Patents by Inventor Toshikazu Matsui
Toshikazu Matsui has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8513808Abstract: Provided is a technique capable of improving the reliability of a semiconductor device having a slit made over a main surface of a semiconductor substrate, so as to surround each element formation region. In the technique, a second passivation film covers the side surface of an opening made to make the upper surface of a sixth-layer interconnection M6 used for bonding pads naked, and the inner walls (the side surfaces and the bottom surface) of a slit made to surround the circumference of a guard ring and made in a first passivation film, an insulating film for bonding, and an interlayer dielectric, so as to cause the bottom thereof not to penetrate through a barrier insulating film.Type: GrantFiled: April 27, 2011Date of Patent: August 20, 2013Assignee: Renesas Electronics CorporationInventors: Katsuhiko Hotta, Takeshi Furusawa, Toshikazu Matsui, Takuro Homma
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Patent number: 8431978Abstract: In connection with a semiconductor device including a capacitor element there is provided a technique capable of improving the reliability of the capacitor element. A capacitor element is formed in an element isolation region formed over a semiconductor substrate. The capacitor element includes a lower electrode and an upper electrode formed over the lower electrode through a capacitor insulating film. Basically, the lower electrode and the upper electrode are formed from polysilicon films and a cobalt silicide film formed over the surfaces of the polysilicon films. End portions of the cobalt silicide film formed over the upper electrode are spaced apart a distance from end portions of the upper electrode. Besides, end portions of the cobalt silicide film formed over the lower electrode are spaced apart a distance from boundaries between the upper electrode and the lower electrode.Type: GrantFiled: August 16, 2012Date of Patent: April 30, 2013Assignee: Renesas Electronics CorporationInventors: Yoshiyuki Kawashima, Koichi Toba, Yasushi Ishii, Toshikazu Matsui, Takashi Hashimoto
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Patent number: 8390048Abstract: For enhancing the high performance of a non-volatile semiconductor memory device having an MONOS type transistor, a non-volatile semiconductor memory device is provided with MONOS type transistors having improved performance in which the memory cell of an MONOS non-volatile memory comprises a control transistor and a memory transistor. A control gate of the control transistor comprises an n-type polycrystal silicon film and is formed over a gate insulative film comprising a silicon oxide film. A memory gate of the memory transistor comprises an n-type polycrystal silicon film and is disposed on one of the side walls of the control gate. The memory gate comprises a doped polycrystal silicon film with a sheet resistance lower than that of the control gate comprising a polycrystal silicon film formed by ion implantation of impurities to the undoped silicon film.Type: GrantFiled: October 14, 2010Date of Patent: March 5, 2013Assignee: Renesas Electronics CorporationInventors: Takeshi Sakai, Yasushi Ishii, Tsutomu Okazaki, Masaru Nakamichi, Toshikazu Matsui, Kyoya Nitta, Satoru Machida, Munekatsu Nakagawa, Yuichi Tsukada
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Publication number: 20120306051Abstract: In connection with a semiconductor device including a capacitor element there is provided a technique capable of improving the reliability of the capacitor element. A capacitor element is formed in an element isolation region formed over a semiconductor substrate. The capacitor element includes a lower electrode and an upper electrode formed over the lower electrode through a capacitor insulating film. Basically, the lower electrode and the upper electrode are formed from polysilicon films and a cobalt silicide film formed over the surfaces of the polysilicon films. End portions of the cobalt silicide film formed over the upper electrode are spaced apart a distance from end portions of the upper electrode. Besides, end portions of the cobalt silicide film formed over the lower electrode are spaced apart a distance from boundaries between the upper electrode and the lower electrode.Type: ApplicationFiled: August 16, 2012Publication date: December 6, 2012Inventors: Yoshiyuki Kawashima, Koichi Toba, Yasushi Ishii, Toshikazu Matsui, Takashi Hashimoto
