Abstract: A light-emitting apparatus including: a substrate; an LED chip mounted on a first surface of the substrate; a fluorescent material-containing layer containing a first fluorescent material, which fluorescent material-containing layer is provided above the first surface of the substrate so as to cover the LED chip; and a color-adjusting fluorescent layer that contains a second fluorescent material, which color-adjusting fluorescent material layer is formed in a layer provided on an outer side of the fluorescent material-containing layer in an emission direction, the color-adjusting fluorescent layer being formed in dots. Thus, the present invention provides a light-emitting apparatus and a method for manufacturing the same, each making it possible to carry out fine color adjustment so as to prevent a subtle color shift that occurs due to a factor such as a difference in concentration of a fluorescent material or the like.

Abstract: Disclosed is a light-emitting device having a wide luminous-intensity distribution characteristic with a simple structure. The light-emitting device includes a resin package in which an LED chip, a first inner portion of a first lead terminal, and a second inner portion of a second lead terminal are accommodated and which has a second recess portion formed so that a portion including a first recess portion of the first inner portion of the first lead terminal as well as a portion of the second inner portion of the second lead terminal are exposed to a bottom portion of the second recess portion, and a resin portion containing phosphors and filled in the first recess portion of the first lead terminal and in the second recess portion of the resin package. A photoreflective filler is contained in a region opposed to the LED chip of the resin portion including the phosphors.

Abstract: A light emitting device includes: a ceramic substrate; a plurality of LED chips; a printed resistor(s) connected in parallel with the plurality of LED chips; a dam resin made of a resin having a low optical transmittance; a fluorescent-material-containing resin layer; and an anode-side electrode and a cathode-side electrode, (a) which are provided on a primary surface of the ceramic substrate so as to face each other along a first direction on the primary surface and (b) which are disposed below at least one of the dam resin and the fluorescent-material-containing resin layer. With the configuration in which a plurality of LEDs, which are connected in a series-parallel connection, are provided on a substrate, it is possible to provide a light emitting device which can achieve restraining of luminance unevenness and an improvement in luminous efficiency.

Abstract: A light-emitting apparatus of the present invention has (i) a semiconductor device which emits light toward a higher position than a substrate and (ii) a plurality of external connection terminals, and includes: a light-reflecting layer, provided on the substrate, which reflects the light emitted by the semiconductor device; and a covering layer which covers at least the light-reflecting layer and which transmits the light reflected by the light-reflecting layer. Further, the semiconductor device is provided on the covering layer, and is electrically connected to the external connection terminals via connecting portions, and the semiconductor device and the connecting portions are sealed with a sealing resin so as to be covered. Therefore, the light-emitting apparatus has increased efficiency with which light is taken out, and can prevent a reflecting layer from being altered, deteriorating, and decreasing in reflectance.

Abstract: A light-emitting apparatus including: a substrate; an LED chip mounted on a first surface of the substrate; a fluorescent material-containing layer containing a first fluorescent material, which fluorescent material-containing layer is provided above the first surface of the substrate so as to cover the LED chip; and a color-adjusting fluorescent layer that contains a second fluorescent material, which color-adjusting fluorescent material layer is formed in a layer provided on an outer side of the fluorescent material-containing layer in an emission direction, the color-adjusting fluorescent layer being formed in dots. Thus, the present invention provides a light-emitting apparatus and a method for manufacturing the same, each making it possible to carry out fine color adjustment so as to prevent a subtle color shift that occurs due to a factor such as a difference in concentration of a fluorescent material or the like.

