Patents by Inventor Toshiki Furutani
Toshiki Furutani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 9232656Abstract: A wiring board includes a substrate having an opening portion, multiple electronic devices positioned in the opening portion such that the electronic devices are arrayed in the lateral direction of each of the electronic devices, and an insulation layer formed on the substrate such that the insulation layer covers the electronic devices in the opening portion of the substrate. The substrate has a wall surface defining the opening portion and formed such that the opening portion is partially partitioned and the electronic devices are kept from making contact with each other.Type: GrantFiled: February 7, 2014Date of Patent: January 5, 2016Assignee: IBIDEN CO., LTD.Inventors: Yukinobu Mikado, Mitsuhiro Tomikawa, Yusuke Tanaka, Toshiki Furutani
-
Publication number: 20150382471Abstract: A wiring board includes a substrate which has multiple opening portions and one or more boundary portions separating the opening portions, multiple electronic devices positioned in the opening portions of the substrate, respectively, a conductive pattern formed on a surface of the boundary portion, and an insulation layer formed on the substrate and the conductive pattern on the boundary portion of the substrate such that the insulation layer covers the electronic devices in the opening portions of the substrate. The boundary portion has a width which is in a range of approximately 0.05 to approximately 2.0 mm.Type: ApplicationFiled: September 4, 2015Publication date: December 31, 2015Applicant: IBIDEN CO., LTD.Inventors: Toshiki FURUTANI, Yukinobu Mikado, Toyotaka Shimabe, Shinobu Kato
-
Patent number: 9220168Abstract: A wiring board with a built-in electronic component includes a core substrate having the thickness not exceeding 300 ?m and having a cavity having an opening on a surface of the core substrate, an electronic component having the thickness not exceeding 300 ?m and accommodated in the cavity of the core substrate, and a laminated structure formed on the surface of the core substrate and including an insulation resin layer and a wiring layer such that the laminated structure is covering the opening of the cavity of the core substrate and the electronic component accommodated in the cavity of the core substrate. The electronic component has an insulation material body and an electrode formed on a surface of the insulation material body, and the wiring layer of the laminated structure is formed such that the thickness of the wiring layer is set smaller than the thickness of the electrode.Type: GrantFiled: January 30, 2014Date of Patent: December 22, 2015Assignee: IBIDEN CO., LTD.Inventors: Masahiro Zanma, Masafumi Niwa, Toshiki Furutani
-
Patent number: 9215805Abstract: A wiring board including a substrate having opening penetrating from first to second surfaces, an electronic component in the opening having first and second electrodes, a first insulation layer over the first surface, a second insulation layer over the second surface, a first via conductor in the first layer having bottom connected to the first electrode, a second via conductor in the first layer having bottom connected to the second electrode, a third via conductor in the second layer having bottom connected to the first electrode, and a fourth via conductor in the second layer having bottom connected to the second electrode. The first conductor is longer than the third conductor and has the bottom having greater width than the bottom of the third conductor, and the second conductor is longer than the fourth conductor and has the bottom having greater width than the bottom of the fourth conductor.Type: GrantFiled: January 24, 2013Date of Patent: December 15, 2015Assignee: IBIDEN CO., LTD.Inventors: Masahiro Zanma, Toshiki Furutani, Yukinobu Mikado
-
Patent number: 9204552Abstract: A printed wiring board includes a core substrate, an electronic component accommodated in the substrate, a first buildup structure formed on surface of the substrate and including an interlayer insulation layer, and a second buildup structure formed on the opposing surface of the substrate and including an interlayer insulation layer. The substrate includes a core material portion including multiple resin layers, a first conductive layer formed on first surface of the core portion and a second conductive layer formed on second surface of the core portion, the core portion has opening through the resin layers and accommodating the component, the insulation layer of the first structure is positioned such that the opening of the core portion is covered on the first surface, and the insulation layer of the second structure is positioned such that the opening of the core portion is covered on the second surface.Type: GrantFiled: November 27, 2012Date of Patent: December 1, 2015Assignee: IBIDEN Co., Ltd.Inventors: Toshiki Furutani, Yukinobu Mikado, Mitsuhiro Tomikawa
-