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Patent number: 8319265Abstract: A semiconductor memory array includes a first nonvolatile memory cell having a first charge storage layer and a first gate electrode and a second nonvolatile memory cell, adjacent to the first memory cell in a first direction, having a second charge storage layer and a second gate electrode. The first and second electrodes extend in a second direction perpendicular to the first direction, the first electrode has a first contact section extending toward the second electrode in the first direction, and the second electrode has a second contact section extending toward the first electrode in the first direction. The first and second contact positions are shifted in the second direction, respectively, and the first electrode and the first contact section are electrically separated from the second electrode and the second contact section.Type: GrantFiled: October 16, 2009Date of Patent: November 27, 2012Assignee: Renesas Electronics CorporationInventors: Tsutomu Okazaki, Daisuke Okada, Kyoya Nitta, Toshihiro Tanaka, Akira Kato, Toshikazu Matsui, Yasushi Ishii, Digh Hisamoto, Kan Yasui
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Patent number: 8258561Abstract: In connection with a semiconductor device including a capacitor element there is provided a technique capable of improving the reliability of the capacitor element. A capacitor element is formed in an element isolation region formed over a semiconductor substrate. The capacitor element includes a lower electrode and an upper electrode formed over the lower electrode through a capacitor insulating film. Basically, the lower electrode and the upper electrode are formed from polysilicon films and a cobalt silicide film formed over the surfaces of the polysilicon films. End portions of the cobalt silicide film formed over the upper electrode are spaced apart a distance from end portions of the upper electrode. Besides, end portions of the cobalt silicide film formed over the lower electrode are spaced apart a distance from boundaries between the upper electrode and the lower electrode.Type: GrantFiled: November 30, 2011Date of Patent: September 4, 2012Assignee: Renesas Electronics CorporationInventors: Yoshiyuki Kawashima, Koichi Toba, Yasushi Ishii, Toshikazu Matsui, Takashi Hashimoto
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Publication number: 20120068307Abstract: In connection with a semiconductor device including a capacitor element there is provided a technique capable of improving the reliability of the capacitor element. A capacitor element is formed in an element isolation region formed over a semiconductor substrate. The capacitor element includes a lower electrode and an upper electrode formed over the lower electrode through a capacitor insulating film. Basically, the lower electrode and the upper electrode are formed from polysilicon films and a cobalt silicide film formed over the surfaces of the polysilicon films. End portions of the cobalt silicide film formed over the upper electrode are spaced apart a distance from end portions of the upper electrode. Besides, end portions of the cobalt silicide film formed over the lower electrode are spaced apart a distance from boundaries between the upper electrode and the lower electrode.Type: ApplicationFiled: November 30, 2011Publication date: March 22, 2012Inventors: Yoshiyuki Kawashima, Koichi Toba, Yasushi Ishii, Toshikazu Matsui, Takashi Hashimoto
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Patent number: 8084800Abstract: In connection with a semiconductor device including a capacitor element there is provided a technique capable of improving the reliability of the capacitor element. A capacitor element is formed in an element isolation region formed over a semiconductor substrate. The capacitor element includes a lower electrode and an upper electrode formed over the lower electrode through a capacitor insulating film. Basically, the lower electrode and the upper electrode are formed from polysilicon films and a cobalt silicide film formed over the surfaces of the polysilicon films. End portions of the cobalt silicide film formed over the upper electrode are spaced apart a distance from end portions of the upper electrode. Besides, end portions of the cobalt silicide film formed over the lower electrode are spaced apart a distance from boundaries between the upper electrode and the lower electrode.Type: GrantFiled: September 28, 2008Date of Patent: December 27, 2011Assignee: Renesas Electronics CorporationInventors: Yoshiyuki Kawashima, Koichi Toba, Yasushi Ishii, Toshikazu Matsui, Takashi Hashimoto
