Patents by Inventor Toshio Uchida

Toshio Uchida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12140430
    Abstract: A sensor device includes a sensor element, a supporting member, a substrate, and a bonding wire. The supporting member is electrically connected to the sensor element. The substrate is electrically connected to the supporting member. The bonding wire forms at least part of a connection path that electrically connects the sensor element and the supporting member together. The substrate and an installation member on which the sensor element is installed intersect with each other. The sensor element and the supporting member are separated from each other.
    Type: Grant
    Filed: November 6, 2020
    Date of Patent: November 12, 2024
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Hideki Ueda, Yusuke Nakamura, Koichiro Nakashima, Takashi Uchida, Toshio Yamazaki, Hiroyuki Fujii, Chikara Nara
  • Patent number: 9421605
    Abstract: An object is to propose a mold release agent improving the state of a mold surface by repeating casting cycle so as to extend the life of the metal mold actively, and a casting method using the mold release agent. A water-soluble mold release agent applied on a mold surface of a metal mold contains organic acid or organic acid salt which is reducing and ligand, wherein concentration of a total thereof is not less than 0.01 wt % in using concentration and is not more than a fixed concentration which is stability limit of emulsion of the mold release agent in undiluted concentration. Construction weight ratio of the organic acid or organic acid salt which is reducing and the ligand is in the range from 99/1 to 30/70.
    Type: Grant
    Filed: October 23, 2006
    Date of Patent: August 23, 2016
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventors: Yuichi Furukawa, Toshio Uchida, Setsuyu Hayakawa
  • Patent number: 9139745
    Abstract: The present invention provides an aggregate of spherical core-shell cerium oxide/polymer hybrid nanoparticles, a process for producing the same, and a product such as an anti-reflection film having a high refractive index layer.
    Type: Grant
    Filed: July 23, 2010
    Date of Patent: September 22, 2015
    Assignee: National Institute of Advanced Industrial Science and Technology
    Inventors: Noriya Izu, Toshio Uchida, Ichiro Matsubara, Toshio Itoh, Woosuck Shin, Maiko Nishibori
  • Patent number: 8846785
    Abstract: The invention provides a method for manufacturing spherical, monodispersed core-shell type ceria-polymer hybrid nanoparticles including, a mixing step in which a cerium salt and a polymer are mixed together in a high-boiling-point organic solvent to obtain a mixture, and a heating and reflux step in which this mixture is heated and refluxed at a temperature of 110° C. or more to thereby generate a boiling phenomenon in the heating and reflux step, and rapidly cooling the mixture after the heating and reflux step to precipitate cerium oxide, and a liquid dispersion thereof.
    Type: Grant
    Filed: December 23, 2009
    Date of Patent: September 30, 2014
    Assignee: National Institute of Advanced Industrial Science and Technology
    Inventors: Noriya Izu, Ichiro Matsubara, Toshio Itoh, Woosuck Shin, Maiko Nishibori, Toshio Uchida
  • Publication number: 20130158850
    Abstract: Evaluation display systems, methods, and programs display a current position of a vehicle on a map around on a display unit. The systems, methods, and programs acquire a current evaluation indicating a fuel efficiency evaluation of each unit interval in a current travel of the vehicle, and acquire a past evaluation indicating a fuel efficiency evaluation of the each unit interval in a past travel that is earlier than the current travel. The systems, methods, and programs display the current evaluation and the past evaluation of each unit interval on the map and, if a distance between the current position of the vehicle and a display position of at least one past evaluation on the map becomes equal to or smaller than a predetermined distance, erases the at least one past evaluation from the map.
    Type: Application
    Filed: October 23, 2012
    Publication date: June 20, 2013
    Inventors: Toshio UCHIDA, Toru SAKAI, Naoki MIURA
  • Patent number: 8223496
    Abstract: A power supply unit of an arc discharge device includes a semiconductor module 1 and a radiator fitted onto the semiconductor module 1. The semiconductor module 1 includes a module casing 2 and common units 3a to 3c retained by the module casing 2. Each of the common units 3a to 3c has: a ceramic substrate 50 having a circuit surface disposed with a semiconductor element 54 and a radiation surface on a side opposite to the circuit surface and a package 35 that exposes the radiation surface and seals the circuit surface with heat resistant resin. The radiator is fitted onto the module casing 2 to be thereby brought into abutting contact with all of the radiation surfaces of the common units 3a to 3c.
    Type: Grant
    Filed: May 18, 2007
    Date of Patent: July 17, 2012
    Assignee: Sansha Electric Manufacturing Co., Ltd.
    Inventors: Osamu Soda, Yuji Ohnishi, Kazunori Inami, Toshio Uchida
  • Publication number: 20120142808
    Abstract: The present invention provides an aggregate of spherical core-shell cerium oxide/polymer hybrid nanoparticles, a process for producing the same, and a product such as an anti-reflection film having a high refractive index layer.
    Type: Application
    Filed: July 23, 2010
    Publication date: June 7, 2012
    Applicant: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
    Inventors: Noriya Izu, Toshio Uchida, Ichiro Matsubara, Toshio Itoh, Woosuck Shin, Maiko Nishibori
  • Patent number: 7994635
    Abstract: To suppress warpage of a ceramic substrate, and to prevent a reduction in radiation efficiency. A power semiconductor module includes a module casing fitted with a radiator, and a common unit retained by the module casing. The common unit has: a ceramic substrate having a circuit surface disposed with a semiconductor element, and a radiation surface brought into abutting contact with the radiator; and a package formed by exposing the radiation surface and sealing the circuit surface with heat resistant resin. The circuit surface and the radiation surface are respectively formed of metal layers 51 formed on the ceramic substrate, and the metal layer 51 forming the radiation surface has: by forming a buffer pattern 512 including a groove part extending along a circumferential part thereof, a radiation pattern 510 formed on an inner side of the buffer pattern 512; and an outer peripheral pattern 511 formed on an outer side of the buffer pattern 512.
