Abstract: Bending deformation exceeding a yield stress is applied by winding a material on a mandrel. Coiling is performed simultaneously with the application of the bending deformation, and the load is removed after the coiling. This spring includes an outside surface region having a compressive residual stress and a compressive stress reduction region in which the compressive residual stress is reduced from the outside surface region toward the center of the material. A stress change portion at which a change from the compressive residual stress to a tensile residual stress occurs exists between the outside surface region and the center of the material. The spring further includes a tensile stress peak portion, tensile stress reduction region, and inside surface region. The inside surface region has the tensile compressive residual stress having an absolute value smaller than that of the outside surface region.

Abstract: Bending deformation exceeding a yield stress is applied by winding a material on a mandrel. Coiling is performed simultaneously with the application of the bending deformation, and the load is removed after the coiling. This spring includes an outside surface region having a compressive residual stress and a compressive stress reduction region in which the compressive residual stress is reduced from the outside surface region toward the center of the material. A stress change portion at which a change from the compressive residual stress to a tensile residual stress occurs exists between the outside surface region and the center of the material. The spring further includes a tensile stress peak portion, tensile stress reduction region, and inside surface region. The inside surface region has the tensile compressive residual stress having an absolute value smaller than that of the outside surface region.

Abstract: A compression coil spring device suitable for use in a strut wheel suspension system. The device includes a coil wire wound into a coil having an end turn. The end turn of the coil, and only the end turn of the coil, is provided with a plurality of projections along the length thereof, with the remainder of the coil wire being substantially free of projections.

Abstract: In a compression coil spring device, suitable for use in a strut wheel suspension system, including a coil wire wound into a coil having an end turn, the end turn is adapted to be supported by a spring seat at one or a plurality of discrete points. This can be accomplished either by providing a plurality of projections on the coil wire along the length of the coil wire of the end turn, with the remainder of the coil wire being substantially free of projections, or by providing a plurality of projections for supporting the end turn at one or a plurality of discrete points of the spring seat. Thus, the spring demonstrates the same property with regard to the centroid of contact pressure or line of action of the spring force, and the spring constant, without regard to the spring load as long as the spring end is supported by the same discrete contact point or points.

Abstract: A semiconductor element has a circuit formation surface on which electrode terminals are arranged in a peripheral part thereof. The semiconductor element is encapsulated by a mold resin on a substrate which has openings at positions corresponding to the electrodes of the semiconductor element. The semiconductor element is mounted to the substrate in a state where the circuit formation surface faces the substrate and the electrode terminals are positioned at the openings and a back surface opposite to the circuit formation surface of the semiconductor element is exposed from the mold resin. A heat-emitting member formed of a metal plate is provided on a surface of the substrate opposite to a surface on which the semiconductor element is mounted. The surface of the heat-emitting member being exposed from the mold resin.

Abstract: A semiconductor element has a circuit formation surface on which electrode terminals are arranged in a peripheral part thereof. The semiconductor element is encapsulated by a mold resin on a substrate which has openings at positions corresponding to the electrodes of the semiconductor element. The semiconductor element is mounted to the substrate in a state where the circuit formation surface faces the substrate and the electrode terminals are positioned at the openings and a back surface opposite to the circuit formation surface of the semiconductor element is exposed from the mold resin. A heat-emitting member formed of a metal plate is provided on a surface of the substrate opposite to a surface on which the semiconductor element is mounted. The surface of the heat-emitting member being exposed from the mold resin.

Abstract: In a compression coil spring device, suitable for use in a strut wheel suspension system, including a coil wire wound into a coil having an end turn, the end turn is adapted to be supported by a spring seat at one or a plurality of discrete points. This can be accomplished either by providing a plurality of projections on the coil wire along the length of the coil wire of the end turn or by providing a plurality of projections for supporting the end turn at one or a plurality of discrete points of the spring seat. Thus, the spring demonstrates a same property with regard to the centroid of contact pressure or line of action of the spring force, and the spring constant without regard to the spring load as long as the spring end is supported by the same discrete contact point or points.

Abstract: A semiconductor module includes a plurality of semiconductor devices each including a circuit substrate carrying thereon a single memory semiconductor chip and a socket for holding the semiconductor devices detachably.

Abstract: A semiconductor element has a circuit formation surface on which electrode terminals are arranged in a peripheral part thereof. The semiconductor element is encapsulated by a mold resin on a substrate which has openings at positions corresponding to the electrodes of the semiconductor element. The semiconductor element is mounted to the substrate in a state where the circuit formation surface faces the substrate and the electrode terminals are positioned at the openings and a back surface opposite to the circuit formation surface of the semiconductor element is exposed from the mold resin. A heat-emitting member formed of a metal plate is provided on a surface of the substrate opposite to a surface on which the semiconductor element is mounted. The surface of the heat-emitting member being exposed from the mold resin.