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Publication number: 20110266679Abstract: Provided is a technique capable of improving the reliability of a semiconductor device having a slit made over a main surface of a semiconductor substrate, so as to surround each element formation region. In the technique, a second passivation film covers the side surface of an opening made to make the upper surface of a sixth-layer interconnection M6 used for bonding pads naked, and the inner walls (the side surfaces and the bottom surface) of a slit made to surround the circumference of a guard ring and made in a first passivation film, an insulating film for bonding, and an interlayer dielectric, so as to cause the bottom thereof not to penetrate through a barrier insulating film.Type: ApplicationFiled: April 27, 2011Publication date: November 3, 2011Inventors: Katsuhiko Hotta, Takeshi Furusawa, Toshikazu Matsui, Takuro Homma
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Patent number: 8050066Abstract: The present invention aims to enhance the reliability of a semiconductor device having first through fourth capacitive elements. The first through fourth capacitive elements are disposed over a semiconductor substrate. A series circuit of the first and second capacitive elements and a series circuit of the third and fourth capacitive elements are coupled in parallel between first and second potentials. Lower electrodes of the first and third capacitive elements are respectively formed by a common conductor pattern and coupled to the first potential. Lower electrodes of the second and fourth capacitive elements are respectively formed by a conductor pattern of the same layer as the above conductor pattern and coupled to the second potential. Upper electrodes of the first and second capacitive elements are respectively formed by a common conductor pattern and brought to a floating potential.Type: GrantFiled: April 11, 2008Date of Patent: November 1, 2011Assignee: Renesas Electronics CorporationInventors: Keiichi Haraguchi, Toshikazu Matsui, Satoshi Kamei, Hisanori Ito
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Patent number: 8017482Abstract: The invention provides a method of manufacturing a semiconductor device at low cost in which the gate insulation film having a trench structure is not damaged by arsenic ions when the emitter layer or the like is formed and the insulation breakdown voltage is enhanced. A gate electrode made of polysilicon formed in a trench is thermally oxidized in a high temperature furnace or the like to form a thick polysilicon thermal oxide film on the gate electrode. Impurity ions are then ion-implanted to form an N type semiconductor layer that is to be an emitter layer or the like. At this time, the polysilicon thermal oxide film is formed thicker than the projected range Rp of impurity ions in the silicon oxide film for forming the N type semiconductor layer as the emitter layer or the like by ion implantation. This prevents a gate insulation film between the gate electrode and the N type semiconductor layer from being damaged by the impurity ions.Type: GrantFiled: December 21, 2010Date of Patent: September 13, 2011Assignees: SANYO Semiconductor Co., Ltd., Semiconductor Components Industries, LLCInventors: Toshikazu Matsui, Yasuyuki Sayama, Hiroki Eto, Takumi Hosoya
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Publication number: 20110159651Abstract: The invention provides a method of manufacturing a semiconductor device at low cost in which the gate insulation film having a trench structure is not damaged by arsenic ions when the emitter layer or the like is formed and the insulation breakdown voltage is enhanced. A gate electrode made of polysilicon formed in a trench is thermally oxidized in a high temperature furnace or the like to form a thick polysilicon thermal oxide film on the gate electrode. Impurity ions are then ion-implanted to form an N type semiconductor layer that is to be an emitter layer or the like. At this time, the polysilicon thermal oxide film is formed thicker than the projected range Rp of impurity ions in the silicon oxide film for forming the N type semiconductor layer as the emitter layer or the like by ion implantation. This prevents a gate insulation film between the gate electrode and the N type semiconductor layer from being damaged by the impurity ions.Type: ApplicationFiled: December 21, 2010Publication date: June 30, 2011Applicants: SANYO ELECTRIC CO., LTD., SANYO SEMICONDUCTOR CO., LTD.Inventors: TOSHIKAZU MATSUI, YASUYUKI SAYAMA, HIROKI ETO, TAKUMI HOSOYA
