Patents by Inventor Toshio Hiroe

Toshio Hiroe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8957564
    Abstract: Megasonic cleaning systems and methods of fabricating and using the same are provided. In one embodiment, the system comprises a plurality of Micro-Electromechanical System (MEMS) transducers, each transducer including a movable membrane with a membrane electrode coupled to a first potential disposed above and spaced apart from an upper surface of a die including a cavity electrode coupled to a second potential, the membrane including multiple layers including a polysilicon layer between a top silicon nitride layer and a bottom silicon nitride layer, and the membrane electrode includes the polysilicon layer; a chuck on which a target workpiece is positioned; and a fluid to couple sonic energy from the plurality of MEMS transducers to the target workpiece. Other embodiments are also provided.
    Type: Grant
    Filed: June 29, 2011
    Date of Patent: February 17, 2015
    Assignee: Silicon Light Machines Corporation
    Inventors: Toshio Hiroe, Zarem Harold, Alexander Payne, James Hunter
  • Publication number: 20110256728
    Abstract: A wafer thinning apparatus for treating wafers each having at least a circuit-forming surface thereof protected, by immersing the wafers in a treating solution. The apparatus includes a support table for receiving, as placed thereon, containers each containing a plurality of wafers in one of groups into which the wafers are sorted according to predetermined ranges of thickness, a treating tank for storing the treating solution and receiving the containers, a transport mechanism for transporting the containers between the support table and the treating tank, and a control unit for controlling the transport mechanism to transport the containers successively to the treating tank, and for changing an immersion time of the containers in the treating tank for each group.
    Type: Application
    Filed: July 1, 2011
    Publication date: October 20, 2011
    Inventors: Toshio HIROE, Kenichiro ARAI
  • Patent number: 7938129
    Abstract: A substrate processing apparatus of the present invention is to apply processing using a processing liquid to a substrate. The substrate processing apparatus includes a first-side plate disposed oppositely to a first surface of the substrate with a distance and provided with plural discharge ports and suction ports in a surface opposing the first surface, a first-side processing liquid supply mechanism that supplies a processing liquid to the discharge ports in the first-side plate, and a first-side suction mechanism that sucks insides of the suction ports in the first-side plate.
    Type: Grant
    Filed: February 7, 2007
    Date of Patent: May 10, 2011
    Assignee: Dainippon Screen Mfg. Co., Ltd.
    Inventors: Toshio Hiroe, Hiroaki Uchida
  • Patent number: 7615118
    Abstract: In a substrate processing apparatus of the present invention, when substrates are loaded into a chamber, a frame part formed integral with a substrate holding part is interposed between the chamber and a cover, thereby sealing the interior of the chamber. When the substrates are unloaded to above the chamber, the chamber and the cover are brought into a direct contact, thereby sealing the interior of the chamber. Hence, the interior of the chamber can be sealed satisfactorily when the substrates are loaded into the chamber, and when the substrates are unloaded to above the chamber.
    Type: Grant
    Filed: August 15, 2006
    Date of Patent: November 10, 2009
    Assignee: Dainippon Screen Mfg. Co., Ltd.
    Inventors: Katsuhiro Fukui, Toshio Hiroe
  • Patent number: 7541285
    Abstract: A substrate processing apparatus performs a chemical solution process in a chemical solution process room that is partially formed within a chamber. During the chemical solution process, the substrate processing apparatus seals the chemical solution process room, and measures the pressure within the chemical solution process room, and controls the pressure within the chemical solution process room, based on a measured value. Irrespective of location environment of the substrate processing apparatus, the chemical solution process room can be controlled to a predetermined pressure. The substrate processing apparatus also permits efficient pressure control with respect to a minimum required amount of region.
    Type: Grant
    Filed: August 15, 2006
    Date of Patent: June 2, 2009
    Assignee: Dainippon Screen Mfg. Co., Ltd.
