Patents by Inventor Toshio Shiobara

Toshio Shiobara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Liquid epoxy resin composition and semiconductor device
    Publication number: 20020077421
    Abstract: A liquid epoxy resin composition comprising (A) a liquid epoxy resin, (B) a curing agent, (C) a curing accelerator, and (D) an inorganic filler is provided, the curing agent (B) comprising 5 to 75 parts by weight of a mixture of 3,4-dimethyl-6-(2-methyl-1-propenyl)-1,2,3,6-tetrahydrophthalic acid and 1-isopropyl-4-methyl-bicyclo[2.2.2]oct-5-ene-2,3-dicarboxylic acid per 100 parts by weight of the entire curing agent. The composition is adherent to the surface of silicon chips, and especially to polyimide resins and nitride films and has high thermal shock resistance. A semiconductor device sealed with the cured epoxy resin composition remains reliable.
    Type: Application
    Filed: September 20, 2001
    Publication date: June 20, 2002
    Inventors: Kazuaki Sumita, Toshio Shiobara
  • Epoxy resin compositions and premolded semiconductor packages
    Publication number: 20020076558
    Abstract: In an epoxy resin composition comprising an epoxy resin, a curing agent, and an inorganic filler, the filler is porous silica having a specific surface area of 6-200 m2/g, a true specific gravity of 2.0-2.2, and a mean particle size of 2-50 &mgr;m. The epoxy resin composition is readily moldable, has a low moisture permeability and reliability in the cured state, and is suitable for forming a premolded hollow semiconductor package.
    Type: Application
    Filed: November 20, 2001
    Publication date: June 20, 2002
    Applicant: Shin-Etsu Company Co., Ltd.
    Inventors: Kazutoshi Tomiyoshi, Kazuhiro Arai, Toshio Shiobara, Koki Oitori, Hironori Sakamoto, Yuji Kishigami, Koji Tsuchiya, Masato Kanari
  • Epoxy resin compositions and premolded semiconductor packages
    Patent number: 6399677
    Abstract: In an epoxy resin composition comprising an epoxy resin, a curing agent, and an inorganic filler, the filler is porous silica having a specific surface area of 6-200 m2/g, a true specific gravity of 2.0-2.2, and a mean particle size of 2-50 &mgr;m. The epoxy resin composition is readily moldable, has a low moisture permeability and reliability in the cured state, and is suitable for forming a premolded hollow semiconductor package.
    Type: Grant
    Filed: December 1, 2000
    Date of Patent: June 4, 2002
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Kazutoshi Tomiyoshi, Kazuhiro Arai, Toshio Shiobara
  • Light-transmissive epoxy resin composition and semiconductor device
    Publication number: 20020058145
    Abstract: An epoxy resin composition comprising (A) an epoxy resin, (B) a curing accelerator, and (C) an inorganic filler is light transmissive when it satisfies formulae (1) and (2):
    Type: Application
    Filed: September 13, 2001
    Publication date: May 16, 2002
    Inventors: Tatsuya Kanamaru, Tsuyoshi Honda, Eiichi Asano, Toshio Shiobara
  • Light-transmissive epoxy resin composition and flip-chip type semiconductor device
    Publication number: 20020058742
    Abstract: A light-transmissive epoxy resin composition comprising (A) an epoxy resin, (B) a curing accelerator, and (C) an inorganic filler satisfies formula (1):
    Type: Application
    Filed: September 12, 2001
    Publication date: May 16, 2002
    Inventors: Tsuyoshi Honda, Tatsuya Kanamaru, Eiichi Asano, Toshio Shiobara
  • Epoxy resin composition, laminate film using the same, and semiconductor device
    Patent number: 6383659
    Abstract: An epoxy resin composition comprising an epoxy resin containing 0-10% by weight of a 2-nucleus compound and 50-100% by weight of 3 to 5-nucleus compounds combined and having a dispersity (Mw/Mn) of up to 1.7, an inorganic filler, a curing catalyst, a thermoplastic resin, and an optional phenolic resin and having a Tg of lower than 15° C. in an uncured state is effective in forming a flexible film which is easy to work at room temperature. Owing to the thermoplastic resin added, the composition avoids the problem that when a semiconductor chip is sealed with an uncured film of the composition, the film will lose its original shape or entrapped voids will be formed near the chip.
    Type: Grant
    Filed: April 13, 2000
    Date of Patent: May 7, 2002
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Tsuyoshi Honda, Miyuki Wakao, Toshio Shiobara
  • Flip-chip type semiconductor device sealing material and flip-chip type semiconductor device
    Patent number: 6376923
    Abstract: A sealing material comprising (A) a liquid epoxy resin, (B) a curing agent, (C) a copolymer obtained through addition reaction between an alkenyl group-containing epoxy resin and an SiH group-containing organopolysiloxane, (D) an inorganic filler having a specific surface area of less than 4 m2/g, and (E) a fine inorganic filler having a specific surface area of at least 4 m2/g and surface treated with an aminosilane or organosilazane compound is suitable for sealing flip-chip type semiconductor devices. Despite high loading of inorganic fillers, the material has a low viscosity in the low shear region and improved thin-film infiltration and forms a reliable seal.