Abstract: A light emitting device is a light emitting device using light emitting elements and includes: a substrate; a resin frame provided circularly on the substrate; a resin wall provided on the substrate so as to partition an area surrounded by the resin frame into 2 zones; light-emitting sections (a first light-emitting section: blue LEDs+red fluorescent material, a second light-emitting section: blue LEDs+yellow fluorescent material) provided in the respective zones, each of which light-emitting sections includes at least one light emitting element; and first and second anode electrodes and a cathode electrode provided so that each of the light-emitting sections receives current via a corresponding anode electrode and the cathode electrode, the light-emitting sections emitting respective pieces of light each having at least one color, which respective pieces of light have different colors from each other, the first and second anode electrodes being electrically connected to the first and second light-emitting se

Abstract: A light emitting device includes a substrate having a rectangular outer shape in a top view, a plurality of LED chips, a resin frame formed on the primary surface of the substrate and provided annularly so as to surround a mounting area in which the LED chips are provided, an anode-side electrode land and a cathode-side electrode land which are electrodes to be connected to an external voltage supply of said light emitting device. An electrode wiring pattern may be formed on the primary surface of the substrate including (i) an anode line extending from the anode-side electrode land to a portion under the resin frame and (ii) a cathode line extending from the cathode-side electrode land to the other portion under the resin frame.

Abstract: The light-emitting device includes: a substrate which has a single layer structure in which a conductive member is partially provided on a surface of the substrate; a plurality of light-emitting elements which are directly provided on the surface of the substrate so as to be electrically connected with the conductive member; a first light reflection resin layer; a second light reflection resin layer which is provided in a looped shape on the surface of the substrate so as to surround an area in which the plurality of light-emitting elements are provided; and a sealing resin which covers the plurality of light-emitting elements.

Abstract: The light-emitting device includes a substrate and a plurality of light-emitting sections. A first light-emitting section is made up of LED chips and a first fluorescent-substance-containing resin layer, and a second light-emitting section is made up of LED chips and a second fluorescent-substance-containing resin layer. The first fluorescent-substance-containing resin layer and the second fluorescent-substance-containing resin layer are provided in a plurality of locations such that the fluorescent-substance-containing resin layers for the different light-emitting sections are adjacently arranged.

Abstract: A light-emitting apparatus of the present invention has (i) a semiconductor device which emits light toward a higher position than a substrate and (ii) a plurality of external connection terminals, and includes: a light-reflecting layer, provided on the substrate, which reflects the light emitted by the semiconductor device; and a covering layer which covers at least the light-reflecting layer and which transmits the light reflected by the light-reflecting layer. Further, the semiconductor device is provided on the covering layer, and is electrically connected to the external connection terminals via connecting portions, and the semiconductor device and the connecting portions are sealed with a sealing resin so as to be covered. Therefore, the light-emitting apparatus has increased efficiency with which light is taken out, and can prevent a reflecting layer from being altered, deteriorating, and decreasing in reflectance.

Abstract: The light-emitting device includes: a substrate which has a single layer structure in which a conductive member is partially provided on a surface of the substrate; a plurality of light-emitting elements which are directly provided on the surface of the substrate so as to be electrically connected with the conductive member; a first light reflection resin layer; a second light reflection resin layer which is provided in a looped shape on the surface of the substrate so as to surround an area in which the plurality of light-emitting elements are provided; and a sealing resin which covers the plurality of light-emitting elements.

Abstract: There is provided a lighting system capable of suppressing a decrease in light output while preventing occurrence of glare. The lighting system of the present invention includes a light-emitting device and a jig for light control. The light-emitting device includes a plurality of light-emitting elements arranged so as to be distributed on a substrate, and the jig for light control is made up of a resin plate having a plurality of discrete openings for light-emitting surface partitioned by a louver. The light-emitting device and the jig for light control are overlaid so that a light-emitting portion is exposed from the plurality of discrete openings for light-emitting surface.

Abstract: An LED bulb (100) including a light source device (105) provided on a mounting plate (102) and covered by a globe (104) in a shape of a spherical shell is configured such that the light source device (105) includes: a reflecting member (108) in a truncated cone shape; and a plurality of LED chips (15) provided on a top surface of the substrate (11), at least a side face of the reflecting member (108) has a light reflecting function, and the light source device (105) is provided on the mounting plate (102) in such a way that a bottom surface of the substrate (11) faces the mounting plate (102).