    Inventors: Yoshitaka Abiko, Toshio Hiroe
  • Patent number: 7422681
    Abstract: A substrate treating apparatus for treating substrates having a film coating. The apparatus includes a treating unit for treating the substrates with a treating solution, a drain pipe for draining the treating solution from the treating unit, a filter mounted on the drain pipe, and an ultraviolet emitting unit for the filter for emitting ultraviolet light to the treating solution flowing through the filter.
    Type: Grant
    Filed: May 4, 2005
    Date of Patent: September 9, 2008
    Assignee: Dainippon Screen Mfg. Co., Ltd.
    Inventors: Toshio Hiroe, Tadashi Maegawa, Yoshitaka Abiko, Akira Morita
  • Publication number: 20080083501
    Abstract: A substrate processing apparatus of the invention includes: a substrate holding unit that holds a substrate almost in a horizontal posture; a rotating unit that rotates the substrate held by the substrate holding unit about a vertical shaft line; and an etching liquid nozzle disposed oppositely to a bottom surface of the substrate held by the substrate holding unit and having plural discharge ports each having a different distance from a rotation center of the substrate rotated by the rotating unit so as to discharge an etching liquid toward the bottom surface of the substrate rotated by the rotating unit from the plural discharge ports.
    Type: Application
    Filed: October 10, 2007
    Publication date: April 10, 2008
    Inventors: Kenichiro ARAI, Toshio HIROE, Soichi NADAHARA, Koji HASEGAWA, Seiichiro OKUDA, Tomomasa ISHIDA, Naoko KURUMOTO, Kazunari NADA
  • Publication number: 20070277861
    Abstract: A wafer thinning apparatus for treating wafers each having at least a circuit-forming surface thereof protected, by immersing the wafers in a treating solution. The apparatus includes a support table for receiving, as placed thereon, containers each containing a plurality of wafers in one of groups into which the wafers are sorted according to predetermined ranges of thickness, a treating tank for storing the treating solution and receiving the containers, a transport mechanism for transporting the containers between the support table and the treating tank, and a control unit for controlling the transport mechanism to transport the containers successively to the treating tank, and for changing an immersion time of the containers in the treating tank for each group.
    Type: Application
    Filed: May 18, 2007
    Publication date: December 6, 2007
    Inventors: Toshio Hiroe, Kenichiro Arai
  • Publication number: 20070240743
    Abstract: A substrate processing apparatus of the present invention is to apply processing using a processing liquid to a substrate. The substrate processing apparatus includes a first-side plate disposed oppositely to a first surface of the substrate with a distance and provided with plural discharge ports and suction ports in a surface opposing the first surface, a first-side processing liquid supply mechanism that supplies a processing liquid to the discharge ports in the first-side plate, and a first-side suction mechanism that sucks insides of the suction ports in the first-side plate.
    Type: Application
    Filed: February 7, 2007
    Publication date: October 18, 2007
    Inventors: Toshio Hiroe, Hiroaki Uchida
  • Patent number: 7267128
    Abstract: A substrate treating apparatus for treating substrates includes a treating tank for receiving and treating the substrates, a holding device movable, while holding the substrates in a cantilever mode, between a treating position in the treating tank and a transfer position above the treating tank, a transport device for supporting the substrates and transferring the substrates to and from the holding device in the transfer position, a detecting device for detecting a posture variation of the holding device, and a correcting device for correcting a position of the holding device or the transport device. The correcting device performs a correction according to the posture variation of the holding device detected by the detecting device in time of transfer of the substrates between the holding device and the transport device.
    Type: Grant
    Filed: October 8, 2003
    Date of Patent: September 11, 2007
    Assignee: Dainippon Screen Mfg. Co., Ltd.
