Abstract: To keep printing quality uniform and to improve productivity, while maintaining a heating efficiency and a strength against an external load, provided is a thermal head manufacturing method including: a concave portion forming step of forming a concave portion on one face of a supporting substrate; an upper substrate forming step of forming an upper substrate in which an etching layer and a non-etching layer are arranged in layers in a substrate thickness direction, the etching layer being etched at a predetermined etching rate, the non-etching layer being lower in etching rate than the etching layer; a bonding step of bonding the one face of the supporting substrate in which the concave portion has been formed in the concave portion forming step to a surface on a side of the non-etching layer of the upper substrate; a thinning step of etching the etching layer of the upper substrate which has been bonded to the supporting substrate in the bonding step; and a heating resistor forming step of forming a heating

Abstract: To improve print quality, a plurality of heating resistors (14) are arranged with spaces therebetween on a heat storage layer (13) laminated on a surface of a supporting substrate (11) via an adhesive layer (12) made of an elastic material. A cavity portion (19) is formed at a region between the supporting substrate (11) and the heat storage layer (13), the region being opposed to a heat generating portion of each of the plurality of heating resistors (14). The elastic material constituting the adhesive layer (12) is arranged so that the elastic material is in a bonded state with respect to at least a part of a surface of the heat storage layer (13) opposed to the cavity portion (19).

Abstract: To improve heat generating efficiency and printing quality, a plurality of heating resistors (14) are arranged with spaces therebetween on a heat storage layer (13) laminated on a surface of a supporting substrate (11) via an adhesive layer (12) made of an elastic material. A cavity section (19) is formed at a region between the supporting substrate (11) and the heat storage layer (13), the region being opposed to a heat generating portion of each of the plurality of heating resistors (14). The cavity section (19) includes a concave portion (20) formed in the surface of the supporting substrate (11) and the heat storage layer (13) in which the concave portion (20) is closed and the surface thereof is exposed to the cavity section (19).

Abstract: To improve heating efficiency and printing quality, a heating resistor element component (4) includes a plurality of heating resistors (14) arranged with intervals on a heat storage layer (13) laminated on a supporting substrate (11) through an intermediation of an adhesive layer (12), in which: the adhesive layer (12) includes an adhesive (12a) for bonding one surface of the supporting substrate (11) and another surface of the heat storage layer (13), and a plurality of gap members (12b) kneaded in the adhesive (12a), for keeping a distance between the one surface of the supporting substrate (11) and the another surface of the heat storage layer (13) constant; and a cavity portion (19) is formed in a region of the adhesive layer (12), the region being opposed to a heating portion of the heating resistor (14).

Abstract: Provided is a manufacturing method for a thermal head, which enables to manufacture a thermal head having high heating efficiency and stable quality.

Abstract: To provide a thermal head and a printer which realize improved heating efficiency and improved strength, and to manufacture the thermal head stably, provided is a thermal head manufacturing method including: a concave portion forming step of forming a concave portion on one surface of a supporting substrate; a bonding step of bonding a thin plate glass shaped like a substantially flat board, to the one surface of the supporting substrate where the concave portion has been formed in the concave portion forming step, in a manner that hermetically seals the concave portion and forms a hollow portion; a heating step of heating the supporting substrate and the thin plate glass which have been bonded together in the bonding step, to thereby soften the thin plate glass and expand gas trapped inside the hollow portion; and a heating resistor forming step of forming a heating resistor on the thin plate glass so as to be opposed to the hollow portion, wherein the heating step concavely curves a surface of the thin plat

Abstract: Provided is a manufacturing method for a thermal head, which includes: a concave portion forming step of forming a plurality of concave portions on a surface of a collective substrate; a bonding step of thermally fusion bonding an insulating film to the surface of the collective substrate including the plurality of concave portions formed thereon in the concave portion forming step; and a heating resistor forming step of forming a plurality of heating resistors on the insulating film so as to be opposed to the plurality of concave portions, in which the concave portion forming step includes setting any one of the plurality of concave portions as a reference, and setting sizes of the plurality of concave portions other than the any one of the plurality of concave portions so as to become larger as a distance from the any one thereof increases.