Abstract: This invention provides a surface mounting type light emitting diode excellent in heat radiation performance, reliability and productivity. The surface mounting type light emitting diode includes a metallic base member, a semiconductor light emitting element having a bottom face fixedly bonded to a top face of the base member, and a metallic reflector joined to the top face of the base member with a heat conduction type adhesive sheet interposed therebetween, to surround the semiconductor light emitting element. Heat generated from the semiconductor light emitting element is transferred to the reflector via the base member and the heat conduction type adhesive sheet, and then is radiated to the outside. The metallic reflector can efficiently radiate the heat to the outside. The cutting margin provided for the reflector facilitates a dicing process, which improves productivity.

Abstract: A nitride-based semiconductor light-emitting device and a manufacturing method thereof are provided. The nitride-based light-emitting device includes a first conductivity type nitride-based semiconductor layer, a light-emitting layer and a second conductivity type nitride-based semiconductor layer, that are successively layered above a translucent base. A first conductivity type electrode layer is electrically connected to the first conductivity type nitride-based semiconductor layer, and a second conductivity type electrode layer is electrically connected to the second conductivity type nitride-based semiconductor layer.

Abstract: A substrate-type LED light source (10) includes: at least one blue LED chip (2) which has an emission peak in a range from 400 nm to 480 nm so as to correspond to a blue light region absorption peak of chlorophyll; a red phosphor (7b) which emit, upon receiving excitation light from the at least one blue LED chip (2), light having a peak wavelength in a range from 620 nm to 700 nm so as to correspond to a red light region absorption peak of chlorophyll; and a resin layer (7) in which the red phosphor 7b is dispersed and which covers the at least one blue LED chip (2).

Abstract: To provide a light emitting device easy to produce and extracting light to its outside with high efficiency, the light-emitting device 70 of the present invention includes an insulating base 10; a light-emitting element 1 mounted on a side of the base 10; and a protection element 2 mounted on the side and protecting the light-emitting element 1. The element 2 is covered with a light-reflecting filler-containing resin 5, which is prepared by causing a flexible silicone resin to contain, before being cured, light-reflecting or light-scattering fillers 5a having a particle diameter larger than the wavelength of light emitted by the element 1. This causes light emitted from the element 1 to be reflected by the resin 5, instead of being absorbed by the element 2, so that such light is released to the outside of the light-emitting device 70. This allows the device 70 to extract light to the outside with high efficiency, and also allows for easy formation of the resin 5 having a desired pattern and position.

Abstract: An illumination device with a toning function in which possibility of moisture and dust intruding into the case is reduced with a simple mechanism is realized.

Abstract: A low-cost and productivity-oriented surface mount light-emitting device is provided. The light-emitting device includes an insulating film 2, at least one pair of land portions 3a and 3b comprising metal film pieces formed on the top surface of the insulating film 2, external connection terminal portions 4a and 4b comprising metal film pieces formed on the bottom surface of the insulating film 2, that are opposed to the land portions 3a and 3b across the insulating film 2 in one-to-one correspondence, through-conductors 7a and 7b that connect between the land portions 3a and 3b and the terminal portions 4a and 4b corresponding to each other through the insulating film 2, and a light-emitting element 10 that is electrically connected to the pair of the land portions 3a and 3b and disposed in a unit section which contains the pair of the land portions 3a and 3b.

Abstract: In order to provide a light emitting device at low costs with high reliability, while suppressing deterioration in luminance of light emitting elements due to the existence of a protection element, the protection element is mounted on a mounting surface of a first lead terminal located inside a cavity in a resin section, and a light emitting element is mounted on a bottom of a recess section of a second lead terminal located in the cavity, so that the protection element is located above the light emitting device.