Publication number: 20150340309Abstract: A printed wiring board includes a first interlayer, a first conductive layer on first-surface side of the first interlayer, a second conductive layer on second-surface side of the first interlayer, a first buildup layer including interlayers and conductive layers and formed on first surface of the first interlayer, and a second buildup layer including interlayers and conductive layers and formed on second surface of the first interlayer. The first conductive layer is formed such that the first conductive layer is embedded in the first interlayer and exposing surface on the first surface of the first interlayer, the second conductive layer is formed on the second surface of the first interlayer, and the interlayers in the first buildup layer include a second interlayer positioned adjacent to the first conductive layer and having the greatest thickness among the first interlayer and interlayers in the first and second buildup layers.Type: ApplicationFiled: May 26, 2015Publication date: November 26, 2015Applicant: IBIDEN CO., LTD.Inventors: Toshiki FURUTANI, Yuki YOSHIKAWA
-
Publication number: 20150319848Abstract: A printed wiring board includes a core laminate including insulating layers and conductor layers, a first build-up layer formed on first surface of the laminate and including first interlayer resin and conductor layers, and a second build-up layer formed on second surface of the core laminate on the opposite side and including second interlayer resin and conductor layers. The conductor layers in the laminate include first and second conductor layers such that the first conductor layer is embedded in one of the insulating layers forming the first surface of the laminate and has an exposed surface exposed from the insulating layer and that the second conductor layer is formed on one of the insulating layers forming the second surface of the laminate, and the first interlayer resin layer has thickness greater than thickness of the second interlayer resin layer.Type: ApplicationFiled: April 30, 2015Publication date: November 5, 2015Applicant: IBIDEN CO., LTD.Inventors: Toshiki FURUTANI, Yuki YOSHIKAWA
-
Publication number: 20150264815Abstract: A substrate with a built-in capacitor includes an insulating base material layer, a build-up layer formed on the insulating base material layer and including a conductor layer and an insulating layer, and a multilayer ceramic capacitor positioned in an opening of the base material layer and including internal electrodes, ceramic dielectric layers and a pair of external electrodes. The ceramic capacitor has a cuboid shape having long sides and short sides, the pair of external electrodes is formed on opposing long-side sides such that the external electrodes are separated by a distance in range of 30 ?m to 200 ?m and that each external electrode includes a conductive paste layer connected to a respective group of the internal electrodes and a copper plated layer covering the conductive paste layer, and the conductive paste layer includes Ni paste or Cu paste including glass component in range of 5% to 40%.Type: ApplicationFiled: March 11, 2015Publication date: September 17, 2015Applicant: IBIDEN CO., LTD.Inventors: Toyotaka SHIMABE, Masahiro KANEKO, Toshiki FURUTANI
-
Publication number: 20150255359Abstract: An electronic component including a wiring board having interlayer insulation layers and conductive patterns, the wiring board having a first surface and a second surface on the opposite side of the first surface, multiple first bumps formed on a first conductive pattern positioned on the first surface of the wiring board among the conductive patterns of the wiring board, a semiconductor element mounted on the first surface of the wiring board through the first bumps, an encapsulating resin encapsulating the semiconductor element and at least a portion of a side surface of the wiring board, the side surface of the wiring board extending between the first surface and second surface of the wiring board, and multiple of second bumps formed on the second surface of the wiring board and connected to a second conductive pattern of the conductive patterns in the wiring board.Type: ApplicationFiled: May 22, 2015Publication date: September 10, 2015Applicant: IBIDEN CO., LTD.Inventors: Toshiki FURUTANI, Daiki KOMATSU, Nobuya TAKAHASHI
-
Publication number: 20150245492Abstract: A multilayer wiring board with built-in electronic components includes a substrate including an insulating material and having multiple opening portions, a first conductor layer formed on a surface of the substrate and having an opening portion such that the substrate has the opening portions inside the opening portion of the first conductor layer, multiple electronic components positioned in the opening portions of the substrate, and an insulating layer formed on the substrate such that the insulating layer is formed on the electronic components and on the first conductor layer. The opening portions are formed in the substrate such that the opening portions include two opening portions and that the substrate has a partition wall formed between the two opening portions.Type: ApplicationFiled: February 19, 2015Publication date: August 27, 2015Applicant: IBIDEN CO., LTD.Inventors: Toyotaka SHIMABE, Toshiki Furutani, Shunsuke Sakai
