Patents by Inventor Toshio Hiramatsu

Toshio Hiramatsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6518599
    Abstract: A light emitting device using a group III nitride group compound semiconductor is disclosed. The device includes a substrate, a group III nitride group compound semiconductor layer, and a rectangular parallelepiped stack Rd which is formed by etching multiple group III nitride group compound semiconductor layers laminated on the group III nitride group compound semiconductor layer. The group III nitride group compound semiconductor layer comprises regions, which have many defects and less defects, respectively, and are formed in a striped pattern. Each of the boundaries between the regions with less defects and more defects or a plane which includes a longitudinal edge of the buffer layer is vertical to the substrate and parallel to a longitudinal plane of the rectangular parallelepiped stack Rd. The boundaries and two stack facets Mrr of the rectangular parallelepiped stack Rd are parallel to each other.
    Type: Grant
    Filed: November 30, 2000
    Date of Patent: February 11, 2003
    Assignees: Toyoda Gosei Co., Ltd., Japan Science and Technology Corporation
    Inventors: Tamiyo Umezaki, Yuta Tezen, Toshio Hiramatsu, Masayoshi Koike
  • Publication number: 20010013605
    Abstract: A light emitting device using a group III nitride group compound semiconductor is disclosed. The device includes a substrate, a group III nitride group compound semiconductor layer, and a rectangular parallelepiped stack Rd which is formed by etching multiple group III nitride group compound semiconductor layers laminated on the group III nitride group compound semiconductor layer. The group III nitride group compound semiconductor layer comprises regions, which have many defects and less defects, respectively, and are formed in a striped pattern. Each of the boundaries between the regions with less defects and more defects or a plane which includes a longitudinal edge of the buffer layer is vertical to the substrate and parallel to a longitudinal plane of the rectangular parallelepiped stack Rd. The boundaries and two stack facets Mrr of the rectangular parallelepiped stack Rd are parallel to each other.
    Type: Application
    Filed: November 30, 2000
    Publication date: August 16, 2001
    Inventors: Tamiyo Umezaki, Yuta Tezen, Toshio Hiramatsu, Masayoshi Koike
  • Patent number: 6037423
    Abstract: A polyester elastomer composition comprising a polyester block copolymer and a compound having, in one molecule, not less than two functional groups capable of reacting with a terminal group of the polyester block copolymer, and showing (A) a weight loss (volatility) at 150.degree. C., 2 hours of not more than 0.4% and (B) a gelation degree (gel fraction) at 250.degree. C., 4 hours of not more than 50%; and a polyester elastomer composition comprising a polyester block copolymer, a compound having, in one molecule, not less than two functional groups capable of reacting with a terminal group of the polyester block copolymer and a chain extender heating loss percentage satisfying the formula: (W1-W2)/W1.ltoreq.0.1, and a stabilizer comprising a tertiary amine as a part of its skeleton. From such composition, an elastomer molded product having fine mechanical strength, heat resistance and resistance to hydrolysis, which shows less volatility during heating and less gel and bleed out, can be obtained.
    Type: Grant
    Filed: September 9, 1999
    Date of Patent: March 14, 2000
    Assignee: Toyo Boseki Kabushiki Kaisha
    Inventors: Hirota Nagano, Toshio Hiramatsu, Hitoshi Ueno, Tsunehiro Ohshima
  • Patent number: 4957980
    Abstract: A polyester resin composition having excellent gas barrier properties and transparency which comprises 100 parts by weight of a thermoplastic polyester resin (A), 1 to 100 parts by weight of a polyamide resin having metaxylylene group (B) and 0.01 to 50 parts by weight of a compatibilizing agent (C); and a polyester hollow molded article in the form of a single or multi-layered hollow molded article, wherein at least one of the layers is made of the above polyester resin composition.
    Type: Grant
    Filed: August 8, 1988
    Date of Patent: September 18, 1990
    Assignee: Toyo Boseki Kabushiki Kaisha
    Inventors: Shigeo Kobayashi, Toshio Hiramatsu, Katsumasa Yamamoto, Nobuhiko Ichikawa
  • Patent number: 4744193
    Abstract: A mixture consisting essentially of (1) an organic polyisocyanate compound and/or a prepolymer having terminal isocyanate residues, which is derived from the reaction of an organic polyisocyanate with a polyhydroxyl compound, and (2) 2-pyrrolidone, is injected for grouting into water-leaking cracks or openings of concrete structures such as water tanks, subway constructions and tunnels. The injected mixture diffuses into the cracks or openings and is cured in short time by reacting with water at the leaking sites. The resultant polyurethane foam securely seals the water leaking sites.
    Type: Grant
    Filed: November 6, 1986
    Date of Patent: May 17, 1988
    Assignees: Taisei Corporation, Nisshinboseki Kabushiki Kaisha
    Inventors: Toshio Hatsuzaki, Yoshihiko Ogawa, Toshio Hiramatsu, Hideo Senga, Takehiko Tokoro