Abstract: Provided is a method of manufacturing a multilayer wiring board, in which electrical inspection can be performed with accurate probing while warpage of a multilayer laminate is reduced. This method includes providing a laminated sheet including a first support, a first release layer and a metal layer; alternately stacking wiring layers and insulating layers on a surface of the metal layer, wherein an n-th wiring layer being the uppermost layer includes an n-th connection pad; bonding a second support having an opening on a surface, remote from the laminated sheet, of the multilayer laminate with a second release layer therebetween such that at least a part of the n-th connection pad is disposed within the opening; releasing the first support from the reinforced multilayer laminate at the first release layer; and putting conductors into contact with the n-th connection pads of the reinforced multilayer laminate to perform electrical inspection.

Abstract: Provided is an adhesive sheet including a substrate sheet and a soluble adhesive layer with an island or stripe pattern disposed on at least one surface of the substrate sheet, wherein each adhesive region has a circumscribed circle diameter of 0.1 mm to 10 mm for the island pattern, or has a stripe width of 0.1 mm to 10 mm for the stripe pattern. This adhesive sheet can retain an adhesive force of the adhesive layer until just before releasing and can be readily released from the adherend at any time without applying of excessive stress to the adherend.

Abstract: There is provided a high gloss electrodeposited copper foil which can be manufactured in a short time. The electrodeposited copper foil has a fraction of the areas occupied by the {100} plane deviating by 18° or less from the <001> crystal orientation of 10% or more determined by analysis of the surface by electron backscatter diffraction (EBSD) and at least one surface of the electrodeposited copper foil has a glossiness Gs (20°) of 1,500 or more, determined in accordance with JIS Z 8741-1997.

Abstract: There is provided a metal foil suitable for an electrode substrate for an electronic element, which makes it possible to suppress oxidation of the ultra-smooth surface and also prevent roll scratches when wound in a roll. The metal foil of the present invention is made of copper or copper alloy. The front surface of the metal foil has an ultra-smooth surface profile having an arithmetic mean roughness Ra of 30 nm or less as determined in accordance with JIS B 0601-2001. The back surface of the metal has a concave-dominant surface profile having a Pv/Pp ratio of 1.5 or more, the Pv/Pp ratio being a ratio of a maximum profile valley depth Pv to a maximum profile peak height Pp of a profile curve as determined in a rectangular area of 181 ?m by 136 ?m in accordance with JIS B 0601-2001.

Abstract: There is provided an electrode foil that can form an organic electroluminescent device having a high external quantum efficiency despite the presence of the organic nitrogen compound at the interface of a metal foil and a reflective layer. The electrode foil of the invention includes a metal foil made of copper or copper alloy and a reflective layer provided on at least one surface of the metal foil. The electrode foil has an organic nitrogen compound at the interface between the metal foil and the reflective layer in such an amount that the ratio of the number of counts on the C—N bond to the total number of counts on the copper and the C—N bond: CN/(CN+Cu) in the organic nitrogen compound is 0.4 or less determined by time-of-flight secondary ion mass spectrometric analysis (TOF-SIMS) of the interface.

Abstract: There is provided a high gloss electrodeposited copper foil which can be manufactured in a short time.

Abstract: There is provided an electrode foil that can form an organic electroluminescent device having a high external quantum efficiency despite the presence of the organic nitrogen compound at the interface of a metal foil and a reflective layer. The electrode foil of the invention includes a metal foil made of copper or copper alloy and a reflective layer provided on at least one surface of the metal foil. The electrode foil has an organic nitrogen compound at the interface between the metal foil and the reflective layer in such an amount that the ratio of the number of counts on the C—N bond to the total number of counts on the copper and the C—N bond: CN/(CN+Cu) in the organic nitrogen compound is 0.4 or less determined by time-of-flight secondary ion mass spectrometric analysis (TOF-SIMS) of the interface.

Abstract: There is provided a metal foil suitable for an electrode substrate for an electronic element, which makes it possible to suppress oxidation of the ultra-smooth surface and also prevent roll scratches when wound in a roll. The metal foil of the present invention is made of copper or copper alloy. The front surface of the metal foil has an ultra-smooth surface profile having an arithmetic mean roughness Ra of 30 nm or less as determined in accordance with JIS B 0601-2001. The back surface of the metal has a concave-dominant surface profile having a Pv/Pp ratio of 1.5 or more, the Pv/Pp ratio being a ratio of a maximum profile valley depth Pv to a maximum profile peak height Pp of a profile curve as determined in a rectangular area of 181 ?m by 136 ?m in accordance with JIS B 0601-2001.

Abstract: There is provided an electrode foil, which can show superior light scattering, while preventing short circuit between electrodes. The electrode foil of the present invention comprises a metal foil having a thickness of from 1 ?m to 250 ?m, wherein the electrode foil comprises, on at least one outermost surface thereof, a light-scattering surface having a Pv/Pp ratio of 2.0 or higher, wherein the Pv/Pp ratio is a ratio of a maximum profile valley depth Pv of a profile curve to a maximum profile peak height Pp of the profile curve as measured in a rectangular area of 181 ?m×136 ?m in accordance with JIS B 0601-2001.