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Publication number: 20110089825Abstract: The present invention aims at providing a photocathode which can improve various characteristics. In a photocathode 10, an intermediate layer 14, an underlayer 16, and a photoelectron emission layer 18 are formed in this order on a substrate 12. The photoelectron emission layer 18 contains Sb and Bi and functions to emit a photoelectron in response to light incident thereon. The photoelectron emission layer 18 contains 32 mol % or less of Bi relative to SbBi. This can dramatically improve the linearity at low temperatures.Type: ApplicationFiled: November 7, 2008Publication date: April 21, 2011Applicant: HAMAMATSU PHOTONICS K.K.Inventors: Toshikazu Matsui, Yasumasa Hamana, Kimitsugu Nakamura, Yoshihiro Ishigami, Daijiro Oguri
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Publication number: 20110024820Abstract: For enhancing the high performance of a non-volatile semiconductor memory device having an MONOS type transistor, a non-volatile semiconductor memory device is provided with MONOS type transistors having improved performance in which the memory cell of an MONOS non-volatile memory comprises a control transistor and a memory transistor. A control gate of the control transistor comprises an n-type polycrystal silicon film and is formed over a gate insulative film comprising a silicon oxide film. A memory gate of the memory transistor comprises an n-type polycrystal silicon film and is disposed on one of the side walls of the control gate. The memory gate comprises a doped polycrystal silicon film with a sheet resistance lower than that of the control gate comprising a polycrystal silicon film formed by ion implantation of impurities to the undoped silicon film.Type: ApplicationFiled: October 14, 2010Publication date: February 3, 2011Inventors: Takeshi SAKAI, Yasushi ISHII, Tsutomu OKAZAKI, Masaru NAKAMICHI, Toshikazu MATSUI, Kyoya NITTA, Satoru MACHIDA, Munekatsu NAKAGAWA, Yuichi TSUKADA
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Patent number: 7863135Abstract: For enhancing the high performance of a non-volatile semiconductor memory device having an MONOS type transistor, a non-volatile semiconductor memory device is provided with MONOS type transistors having improved performance in which the memory cell of an MONOS non-volatile memory comprises a control transistor and a memory transistor. A control gate of the control transistor comprises an n-type polycrystal silicon film and is formed over a gate insulative film comprising a silicon oxide film. A memory gate of the memory transistor comprises an n-type polycrystal silicon film and is disposed on one of the side walls of the control gate. The memory gate comprises a doped polycrystal silicon film with a sheet resistance lower than that of the control gate comprising a polycrystal silicon film formed by ion implantation of impurities to the undoped silicon film.Type: GrantFiled: February 16, 2010Date of Patent: January 4, 2011Assignee: Renesas Electronics CorporationInventors: Takeshi Sakai, Yasushi Ishii, Tsutomu Okazaki, Masaru Nakamichi, Toshikazu Matsui, Kyoya Nitta, Satoru Machida, Munekatsu Nakagawa, Yuichi Tsukada
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Patent number: 7863670Abstract: In a semiconductor device which includes a split-gate type memory cell having a control gate and a memory gate, a low withstand voltage MISFET and a high withstand voltage MISFET, variations of the threshold voltage of the memory cell are suppressed. A gate insulating film of a control gate is thinner than a gate insulating film of a high withstand voltage MISFET, the control gate is thicker than a gate electrode 14 of the low withstand voltage MISFET and the ratio of thickness of a memory gate with respect to the gate length of the memory gate is larger than 1. The control gate and a gate electrode 15 are formed in a multilayer structure including an electrode material film 8A and an electrode material layer 8B, and the gate electrode 14 is a single layer structure formed at the same time as the electrode material film 8A of the control gate.Type: GrantFiled: June 23, 2009Date of Patent: January 4, 2011Assignee: Renesas Electronics CorporationInventors: Yasushi Ishii, Takashi Hashimoto, Yoshiyuki Kawashima, Koichi Toba, Satoru Machida, Kozo Katayama, Kentaro Saito, Toshikazu Matsui