Abstract: A plurality of semiconductor chips are incorporated in a one-piece package so as to substantially increase a mounting area of a semiconductor device so that the semiconductor device can be provided with the projection electrodes having a structure which enable the semiconductor device to be mounted by a conventional surface mounting technique. A redistribution layer interconnects and integrally holds the plurality of semiconductor elements. A plurality of projection electrodes are provided on the redistribution layer for surface mounting. The plurality of semiconductor chips are rendered to be different kinds so that the plurality of different kinds of semiconductor chips together provide a complete function. The plurality of semiconductor chips may be rendered to be the same kind so as to reduce a mounting area of the semiconductor chips as a whole.

Abstract: A semiconductor module includes a plurality of semiconductor devices each including a circuit substrate carrying thereon a single memory semiconductor chip and a socket for holding the semiconductor devices detachably.

Abstract: A semiconductor module includes a plurality of semiconductor devices each including a circuit substrate carrying thereon a single memory semiconductor chip and a socket for holding the semiconductor devices detachably.

Abstract: A method of producing a semiconductor device includes a device body producing step, electrically coupling leads and a semiconductor chip, and producing a device body by encapsulating the semiconductor chip by a resin package so that portions of the leads are exposed from the resin package, a honing step, carrying out a honing process using a polishing solution at least with respect to a resin flash adhered on the portions of the leads exposed from the resin package, an etching step, removing an unwanted stacked layer structure formed on the leads by carrying out an etching process after the honing step, and a plating step, carrying out a plating process with respect to the leads after the etching step to form a plated layer made of a soft bonding material. The honing step removes a portion of the unwanted stacked layer structure in addition to the resin flash.

Abstract: Provided is a wheel suspension system (4) and a spring (6, 16, 26) therefor which can improve the ride comfort of the vehicle by reducing the sliding resistance between the cylinder and the piston of the tubular shock absorber (5) surrounded by the compression coil spring without increasing the size of the suspension system and without complicating the assembly work. The compression coil spring is adapted to produce lateral forces between two ends thereof as the compression coil spring is extended and compressed by forming the coil spring so as to have cyclically varying pitch angle for each turn of the coil wire.

Abstract: A semiconductor device includes a resin package in which a semiconductor chip is sealed, the resin package having a first surface and a second surface opposite to the first surface; a plurality of leads having inner lead parts connected to the semiconductor chip and outer lead parts extending outside the resin package, the outer lead parts being bent along the shape of the resin package so as to form first terminal parts on the second surface and second terminal parts on the first surface; connection means electrically connecting the semiconductor chip and the leads; and a positioning mechanism provided either on the leads or on the resin package, which positions the outer lead parts by engaging a part of the outer lead parts to the resin package. Further, at least one of the leads and/or connection means is cut so as to electrically disconnect the semiconductor chip and the one of the leads and/or connection elements.

Abstract: A plurality of semiconductor chips are incorporated in a one-piece package so as to substantially increase a mounting area of a semiconductor device so that the semiconductor device can be provided with the projection electrodes having a structure which enable the semiconductor device to be mounted by a conventional surface mounting technique. A redistribution layer interconnects and integrally holds the plurality of semiconductor elements. A plurality of projection electrodes are provided on the redistribution layer for surface mounting. The plurality of semiconductor chips are rendered to be different kinds so that the plurality of different kinds of semiconductor chips together provide a complete function. The plurality of semiconductor chips may be rendered to be the same kind so as to reduce a mounting area of the semiconductor chips as a whole.

Abstract: A plurality of semiconductor chips are incorporated in a one-piece package so as to substantially increase a mounting area of a semiconductor device so that the semiconductor device can be provided with the projection electrodes having a structure which enable the semiconductor device to be mounted by a conventional surface mounting technique. A redistribution layer interconnects and integrally holds the plurality of semiconductor elements. A plurality of projection electrodes are provided on the redistribution layer for surface mounting. The plurality of semiconductor chips are rendered to be different kinds so that the plurality of different kinds of semiconductor chips together provide a complete function. The plurality of semiconductor chips may be rendered to be the same kind so as to reduce a mounting area of the semiconductor chips as a whole.

Abstract: A semiconductor device includes a board and a semiconductor chip which is connected to an upper surface of the board via face-down bonding. The semiconductor device further includes a frame-shape member which is connected to the upper surface of the board with first adhesive, and has an opening to accommodate the semiconductor chip therein, and a plate-shape member which is situated to cover the semiconductor chip and the frame-shape member, and is connected to the semiconductor chip and the frame-shape member with second adhesive, wherein the frame-shape member has such a sufficient sturdiness as to prevent thermal-expansion-induced deformations of the board and the plate-shape member.

Abstract: A semiconductor module includes a plurality of semiconductor devices each including a circuit substrate carrying thereon a single memory semiconductor chip and a socket for holding the semiconductor devices detachably.

Abstract: A semiconductor device includes a board and a semiconductor chip which is connected to an upper surface of the board via face-down bonding. The semiconductor device further includes a frame-shape member which is connected to the upper surface of the board with first adhesive, and has an opening to accommodate the semiconductor chip therein, and a plate-shape member which is situated to cover the semiconductor chip and the frame-shape member, and is connected to the semiconductor chip and the frame-shape member with second adhesive, wherein the frame-shape member has such a sufficient sturdiness as to prevent thermal-expansion-induced deformations of the board and the plate-shape member.