Abstract: In order to provide a manufacturing method for a heating resistor element component, with which an insulating film (undercoat) can be easily handled, damage caused in the insulating film can be reduced, and a high yield can be ensured, the manufacturing method comprises the steps of: processing, on a surface of a supporting substrate (2), a plurality of concave portions (8) each forming a hollow portion (7) at intervals; processing, on the surface of the supporting substrate (2), a concave part (10) for each region straddling the plurality of concave portions (8) in an arrangement direction of the concave portions (8); placing an insulating film (3) made of sheet glass in each concave part (10); and bonding the insulating film (3) to the supporting substrate (2).

Abstract: Provided is a heating resistance element component, including: a supporting substrate; an insulating film laminated on the supporting substrate; a plurality of heating resistors formed on the insulating film, the plurality of heating resistors being arranged in a zigzag shape along a main scanning direction and having a substantially square shape; a common wire connected to one end of each of the plurality of heating resistors; individual wires each connected to another end of the each of the plurality of heating resistors; and concave portions formed in regions which are opposed to the plurality of heating resistors and are located on a surface of the supporting substrate, in which an arrangement pitch of the plurality of heating resistors in a sub-scanning direction is larger than an arrangement pitch of the plurality of heating resistors in a main scanning direction.

Abstract: To reduce a plate thickness of an insulating film, a heating resistor element component is provided, which includes: a supporting substrate; an insulating film disposed on a surface of the supporting substrate; a plurality of heating resistors arranged at intervals on the insulating film; a common wire connected to one end of each of the plurality of heating resistors; and individual wires each connected to another end of each of the plurality of heating resistors, in which: the surface of the supporting substrate is provided with a concave portion in a region thereof, the region being opposed to heating portions of the plurality of heating resistors; and when the insulating film is superimposed on the supporting substrate, the insulating film includes a heterogeneous phase formed through irradiation of a phemtosecond laser at least in a region thereof, the region being opposed to the concave portion.

Abstract: Provided is a heating resistor element (1), including: an insulating substrate (9); a heat accumulating layer (10) bonded to a surface of the insulating substrate (9); and a heating resistor (11) provided on the heat accumulating layer (10), in which: on at least one of bonded surfaces (9a) between the insulating substrate (9) and the heat accumulating layer (10), at least one of the insulating substrate (9) and the heat accumulating layer (10) is provided with a concave portion (16) in a region opposed to the heating resistor (11) to form a hollow portion (17); and the hollow portion (17) includes an inner surface on a side of the insulating substrate (9), the inner surface being processed to have surface roughness (Ra) of 0.2 ?m or more. Accordingly, heat accumulation in a gas of the hollow portion (17) can be suppressed to improve printing quality.

Abstract: Provided is a heating resistor element, including: an insulating substrate (9); a heat accumulating layer (10) bonded to a surface of the insulating substrate (9); and a heating resistor (11) provided on the heat accumulating layer (10), in which: on at least one of bonded surfaces between the heating substrate (9) and the heat accumulating layer (10), at least one of the insulating substrate (9) and the heat accumulating layer (10) is provided with a concave portion (16) in a region opposed to the heating resistor (11) to form a hollow portion (17); and the concave portion (16) has a curvature radius of 10 ?m or more at each corner thereof. Accordingly, occurrence of stress concentration caused by heat or a load can be suppressed to improve durability, and both a sufficient strength and heating efficiency are realized.

Abstract: Provided is a heating resistor element including: an insulating substrate including a glass material; a heat accumulating layer bonded to the insulating substrate through heating to temperature ranging from an annealing point to a softening point in a state of being adhered to a surface of the insulating substrate, and including the same material as the glass material of the insulating substrate; and a heating resistor provided on the heat accumulating layer, in which, on at least one of bonded surfaces between the insulating substrate and the heat accumulating layer, at least one of the insulating substrate and the heat accumulating layer is provided with a concave portion in a region opposed to the heating resistor to form a hollow portion. Accordingly, deformation caused by a difference in coefficient of thermal expansion is suppressed to improve printing quality.