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Publication number: 20100237404Abstract: A semiconductor device having a non-volatile memory is disclosed, whose disturb defect can be diminished or prevented. A memory cell of the non-volatile memory has a memory gate electrode formed over a main surface of a semiconductor substrate through an insulating film for charge storage. A first side wall is formed on a side face of the memory gate electrode, and at a side face of the first side wall, a second side wall is formed. On an upper surface of an n+-type semiconductor region for source in the memory cell there is formed a silicide layer whose end portion on the memory gate electrode MG side is defined by the second side wall.Type: ApplicationFiled: March 5, 2010Publication date: September 23, 2010Inventors: KOICHI TOBA, Yasushi Ishii, Yoshiyuki Kawashima, Satoru Machida, Munekatsu Nakagawa, Kentaro Saito, Toshikazu Matsui, Takashi Hashimoto, Kosuke Okuyama
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Patent number: 7745288Abstract: A semiconductor device having a non-volatile memory is disclosed, whose disturb defect can be diminished or prevented. A memory cell of the non-volatile memory has a memory gate electrode formed over a main surface of a semiconductor substrate through an insulating film for charge storage. A first side wall is formed on a side face of the memory gate electrode, and at a side face of the first side wall, a second side wall is formed. On an upper surface of an n+-type semiconductor region for source in the memory cell there is formed a silicide layer whose end portion on the memory gate electrode MG side is defined by the second side wall.Type: GrantFiled: March 13, 2007Date of Patent: June 29, 2010Assignee: Renesas Technology Corp.Inventors: Koichi Toba, Yasushi Ishii, Yoshiyuki Kawashima, Satoru Machida, Munekatsu Nakagawa, Kentaro Saito, Toshikazu Matsui, Takashi Hashimoto, Kosuke Okuyama
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Publication number: 20100144108Abstract: For enhancing the high performance of a non-volatile semiconductor memory device having an MONOS type transistor, a non-volatile semiconductor memory device is provided with MONOS type transistors having improved performance in which the memory cell of an MONOS non-volatile memory comprises a control transistor and a memory transistor. A control gate of the control transistor comprises an n-type polycrystal silicon film and is formed over a gate insulative film comprising a silicon oxide film. A memory gate of the memory transistor comprises an n-type polycrystal silicon film and is disposed on one of the side walls of the control gate. The memory gate comprises a doped polycrystal silicon film with a sheet resistance lower than that of the control gate comprising a polycrystal silicon film formed by ion implantation of impurities to the undoped silicon film.Type: ApplicationFiled: February 16, 2010Publication date: June 10, 2010Inventors: Takeshi SAKAI, Yasushi Ishii, Tsutomu Okazaki, Masaru Nakamichi, Toshikazu Matsui, Kyoya Nitta, Satoru Machida, Munekatsu Nakagawa, Yuichi Tsukada
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Publication number: 20100038700Abstract: A semiconductor memory array includes a first nonvolatile memory cell having a first charge storage layer and a first gate electrode and a second nonvolatile memory cell, adjacent to the first memory cell in a first direction, having a second charge storage layer and a second gate electrode. The first and second electrodes extend in a second direction perpendicular to the first direction, the first electrode has a first contact section extending toward the second electrode in the first direction, and the second electrode has a second contact section extending toward the first electrode in the first direction. The first and second contact positions are shifted in the second direction, respectively, and the first electrode and the first contact section are electrically separated from the second electrode and the second contact section.Type: ApplicationFiled: October 16, 2009Publication date: February 18, 2010Inventors: Tsutomu OKAZAKI, Daisuke Okada, Kyoya Nitta, Toshihiro Tanaka, Akira Kato, Toshikazu Matsui, Yasushi Ishii, Digh Hisamoto, Kan Yasui