-
Patent number: 9119322Abstract: A wiring board includes a substrate having an opening portion, electronic components positioned in the opening portion of the substrate and including first and second electronic components, and an insulation layer formed over the substrate and the first and second components. The first component has first and second electrodes having side portions on side surfaces of the first component, the second component has first and second electrodes having side portions on side surfaces of the second component, the first electrode of the first component and the first electrode of the second component are set to have substantially the same electric potential, and the first component and the second component are positioned in the opening portion of the substrate such that the side portion of the first electrode of the first component is beside the side portion of the first electrode of the second component.Type: GrantFiled: October 9, 2014Date of Patent: August 25, 2015Assignee: IBIDEN CO., LTD.Inventors: Yukinobu Mikado, Shunsuke Sakai, Takashi Kariya, Toshiki Furutani
-
Patent number: 9059187Abstract: An electronic component including a wiring board having interlayer insulation layers and conductive patterns, the wiring board having a first surface and a second surface on the opposite side of the first surface, multiple first bumps formed on a first conductive pattern positioned on the first surface of the wiring board among the conductive patterns of the wiring board, a semiconductor element mounted on the first surface of the wiring board through the first bumps, an encapsulating resin encapsulating the semiconductor element and at least a portion of a side surface of the wiring board, the side surface of the wiring board extending between the first surface and second surface of the wiring board, and multiple of second bumps formed on the second surface of the wiring board and connected to a second conductive pattern of the conductive patterns in the wiring board.Type: GrantFiled: August 22, 2011Date of Patent: June 16, 2015Assignee: IBIDEN CO., LTD.Inventors: Toshiki Furutani, Daiki Komatsu, Nobuya Takahashi
-
Publication number: 20150163919Abstract: A substrate having a built-in electronic component includes an insulating substrate having an opening portion, a conductor pattern formed on the substrate, an electronic component accommodated in the opening portion of the substrate and having a terminal, an insulating layer formed on the substrate such that the insulating layer is covering the pattern and the component in the substrate, and multiple via conductors penetrating through the insulating layer and including a first via conductor reaching to the pattern on the substrate and a second via conductor reaching to the terminal of the component in the substrate. The pattern has a recessed connecting portion connected to the first via conductor, the terminal of the component has a recessed connecting portion connected to the second via conductor, and the recessed connecting portion of the pattern has depth which is greater than depth of the recessed connecting portion of the terminal.Type: ApplicationFiled: December 10, 2014Publication date: June 11, 2015Applicant: IBIDEN CO., LTD.Inventors: Hisayuki NAKAGOME, Toshiki Furutani
-
Patent number: 8975742Abstract: A printed wiring board includes a substrate, a first buildup formed on a first surface of the substrate and including the outermost conductive layer, and a second buildup layer formed on a second surface of the substrate and including the outermost conductive layer. The outermost layer of the first buildup has pads positioned to connect a semiconductor component, the first buildup has a component mounting region directly under the component such that the outermost layer of the first buildup has a portion in the region, the outermost layer of the second buildup has a portion directly under the region, and the portions satisfy the ratio in the range of from 1.1 to 1.35, where the ratio is obtained by dividing a planar area of the portion of the second buildup by a planar area of the portion of the first buildup.Type: GrantFiled: August 30, 2012Date of Patent: March 10, 2015Assignee: IBIDEN Co., Ltd.Inventors: Toshiki Furutani, Takeshi Furusawa
-