Abstract: A thermal head is structured to have a substrate, a thermal storage layer formed on one surface of the substrate and made of glass, and heating resistors provided on the thermal storage layer. A plurality of hollow portions are formed at a position spaced apart from a surface where the heating resistors are formed by laser processing using a femtosecond laser, in an area of the thermal storage layer which is opposed to the heating resistors. In this way, to provide a heating resistance element for improving heating efficiency of heating resistors to reduce power consumption, improving strength of a substrate under the heating resistors, and for enabling simple manufacture at a low cost, a thermal head and a printer using the same, and a method of manufacturing a heating resistance element.

Abstract: Provided is a heating resistance element component, including: a supporting substrate; an insulating film laminated on the supporting substrate; a plurality of heating resistors arranged at intervals on the insulating film; a common wire connected to one end of each of the plurality of heating resistors; and individual wires each connected to another end of the each of the plurality of heating resistors, in which a surface of the supporting substrate is formed with a first concave portion and a second concave portion, the first concave portion being arranged in a region opposed to heating portions of the plurality of heating resistors, the second concave portion being arranged at an interval in a vicinity of the first concave portion. Accordingly, heating efficiency of the heating resistors can be increased to reduce power consumption, and a strength of the substrate under the heating resistors can be increased.

Abstract: A thermal head is structured to have a substrate, a thermal storage layer formed on one surface of the substrate and made of glass, and heating resistors provided on the thermal storage layer. A plurality of hollow portions are formed at a position spaced apart from a surface where the heating resistors are formed by laser processing using a femtosecond laser, in an area of the thermal storage layer which is opposed to the heating resistors. In this way, to provide a heating resistance element for improving heating efficiency of heating resistors to reduce power consumption, improving strength of a substrate under the heating resistors, and for enabling simple manufacture at a low cost, a thermal head and a printer using the same, and a method of manufacturing a heating resistance element.

Abstract: A radiation detector comprises an energy/electricity converter having a detection area for detecting incident radiation, and electrodes connecting the converter to an external driving circuit for driving the converter to convert energy of the incident radiation detected by the detection area of the converter into an electric signal. A collimator is integrally connected to the converter and has an opening for transmitting radiation to irradiate the detection area of the converter and portions for preventing radiation from irradiating a part of the converter other than the detection area. A spacer is integrally connected to the collimator and the converter for maintaining a preselected distance between the collimator and the detection area of the converter.

Abstract: A superconducting radiation detector relies upon the abruptness of a superconducting transition edge to converts a slight heat generated by an X-ray into a high signal current and uses an electrothermal self-feedback mechanism to provide a high energy resolution and a high counting rate. A calorimeter incorporating such a radiation detector has an absorber for absorbing X-rays, a resistor formed of a superconductor provided under the absorber and having a resistance value that varies with heat generated in the absorber, superconducting wires for connecting the resistor to an external current detector, a membrane on which the resistor is provided, and an insulating film provided between the resistor and the absorber and having at least one hole penetrating therethrough, the resistor and the absorber being in contact through the hole.

Abstract: It is an object to obtain a calorimeter characterized by excellent mechanical strength, and a manufacturing method thereof, when a plurality of calorimeters are arranged inside a single substrate. The calorimeter has an absorbent for converting energy of radioactive rays into heat and a resistor for converting heat into an electrical signal using superconductive transition are arranged on a membrane for determining thermal conductivity with the membrane being attached to a substrate, the substrate having a tri-layer structure comprising an etching layer, an etching stop layer and a support substrate, the membrane being arranged separated by the thickness of the etching stop layer and the etching layer.

Abstract: The present invention is intended to provide a calorimeter for converting a quite small amount of heat into an electrical signal, especially a radiation detector providing improved energy resolution and count rate, by using a superconducting transition edge. The calorimeter has an absorber for absorbing radiation and producing heat. This absorber is formed on a resistor whose resistance value is varied by the heat. The resistor is formed on a membrane that controls escape of the heat. The calorimeter is characterized in that it is further fitted with a heat dissipation device for letting active electrons produced in the calorimeter escape to the outside.