxy compound, (c) particles of a curing accelerator, and (d) inorganic particles, the amounts of the organic-solvent-soluble polyimide (a) and the curing-accelerator particles (c) being 15-90 parts by weight and 0.1-50 parts by weight, respectively, per 100 parts by weight of the epoxy compound (b), and the content of the inorganic particles (d) being 30-80 wt. % of the total amount of (a) to (d).

Abstract: The present invention is an optical waveguide-forming paste composition including (A) barium sulfate particles with a mean particle diameter of 1 nm or more to 50 nm or less, (B) a compound having a polymerizable group and a carboxyl group, or a phosphoric ester compound having a polymerizable group, and (C) an organic solvent.

Abstract: The present invention relates to a high dielectric constant paste composition comprising (A) inorganic particles having a perovskite crystal structure or a complex perovskite crystal structure, (B) a compound represented by any one of the general formulas (1) to (4) shown below, and (C) an organic solvent. The present invention provides a high dielectric constant paste composition for producing a high dielectric constant dielectric composition which has high insulation reliability and exhibits satisfactory resistance in a high-temperature high-humidity bias test.

Abstract: A paste composition containing an inorganic filler, a resin and a solvent, wherein the paste composition is characterized in that it contains one or more solvents of which the boiling point is 160° C. or higher and an inorganic filler of which the mean particle diameter is 5 ?m or smaller, and the total content of the solvent is 25 wt % or less based on the total amount of the paste composition, and a dielectric composition containing an inorganic filler and resin, wherein the inorganic filler includes inorganic fillers of at least two kinds of mean particle diameter, and the greatest mean particle diameter of said mean particle diameters is 0.1-5 ?m and is 3 times or more the minimum mean particle diameter.

Abstract: Problems: an object of the present invention is to provide an optical waveguide-forming paste composition that allows short-time curing and provides excellent developability. Means for Solving: The present invention is directed to an optical waveguide-forming paste composition including (A) barium sulfate particles with a mean particle diameter of 1 nm or more to 50 nm or less, (B) a compound having a polymerizable group and a carboxyl group, or a phosphoric ester compound having a polymerizable group, and (C) an organic solvent.

Abstract: [Problems] To provided an adhesive composition for semiconductor that permits handling without an occurrence of cracking or peeling off even when being flexed, that at the time of laminating, permits laminating on the electrode side of a semiconductor wafer provided with bump electrodes of which bump electrodes have a narrow pitch and a high pin proportion, that at the time of dicing, permits a high-speed cutting without any dicing dust contamination or defect, and that facilitates detection of alignment marks at the time of dicing and flip chip assembly. [Means for Solving Problems] There is provided an adhesive composition for semiconductor comprising an organic-solvent-soluble polyimide (a), an epoxy compound (b) and a hardening accelerator (c), wherein per 100 wt parts of the epoxy compound (b), there are contained 15 to 90 wt parts of the organic-solvent-soluble polyimide (a) and 0.1 to 10 wt parts of the hardening accelerator (c), wherein the epoxy compound (b) contains a compound being liquid at 25° C.

Abstract: A paste composition containing (a) a resin, (b) high dielectric constant inorganic particles having a perovskite crystal structure, and (c) an organic solvent, wherein the average particle diameter of the high dielectric constant inorganic particles is 0.002 ?m to 0.06 ?m, and the amount of all organic solvents is 35 wt % to 85 wt % based on the total amount of the paste composition. Further, a dielectric composition containing (a) a resin and (b) high dielectric constant inorganic particles having a perovskite crystal structure, wherein the average particle diameter of the high dielectric constant inorganic particles (b) is 0.002 ?m to 0.06 ?m.

Abstract: This invention is a resin composition for optical wiring, comprising an inorganic filler with an average particle size of 1 nm to 100 nm and a resin, having a ratio nf/nr (where nf is the refractive index of the inorganic filler and nr is the refractive index of the resin) of 0.8 to 1.2, a thermal expansion coefficient of ?1×10?5 /° C. to 4×10?5/° C., and a true dependency value of its refractive index on the temperature of ?1×10?4/° C. to 1×10?4/° C. in a temperature range from ?20° C. to 90° C., and substantially incapable of absorbing light in a wavelength range from 0.6 to 0.9 ?m or from 1.2 to 1.6 ?m. This invention also provides an optoelectronic circuit board.