    Inventors: Toshio Hiroe, Koji Hasegawa, Ichiro Mitsuyoshi, Yoshihiro Nishina
  • Patent number: 7243911
    Abstract: A substrate treating apparatus for performing a predetermined treatment of substrates includes a treating tank for storing a treating solution, a holder for holding a plurality of substrates arranged in one direction inside the treating tank, and a bubble generating device for generating bubbles in the treating solution stored in the treating tank. The bubble generating device includes a plurality of cylindrical bodies extending in the one direction and arranged in a direction perpendicular to the one direction. Each of the cylindrical bodies is at least partly formed of a porous member extending in the one direction.
    Type: Grant
    Filed: January 26, 2005
    Date of Patent: July 17, 2007
    Assignee: Dainippon Screen Mfg. Co., Ltd.
    Inventors: Yoshitaka Abiko, Tomonori Kojimaru, Keiji Magara, Toshio Hiroe, Koji Hasegawa
  • Publication number: 20070072436
    Abstract: In a substrate processing apparatus of the present invention, when substrates are loaded into a chamber, a frame part formed integral with a substrate holding part is interposed between the chamber and a cover, thereby sealing the interior of the chamber. When the substrates are unloaded to above the chamber, the chamber and the cover are brought into a direct contact, thereby sealing the interior of the chamber. Hence, the interior of the chamber can be sealed satisfactorily when the substrates are loaded into the chamber, and when the substrates are unloaded to above the chamber.
    Type: Application
    Filed: August 15, 2006
    Publication date: March 29, 2007
    Inventors: Katsuhiro FUKUI, Toshio HIROE
  • Publication number: 20070042511
    Abstract: A substrate processing apparatus performs a chemical solution process in a chemical solution process room that is partially formed within a chamber. During the chemical solution process, the substrate processing apparatus seals the chemical solution process room, and measures the pressure within the chemical solution process room, and controls the pressure within the chemical solution process room, based on a measured value. Irrespective of location environment of the substrate processing apparatus, the chemical solution process room can be controlled to a predetermined pressure. The substrate processing apparatus also permits efficient pressure control with respect to a minimum required amount of region.
    Type: Application
    Filed: August 15, 2006
    Publication date: February 22, 2007
    Inventors: Yoshitaka ABIKO, Toshio HIROE
  • Publication number: 20050258085
    Abstract: A substrate treating apparatus for treating substrates having a film coating. The apparatus includes a treating unit for treating the substrates with a treating solution, a drain pipe for draining the treating solution from the treating unit, a filter mounted on the drain pipe, and an ultraviolet emitting unit for the filter for emitting ultraviolet light to the treating solution flowing through the filter.
    Type: Application
    Filed: May 4, 2005
    Publication date: November 24, 2005
    Inventors: Toshio Hiroe, Tadashi Maegawa, Yoshitaka Abiko, Akira Morita
  • Publication number: 20050161839
    Abstract: A substrate treating apparatus for performing a predetermined treatment of substrates includes a treating tank for storing a treating solution, a holder for holding a plurality of substrates arranged in one direction inside the treating tank, and a bubble generating device for generating bubbles in the treating solution stored in the treating tank. The bubble generating device includes a plurality of cylindrical bodies extending in the one direction and arranged in a direction perpendicular to the one direction. Each of the cylindrical bodies is at least partly formed of a porous member extending in the one direction.
    Type: Application
    Filed: January 26, 2005
    Publication date: July 28, 2005
    Inventors: Yoshitaka Abiko, Tomonori Kojimaru, Keiji Magara, Toshio Hiroe, Koji Hasegawa
  • Publication number: 20040211449
    Abstract: A cleaning apparatus cleaning a chuck is provided with a cleaning tank, an injection nozzle, a discharge nozzle, a liquid supply mechanism and a gas supply mechanism. The liquid supply mechanism has a supply tank, a heater and a liquid distribution mechanism so that the heater heats pure water supplied from the supply tank under the room temperature for forming warm water, reduced in electrical resistance, heated to a temperature higher than the room temperature. The liquid supply mechanism supplies the formed warm water to the cleaning tank through the liquid distribution mechanism. A vertical moving mechanism moves down a transport arm thereby dipping the chuck in the warm water and cleaning the chuck. Thus, the throughput of the cleaning apparatus cleaning the chuck is improved, the quantity of consumed gas is reduced and cleaning performance is improved.