Abstract: An electrode foil functioning as both a supporting substrate and an electrode and suitable for low-cost high-efficiency production of flexible electronic devices having functionality on their both sides is provided. An electrode foil of the present invention comprises a metal foil, wherein the metal foil has a thickness of 1 to 250 ?m, and wherein the outermost surfaces on both sides of the electrode foil are ultra-smooth surfaces each having an arithmetic mean roughness Ra of 30.0 nm or less as determined in accordance with JIS B 0601-2001.

Abstract: There is provided an electrode foil, which can show superior light scattering, while preventing short circuit between electrodes. The electrode foil of the present invention comprises a metal foil having a thickness of from 1 ?m to 250 ?m, wherein the electrode foil comprises, on at least one outermost surface thereof, a light-scattering surface having a Pv/Pp ratio of 2.0 or higher, wherein the Pv/Pp ratio is a ratio of a maximum profile valley depth Pv of a profile curve to a maximum profile peak height Pp of the profile curve as measured in a rectangular area of 181 ?m×136 ?m in accordance with JIS B 0601-2001.

Abstract: According to one embodiment, a semiconductor device includes a semiconductor substrate, an inter-layer insulating film, a wiring, and a via. The inter-layer insulating film is provided on the semiconductor substrate. The wiring is provided in the inter-layer insulating film. The via is provided in the inter-layer insulating film. Inside the inter-layer insulating film in a circumferential region around a device region, a vertical structure body is formed in which the wiring and the via are vertically connected. At least in an upper portion inside the inter-layer insulating film in an edge region located around the circumferential region and constituting an outer edge portion, no vertical structure body is formed in which the wiring and the via are vertically connected.

Abstract: Provided is a lead frame, an electronic device provided with a lead frame, a method of producing a lead frame, and a method of producing an electronic device provided with a lead frame that has been produced by the method of producing a lead frame, in which a lead frame is not corroded, a mechanical strength of the lead frame is not lowered, it is not necessary to carry out the conventional plating processing steps composed of two stages, the processes are simple, a cost is lower, and a large amount of waste liquid such as plating processing liquid is not generated, thereby preventing an environment from being affected. The lead frame includes an outer lead part and an inner lead part, and plating is carried out on at least a part of one or both of the outer lead part or the inner lead part.

Abstract: According to one embodiment, a semiconductor device includes a semiconductor substrate, an inter-layer insulating film, a wiring, and a via. The inter-layer insulating film is provided on the semiconductor substrate. The wiring is provided in the inter-layer insulating film. The via is provided in the inter-layer insulating film. Inside the inter-layer insulating film in a circumferential region around a device region, a vertical structure body is formed in which the wiring and the via are vertically connected. At least in an upper portion inside the inter-layer insulating film in an edge region located around the circumferential region and constituting an outer edge portion, no vertical structure body is formed in which the wiring and the via are vertically connected.

Abstract: Provided is a detection unit mold package (2A), which is equipped with plate-shaped protrusions (21P and 22P) to contact an object liquid so as to exchange the heat with the object liquid. The plate-shaped protrusions (21P and 22P) are formed by sealing a liquid-kind detecting unit (21a) and a liquid-temperature detecting unit (22a), which are made of thin-film chips containing at least temperature-sensitive elements, and metallic die pads (21c and 22c) having those detecting units joined thereto, with a sealing material (23), so that they may not be exposed to the surface. The plate-shaped protrusions (21P and 22P) have their two principal planes in parallel with the metallic die pads (21c and 22c).

Abstract: On an upper surface of a container body, there are disposed at least a base portion of a concentration meter configured to detect the concentration of a liquid reducing agent based on a heat transmission characteristic between two spaced points, and a heat exchanger configured to permit the engine coolant to circulate therein and arranged to surround a detecting section of the concentration meter, which hangs from the base portion of the concentration meter via a supporting column thereof, to thereby perform the heat exchange with the liquid reducing agent, and also, a protector or an encasing element of substantially box shape is arranged to surround a lower portion of the heat exchanger and the detecting section of the concentration meter, and further, a visor is attached on the supporting column of the concentration meter, which is positioned above the protector by a predetermined interval.

Abstract: A device for detecting leakage of liquid in a tank, capable of detecting the leakage at high accuracy and sensitivity for a wide range of a leakage quantity. A flow rate sensor section attached to a measurement fine tube (13b) includes temperature sensors (133, 134) and an indirectly heated sensor (135). A leakage detection control section connected to a pressure sensor (137) for measuring a liquid level and to the flow rate sensor section has a voltage generation circuit (67) for applying a voltage to a heater (163) of the indirectly heated sensor, a first leakage detection circuit (71), and a second leakage detection circuit for generating an output corresponding to temperature sensed by the indirectly heated sensor (135).

Abstract: A leak detecting system includes a leak detector that detects leakage of liquid stored in a tank based on fluctuation in a level of the liquid. The leak detector includes a liquid inlet/outlet portion through which the liquid in the tank flows in and out, a flow-rate measuring unit configured to measure an amount of flow of the liquid inside the leak detector, and a liquid retaining portion configured to retain liquid flowing therein through the liquid inlet/outlet portion. A lower end of the leak detector is detachably attached to a bottom plate of the tank, and an upper end of the leak detector is supported in a gauging port in a top plate in such a manner that the leak detector is movable in a vertical direction.