    Type: Grant
    Filed: June 8, 2000
    Date of Patent: April 23, 2002
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Kazuaki Sumita, Kimitaka Kumagae, Miyuki Wakao, Toshio Shiobara
  • Flip-chip type semiconductor device underfill material and flip-chip type semiconductor device
    Patent number: 6376100
    Abstract: A composition comprising (A) 100 parts of a liquid epoxy resin, (B) 100-300 parts of a spherical inorganic filler having a maximum particle size of up to 50 &mgr;m and a mean particle size of 0.5-10 &mgr;m, (C) 0.1-6 parts of a reactive functional group-containing silicone compound, and (D) 0.01-10 parts of a curing accelerator is suitable as an underfill material for flip-chip type semiconductor devices. The composition has improved thin film infiltration and eliminates voids and other defects.
    Type: Grant
    Filed: June 9, 2000
    Date of Patent: April 23, 2002
    Assignee: Shin Etsu-Chemical Co., Ltd.
    Inventors: Toshio Shiobara, Kazuaki Sumita
  • Liquid epoxy resin composition and semiconductor device
    Publication number: 20020045709
    Abstract: A liquid epoxy resin composition includes (A) a liquid epoxy resin, (B) an optional curing agent, (C) a curing accelerator, (D) an inorganic filler, and (E) an indene-styrene or indene-chroman-styrene copolymer having a Mn of 200-2,000 in an amount of 0.1-20 parts by weight per 100 parts by weight of components (A) and (B) combined. The indene polymer (E) is previously melt mixed with a part or all of the liquid epoxy resin (A) prior to compounding with the remaining components. A semiconductor device sealed with the cured product of the liquid epoxy resin composition remains reliable.
    Type: Application
    Filed: July 26, 2001
    Publication date: April 18, 2002
    Inventors: Kazuaki Sumita, Toshio Shiobara
  • Flip-chip type semiconductor device underfill
    Patent number: 6372839
    Abstract: A composition comprising (A) a liquid epoxy resin, (B) spherical silica obtained by heating and burning spherical particles of polyorganosilsesquioxane, and (C) a curing accelerator is suitable as an underfill material for flip-chip type semiconductor devices. The composition has improved thin film infiltration and storage stability.
    Type: Grant
    Filed: March 17, 2000
    Date of Patent: April 16, 2002
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Kunio Ito, Toshio Shiobara, Kazuaki Sumita
  • Epoxy resin composition
    Publication number: 20020022681
    Abstract: An epoxy resin composition comprising (A) an epoxy resin, (B) a curing agent, and (C) a silicone stress-reducing agent further includes (D) a foam-suppressing composition comprising (D-i) an oil compound consisting of a hydrophobic organopolysiloxane and finely divided silica, (D-ii) a hydrophilic polyoxyalkylene-modified silicone oil, and optionally, (D-iii) a polyoxyalkylene polymer. The epoxy resin composition has the advantages of improved infiltration to semiconductor device-substrate gaps and minimized formation of internal and surface voids.
    Type: Application
    Filed: July 5, 2001
    Publication date: February 21, 2002
    Inventors: Nobuhiro Ichiroku, Miyuki Wakao, Toshio Shiobara
  • Semiconductor encapsulating epoxy resin composition and semiconductor device
    Publication number: 20020016398
    Abstract: A semiconductor encapsulating epoxy resin composition comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a molybdenum compound, and (D) 300-900 parts by weight per 100 parts by weight of components (A) and (B) combined of an inorganic filler contains nitrogen atoms in an amount of 1.5-20% by weight based on the weight of components (A) and (B) combined. Cured parts of the composition exhibit high-temperature capabilities and flame retardance despite the absence of halogenated epoxy resins and antimony trioxide.
    Type: Application
    Filed: June 19, 2001
    Publication date: February 7, 2002
    Inventors: Shoichi Osada, Toshio Shiobara, Eiichi Asano, Kazutoshi Tomiyoshi, Takayuki Aoki, Shigeki Ino
  • Epoxy resin composition and semiconductor device
    Patent number: 6342309
    Abstract: An epoxy resin composition contains (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler, and (D) catalyzed microcapsules containing an imidazole compound or organic phosphorus compound and having a mean particle size of 0.5-50 &mgr;m, the quantity of the catalyst leached out from the microcapsules in o-cresol at 30° C. for 15 minutes being at least 70% by weight of the entire catalyst quantity. The composition is suited for semiconductor package encapsulation since it has satisfactory catalyst latency, storage stability and cure.