Patent number: 8971053Abstract: A wiring board includes a first substrate having a penetrating hole penetrating through the first substrate, a built-up layer formed on a surface of the first substrate and including interlayer resin insulation layers and wiring layers, the built-up layer having an opening portion communicated with the penetrating hole of the first substrate and opened to the outermost surface of the built-up layer, an interposer accommodated in the opening portion of the built-up layer and including a second substrate and a wiring layer formed on the second substrate, the wiring layer of the interposer including conductive circuits for being connected to semiconductor elements, a filler filling the opening portion such that the interposer is held in the opening portion of the built-up layer, and mounting pads formed on the first substrate and positioned to mount the semiconductor elements. The mounting pads are positioned to form a matrix on the first substrate.Type: GrantFiled: January 22, 2014Date of Patent: March 3, 2015Assignee: Ibiden Co., Ltd.Inventors: Takashi Kariya, Toshiki Furutani
-
Patent number: 8957320Abstract: A printed wiring board includes a substrate having an accommodation section having multiple opening portions, multiple electronic components accommodated in the opening portions, respectively, a filler resin provided in the opening portions in the substrate such that the electronic components are secured in the opening portions in the substrate, a resin insulation layer formed over the substrate and the electronic components, a conductive layer formed on the resin insulation layer, and via conductors formed in the resin insulation layer and connecting the conductive layer and the electronic components. The opening portions are connected to each other.Type: GrantFiled: July 26, 2012Date of Patent: February 17, 2015Assignee: Ibiden Co., Ltd.Inventors: Toshiki Furutani, Yukinobu Mikado, Shunsuke Sakai, Yusuke Tanaka
-
Patent number: 8952507Abstract: A wiring board includes a substrate having a cavity, and an electronic component accommodated in the cavity of the substrate. The substrate has a thickness which is greater than a thickness of the electronic component such that a ratio of the thickness of the substrate to the thickness of the electronic component is set in a range of 0.3 or greater and 0.7 or less.Type: GrantFiled: August 9, 2013Date of Patent: February 10, 2015Assignee: Ibiden Co., Ltd.Inventors: Toyotaka Shimabe, Keisuke Shimizu, Toshiki Furutani
-
Publication number: 20150022982Abstract: A wiring board includes a substrate having an opening portion, electronic components positioned in the opening portion of the substrate and including first and second electronic components, and an insulation layer formed over the substrate and the first and second components. The first component has first and second electrodes having side portions on side surfaces of the first component, the second component has first and second electrodes having side portions on side surfaces of the second component, the first electrode of the first component and the first electrode of the second component are set to have substantially the same electric potential, and the first component and the second component are positioned in the opening portion of the substrate such that the side portion of the first electrode of the first component is beside the side portion of the first electrode of the second component.Type: ApplicationFiled: October 9, 2014Publication date: January 22, 2015Applicant: IBIDEN CO., LTD.Inventors: Yukinobu MIKADO, Shunsuke Sakai, Takashi Kariya, Toshiki Furutani
-
Publication number: 20150016079Abstract: A wiring board includes a first resin insulation layer, an electronic component positioned on first surface of the first insulation layer, a second resin insulation layer formed on the first surface of the first insulation layer such that the second insulation layer is embedding the electronic component, a conductive layer formed on the second insulation layer, a third resin insulation layer formed on the conductive layer and second insulation layer, and a connection via conductor formed in the second insulation layer such that the connection via conductor is connecting electrode of the electronic component and conductive layer on the second insulation layer. The first insulation layer has a pad structure on second surface side of the first insulation layer on opposite side of the first surface, and the first insulation layer has coefficient of thermal expansion set lower than coefficients of thermal expansion of the second and third insulation layers.Type: ApplicationFiled: July 11, 2014Publication date: January 15, 2015Applicant: IBIDEN CO., LTD.Inventors: Toshiki FURUTANI, Takeshi FURUSAWA, Keisuke SHIMIZU, Yuichi NAKAMURA
-
Patent number: 8923008Abstract: A circuit board includes an insulation layer having a first surface and a second surface on the opposite side of the first surface, an electronic component positioned in the insulation layer and having a terminal, a conductive pattern formed on the second surface of the insulation layer and electrically connected to the terminal, and an insulative film formed on the second surface of the insulation layer and on the conductive pattern. The terminal of the electronic component has a protruding portion which protrudes from the second surface of the insulation layer.Type: GrantFiled: February 24, 2012Date of Patent: December 30, 2014Assignee: Ibiden Co., Ltd.Inventors: Kazuhiro Yoshikawa, Toshiki Furutani