Abstract: A curable epoxy resin is blended with (a) an alkenyl group-containing epoxidized novolak resin/organopolysiloxane copolymer and (b) a polyimide resin in addition to a curing agent and an inorganic filler. The resulting epoxy resin composition can be cured both under moisture-free conditions and even under moist conditions without inducing a crack. It is suitable for the encapsulation of semiconductor devices as well as for molding and powder coating.

Abstract: A resin-encapsulated semiconductor device is of the structure wherein a silicon chip on a die pad is encapsulated with a molding resin. The rear surface of the die pad remote from the silicon chip, preferably the entire surfaces of the elements are treated with a primer, typically a silane coupling agent and a low stress epoxy resin encapsulant is used, preventing the encapsulating resin from separating and cracking upon subsequent dipping in solder bath.

Abstract: The present invention provides a novel epoxy resin-based curable composition suitable for use as an encapsulating resin composition for semiconductor devices capable of being highly resistant against crack formation with low internal stress by curing and yet having very high heat conductivity and maintaining high glass transition temperature. The inventive composition comprises (a) 100 parts by weight of a curable epoxy resin blend which is a mixture of an epoxy resin and a curing agent therefor, (b) from 5 to 100 parts by weight of a block copolymer composed of at least one segment of an aromatic polymeric moiety, phenyl novolac, and at least one segment of an organopolysiloxane moiety having 30 to 200 silicon atoms and bonded to the aromatic polymeric moiety through a carbon-to-silicon linkage, and optionally (c) an inorganic filler which is preferably a silica filler such as powdered quartz in an amount not exceeding 1000 parts by weight.

Abstract: An epoxy resin composition which comprises a curable epoxy resin, a curing agent, an inorganic filler, and at least one copolymer selected from copolymers obtained by an addition reaction between aromatic polymers containing one or more epoxy groups and one or more alkenyl groups and the specific organopolysiloxanes; copolymers obtained by an addition reaction between aromatic polymers containing one or more epoxy groups and the specific amino group-containing organopolysiloxanes.

Abstract: An epoxy resin composition which is adapted for use as an encapsulator of electronic or electric parts and which comprises an epoxy resin and a curing agent for the epoxy resin. A modified polymer obtained by reaction between an aromatic polymer and a fluorine-containing material is added to the epoxy resin, so that good characteristic properties are imparted to the resultant cured product.

Abstract: An epoxy resin composition which comprises a curable epoxy resin, a hardener, and a block copolymer formed by the reaction of a triphenol-alkane type resin or a polymer thereof with a specific organopoly-siloxane. The composition provides a cured product having a high glass transition point, a low coefficient of expansion, good crack resistance, and is less likely to exert stress to the semiconductor devices. It exhibits distinct characteristics when used as a sealing compound for semiconductor devices, especially in the case where the element is bonded directly to a printed circuit board or heat sink. It is very unlikely that a semiconductor device sealed with it would become warped.

Abstract: The inorganic filler in the inventive epoxy resin-based composition is a combination of two kinds of quartz powder of which one is a quartz powder having a spherical particle form and the other is a pulverized quartz powder in a specified proportion. The resin composition is highly flowable and capable of giving encapsulation of semiconductor devices with little fins having outstandingly small thermal expansion coefficient and highly resistant against crack formation.

Abstract: An epoxy resin-based composition suitable for encapsulation of semiconductor devices is proposed. The resin composition is capable of giving a cured resin encapsulation highly resistant against crack formation by virtue of the unique ingredient therein, in addition to the thermally curable epoxy resin and an inorganic filler, which is a combination of an organopolysiloxane having a hydrocarbon group substituted by certain functional groups, e.g. glycidyl, amino, mercapto and the like, and a block copolymer composed of the segments of a polymeric aromatic moiety and segments of an organopolysiloxane moiety.

Abstract: An organopolysiloxane composition is proposed which is of the type curable by the addition reaction type and containing, as the retarding agent for crosslinking, an organic compound having one or more acetylenic triple bonds and --O--CO--NH-- groups in the molecule, is readily cured by heating but can be stored for a long period of time without gelling. The composition usable as silicone elastomers, molding compounds, and the like.

Abstract: Starting from an organohydrogenpolysiloxane having at least two hydrogen atoms directly bonded to the silicone atoms, an organohydrogenpolysiloxane is obtained in which part of the silicon-bonded hydrogen atoms have been converted into organic groups and the remaining silicon-bonded hydrogen atoms are left unreacted. The starting organohydrogenpolysiloxane is brought to the partial addition reaction with less than equivalent amount of an organic unsaturated compound having aliphatic double bond in the molecule in the presence of a platinum catalyst, and the reaction mixture is subjected to distillation while the platinum catalyst is deactivated by added benzothiazole or derivatives thereof, thus providing for the production of the organohydrogenpolysiloxane of the invention in reproducibly in high yield. The compounds are useful as crosslinking agents in the manufacture of various silicone products.

Abstract: A silicone resin molding composition is proposed which comprises (a) a vinyl-containing organopolysiloxane composed of randomly copolymerized tri-, di- and mono-functional siloxane units in specific mole fractions, (b) a vinyl-containing organopolysiloxane with at least one block composed of from 5 to 1,000 of diorganosiloxane units bonded linearly to each other in an uninterrupted sequence, (c) an organohydrogenpolysiloxane which serves as a crosslinking agent and (d) a platinum catalyst. Being solid at room temperature, the silicone resin molding composition of the present invention is suitable for transfer molding and injection molding, and the molded articles obtained from the composition have the advantages of good dimensional stability with very small thermal expansion coefficients as well as small shrinkage in molding and in post-curing.