    Type: Application
    Filed: April 26, 2004
    Publication date: October 28, 2004
    Applicant: Dainippon Screen Mfg. Co., Ltd.
    Inventors: Ryu Yokomoto, Toshio Hiroe, Koji Hasegawa
  • Publication number: 20040200415
    Abstract: A substrate processing apparatus of the present invention is surrounded by a hermetic member, and the internal space thereof is divided by a hermetic member into a rinse and dry processing chamber, a first and second liquid chemical processing chambers, and a substrate transport chamber. Openings for allowing transportation of substrates to and from corresponding chambers are capable of being exposed and blocked by open/close mechanisms including sealing means. Hence, substrates being processed can be transported in an environment isolated from outside an external atmosphere containing oxygen, to thereby suppress formation of unnecessary oxide films or generation of water marks on the surfaces of substrates while being transported. Further, exhaust emission can be reduced, which emission serves to prevent diffusion of an atmosphere containing vapor of a liquid chemical to the outside of the substrate processing apparatus.
    Type: Application
    Filed: February 26, 2004
    Publication date: October 14, 2004
    Applicant: Dainippon Screen Mfg. Co., Ltd.
    Inventors: Tadashi Maegawa, Toshio Hiroe
  • Publication number: 20040071531
    Abstract: A substrate treating apparatus for treating substrates includes a treating tank for receiving and treating the substrates, a holding device movable, while holding the substrates in a cantilever mode, between a treating position in the treating tank and a transfer position above the treating tank, a transport device for supporting the substrates and transferring the substrates to and from the holding device in the transfer position, a detecting device for detecting a posture variation of the holding device, and a correcting device for correcting a position of the holding device or the transport device. The correcting device performs a correction according to the posture variation of the holding device detected by the detecting device in time of transfer of the substrates between the holding device and the transport device.
    Type: Application
    Filed: October 8, 2003
    Publication date: April 15, 2004
    Applicant: Dainippon Screen Mfg. Co., Ltd.
    Inventors: Toshio Hiroe, Koji Hasegawa, Ichiro Mitsuyoshi, Yoshihiro Nishina
  • Publication number: 20030178379
    Abstract: A substrate holding apparatus for holding substrates in vertical posture includes a first holder, a second holder and a substrate fall preventing stand arranged along edges of the substrates and located below centers of the substrates. The first holder is disposed in a position for holding the substrates between lower ends and lateral ends of the substrates. The second holder is disposed in a position for holding the substrates at the lower ends of the substrates, or in a position opposed to the first holder across the lower ends for holding the substrates between the lower ends and lateral ends of the substrates. The substrate fall preventing stand being disposed opposite the first holder across the lower ends of the substrates and above the second holder.
    Type: Application
    Filed: March 13, 2003
    Publication date: September 25, 2003
    Applicant: Dainippon Screen Mfg. Co., Ltd.
    Inventors: Koji Hasegawa, Nobutoshi Ogami, Hisao Nishizawa, Toshio Hiroe
  • Patent number: 5656088
    Abstract: For processing semiconductor substrates in a processing fluid, the substrates are introduced into a processing bath in which the processing fluid is filled. For holding the substrates in the process of introducing them into the processing bath, a holder having a pair of holding rods end a pair of aiding rods is prepared. A periodical linear array of grooves is formed on each rod. The rims of substrates are inserted into respective corresponding grooves on the rods so that the substrates do not touch respective side walls of the grooves in the aiding rod.
    Type: Grant
    Filed: August 26, 1992
    Date of Patent: August 12, 1997
    Assignee: Dainippon Screen Mfg. Co., Ltd.
    Inventors: Kenji Sugimoto, Tadashi Maegawa, Akihiko Hidaka, Toshio Hiroe, Hideki Hayashi