Abstract: This invention is a resin composition for optical wiring, comprising an inorganic filler with an average particle size of 1 nm to 100 nm and a resin, having a ratio nf/nr (where nf is the refractive index of the inorganic filler and nr is the refractive index of the resin) of 0.8 to 1.2, a thermal expansion coefficient of ?1×10?5/° C. to 4×105/° C., and a true dependency value of its refractive index on the temperature of ?1×10?4/° C. to 1×10?4/° C. in a temperature range from ?20° C. to 90° C., and substantially incapable of absorbing light in a wavelength range from 0.6 to 0.9 ?m or from 1.2 to 1.6 ?m. This invention also provides an optoelectronic circuit board.

Abstract: A paste composition contains an inorganic filler, a resin and a solvent, wherein the paste composition is characterized in that it contains one or more solvents of which the boiling point is 160° C. or higher and an inorganic filler of which the mean particle diameter is 5 ?m or smaller, and the total content of the solvent is 25 wt % or less based on the total amount of the paste composition, and a dielectric composition contains an inorganic filler and resin, wherein the inorganic filler includes inorganic fillers of at least two kinds of mean particle diameter, and the greatest mean particle diameter of said mean particle diameters is 0.1-5 ?m and is 3 times or more to the minimum mean particle diameter. It is possible to obtain a high dielectric constant composition of which linear expansion coefficient is low, and which has a large capacitance.

Abstract: The object of this invention is to provide a rewritable phase change type optical recording medium and an optical recording apparatus that are good in erasure characteristics and small in jitter even in high linear velocity high density recording, are unlikely to cause cross erasure even in the use of a substrate with a narrow track width, are unlikely to be deteriorated in signal quality even after repeated irradiation with a laser beam, and are good also in storage durability.

Abstract: A rewritable phase change type optical recording medium having excellent in storage durability such as archival property and overwrite shelf property and is less likely to have increased jitters, lower contrast and bursting due to deterioration by repeated overwriting is disclosed. The optical recording medium comprises a first dielectric layer, a first boundary layer and a recording layer, in tis order, wherein the first boundary layer is in contact with the recording layer. The information in the optical recording medium can be recorded, erased and reproduced by irradiating the recording layer with light. The recording and erasure of information are affected by reversible phase change between amorphous phase and crystalline phase of the recording layer.

Abstract: An object of the present invention is to provide a rewritable phase change type optical recording medium less likely to have increased jitters, lower contrast, bursting, etc. respectively caused as deterioration by repeated overwriting. Another object of the present invention is to provide a rewritable phase change type recording medium excellent in storage durability such as archival property and overwrite shelf property.

Abstract: An optical recording medium, wherein a recording layer is formed on a substrate to which a light beam is applied to record, erase, and read data with said recording and erasing of data being carried out by means of phase changes between amorphous and crystalline, and which recording medium has a laminated structure made up of a transparent substrate on which at least a first dielectric layer, recording layer, second dielectric layer, and reflecting layer are formed in this order; and the second dielectric layer not being transparent.Said optical recording media permit low-power recording and erasing, remain stable after repeated recording and erasing, and hardly suffer deterioration in performance or formation of defects. They are high in resistance to moist heat and oxidation and long in service life.

Abstract: A solution for forming a superconductive thin film prepared by dissolving a mol of a compound selected from group A consisting of alkoxides and alkoxyalkoxides of a rare earth metal element; b mol of a compound selected from group B consisting of alkoxides and alkoxyalkoxides of Ba, Sr and Ca; and c mol of a compound selected from group C consisting of alkoxides and alkoxyalkoxides of Cu in e liter of a compound selected from group E, a solvent selected from alcohols together with d mol of a compound selected from group D for inhibiting hydrolysis action such as an amine, a ketone and a glycol, such that the following relationships:0.1.times.(a+b+c).ltoreq.d.ltoreq.3.times.(a+b+c)and0.01.ltoreq.[(a+b+c)/e].ltoreq.3can be satisfied.

Abstract: A solution for forming a superconductive thin film prepared by dissolving a mol of a compound selected from group A consisting of alkoxides and alkoxyalkoxides of a rare earth metal element; b mol of a compound selected from group B consisting of alkoxides and alkoxyalkoxides of Ba, Sr and Ca; and c mol of a compound selected from group C consisting of alkoxides and alkoxyalkoxides of Cu in e liter of a compound selected from group E, a solvent selected from alcohols together with d mol of a compound selected from group D having hydrolysis inhibitory action such as an amine, a ketone and a glycol, such that the following relationships:0.1.times.(a+b+c).gtoreq.d.gtoreq.3.times.(a+b+c)and0.1.gtoreq.[(a+b+c)/e].gtoreq.emay be satisfied.