    Type: Grant
    Filed: August 18, 2000
    Date of Patent: January 29, 2002
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Toshio Shiobara, Shigeki Ino, Yasuo Kimura, Takayuki Aoki, Kazuhiro Arai, Hidenori Mizushima
  • Semiconductor sealing liquid epoxy resin compositions
    Patent number: 6323263
    Abstract: In a semiconductor-sealing liquid epoxy resin composition comprising (A) a liquid epoxy resin, (B) a curing agent, and (C) an inorganic filler, the inorganic filler has such a controlled particle size distribution that the composition provides improved interstitial infiltration and has a low modulus of elasticity in the cured state.
    Type: Grant
    Filed: November 9, 2000
    Date of Patent: November 27, 2001
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Haruyoshi Kuwabawa, Kazuaki Sumita, Toshio Shiobara
  • Flip-chip type semiconductor device sealing material
    Patent number: 6310120
    Abstract: A sealing material comprising (A) a liquid epoxy resin, (B) a curing agent, (C) spherical silica, (D) a soft x-ray non-transmissive spherical inorganic filler, and (E) a curing accelerator is suited as an underfill material for flip-chip type semiconductor devices. The sealing material has improved thin-film infiltration and storage stability. The filled state or seal defects can be readily inspected using soft x-rays.
    Type: Grant
    Filed: February 7, 2000
    Date of Patent: October 30, 2001
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Toshio Shiobara, Kazuaki Sumita
  • Sealing material for flip-chip semiconductor device, and flip-chip semiconductor device made therewith
    Publication number: 20010034382
    Abstract: A sealing material for flip chip-type semiconductor devices comprises a liquid epoxy resin composition which includes (A) a liquid epoxy resin, (B) an optional curing agent, (C) an inorganic filler, and (D) 1 to 15 parts by weight of a microencapsulated catalyst per 100 parts by weight of components A and B combined. The excellent thin-film penetration and shelf stability of the sealing material confer a very high reliability to flip chip-type semiconductor devices made using the sealing material.
    Type: Application
    Filed: February 1, 2001
    Publication date: October 25, 2001
    Inventors: Kazuaki Sumita, Toshio Shiobara
  • Film-type adhesive for electronic components, and electronic components bonded therewith
    Publication number: 20010031828
    Abstract: A film-type adhesive for electronic components comprises a polyimide resin made up of specific repeating units and having a weight-average molecular weight of 5,000-150,000 in combination with an epoxy resin bearing at least two glycidyl groups per molecule. The adhesive has a weight ratio of the polyimide resin to the epoxy resin within a range of 50/50 to 5/95, and a film thickness of 20-150 &mgr;m. Such a film-type adhesive makes it possible to simplify and shorten the duration of assembly operations for electronic components having various types of adherend surfaces.
    Type: Application
    Filed: March 15, 2001
    Publication date: October 18, 2001
    Inventors: Tsuyoshi Honda, Nobuhiro Ichiroku, Toshio Shiobara
  • Semiconductor encapsulating epoxy resin composition and semiconductor device
    Patent number: 6297306
    Abstract: An epoxy resin composition comprising (A) a biphenyl skeleton epoxy resin, (B) a biphenyl skeleton phenolic resin as a curing agent, (C) molybdenum compound, and (D) an inorganic filler is suited for semiconductor encapsulation since it is effectively moldable and cures into a part having improved reflow crack resistance, moisture resistance, and flame retardance. It does not pose a hazard to human health or the environment.
    Type: Grant
    Filed: May 13, 1999
    Date of Patent: October 2, 2001
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Shoichi Osada, Takayuki Aoki, Toshio Shiobara, Kazutoshi Tomiyoshi, Eiichi Asano
  • Flip-chip type semiconductor device sealing material and flip-chip type semiconductor device
    Patent number: 6294271
    Abstract: In a liquid epoxy resin composition comprising a liquid epoxy resin and an inorganic filler, a specific imidazole compound having a solubility of up to 1% by weight in the epoxy resin, a melting point of at least 170° C., a mean particle diameter of 1-5 &mgr;m, and a maximum particle diameter of up to 20 &mgr;m is used as a curing accelerator. The resulting composition is suited as a sealing material for flip-chip type semiconductor devices since it has improved thin-film infiltration and storage stability.
    Type: Grant
    Filed: February 7, 2000
    Date of Patent: September 25, 2001
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Kazuaki Sumita, Kimitaka Kumagae, Miyuki Wakao, Toshio Shiobara
  • Semiconductor encapsulating epoxy resin composition and semiconductor device
    Patent number: 6291556
    Abstract: A semiconductor encapsulating epoxy resin composition is provided comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a microencapsulated flame retardant comprising a red phosphorus-base core coated with a thermoplastic resin and/or thermosetting resin, (D) a molybdenum compound, and (E) an inorganic filler. The composition and its cured product have moisture-proof reliability and high flame retardance despite the absence of halogenated epoxy resins and antimony oxide.
    Type: Grant
    Filed: March 24, 2000
    Date of Patent: September 18, 2001
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Shoichi Osada, Eiichi Asano, Shigeki Ino, Takayuki Aoki, Kazutoshi Tomiyoshi, Toshio Shiobara