    Type: Grant
    Filed: May 18, 2007
    Date of Patent: August 9, 2011
    Assignee: Sansha Electric Manufacturing Co., Ltd.
    Inventors: Osamu Soda, Yuji Ohnishi, Kazunori Inami, Toshio Uchida
  • Patent number: 7948424
    Abstract: In order to provide a radio wave absorber that can be produced easily and has excellent radio wave absorption characteristics, a conductive surface 2 of a conductive paint 6 is formed on one surface 1a of a mat-shaped inorganic fiber bulk material 1.
    Type: Grant
    Filed: August 23, 2007
    Date of Patent: May 24, 2011
    Assignees: Mitsubishi Cable Industries, Ltd., Asahi Building-Wall Co., Ltd., Asahi Fiber Glass Co., Ltd.
    Inventors: Toshio Kudo, Toshio Uchida, Akira Inoue, Kazuaki Yagi
  • Publication number: 20110042029
    Abstract: An object is to propose a mold release agent improving the state of a mold surface by repeating casting cycle so as to extend the life of the metal mold actively, and a casting method using the mold release agent. A water-soluble mold release agent applied on a mold surface of a metal mold contains organic acid or organic acid salt which is reducing and ligand, wherein concentration of a total thereof is not less than 0.01 wt % in using concentration and is not more than a fixed concentration which is stability limit of emulsion of the mold release agent in undiluted concentration. Construction weight ratio of the organic acid or organic acid salt which is reducing and the ligand is in the range from 99/1 to 30/70.
    Type: Application
    Filed: October 23, 2006
    Publication date: February 24, 2011
    Applicants: TOYOTA JIDOSHA KABUSHIKI KAISHA, TETRA CO., LTD
    Inventors: Yuichi Furukawa, Toshio Uchida, Setsuyu Hayakawa
  • Publication number: 20100209710
    Abstract: The invention provides a method for manufacturing spherical, monodispersed core-shell type ceria-polymer hybrid nanoparticles including, a mixing step in which a cerium salt and a polymer are mixed together in a high-boiling-point organic solvent to obtain a mixture, and a heating and reflux step in which this mixture is heated and refluxed at a temperature of 110° C. or more to thereby generate a boiling phenomenon in the heating and reflux step, and rapidly cooling the mixture after the heating and reflux step to precipitate cerium oxide, and a liquid dispersion thereof.
    Type: Application
    Filed: December 23, 2009
    Publication date: August 19, 2010
    Applicant: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
    Inventors: Noriya IZU, Ichiro Matsubara, Toshio Itoh, Woosuck Shin, Maiko Nishibori, Toshio Uchida
  • Publication number: 20100182188
    Abstract: In order to provide a radio wave absorber that can be produced easily and has excellent radio wave absorption characteristics, a conductive surface 2 of a conductive paint 6 is formed on one surface 1a of a mat-shaped inorganic fiber bulk material 1.
    Type: Application
    Filed: August 23, 2007
    Publication date: July 22, 2010
    Inventors: Toshio Kudo, Toshio Uchida, Akira Inoue, Kazuaki Yagi
  • Publication number: 20100127387
    Abstract: [Summary] [Object] To suppress warpage of a ceramic substrate, and to prevent a reduction in radiation efficiency. [Means for Settlement] A power semiconductor module includes a module casing fitted with a radiator, and a common unit retained by the module casing. The common unit has: a ceramic substrate having a circuit surface disposed with a semiconductor element, and a radiation surface brought into abutting contact with the radiator; and a package formed by exposing the radiation surface and sealing the circuit surface with heat resistant resin. The circuit surface and the radiation surface are respectively formed of metal layers 51 formed on the ceramic substrate, and the metal layer 51 forming the radiation surface has: by forming a buffer pattern 512 including a groove part extending along a circumferential part thereof, a radiation pattern 510 formed on an inner side of the buffer pattern 512; and an outer peripheral pattern 511 formed on an outer side of the buffer pattern 512.
    Type: Application
    Filed: May 18, 2007
    Publication date: May 27, 2010
    Applicant: Sansha Electric Manufacturing Co., Ltd.
    Inventors: Osamu Soda, Yuki Ohnishi, Kazunori Inami, Toshio Uchida
  • Publication number: 20100128441
    Abstract: [Object] To incorporate more semiconductor elements in a small-sized lightweight power semiconductor module provided in an arc discharge device. [Means for Settlement] A power supply unit of an arc discharge device includes a semiconductor module 1, and a radiator fitted onto the semiconductor module 1. The semiconductor module 1 includes a module casing 2, and common units 3a to 3c retained by the module casing 2. Each of the common units 3a to 3c has: a ceramic substrate 50 having a circuit surface disposed with a semiconductor element 54, and a radiation surface on a side opposite to the circuit surface; and a package 35 that exposes the radiation surface, and seals the circuit surface with heat resistant resin. The radiator is fitted onto the module casing 2 to be thereby brought into abutting contact with all of the radiation surfaces of the common units 3a to 3c. Based on such a configuration, more semiconductor elements can be incorporated in a small-sized lightweight power semiconductor module.
    Type: Application
    Filed: May 18, 2007
    Publication date: May 27, 2010
    Applicant: Sansha Electric Manufacturing Co., LTd
    Inventors: Osamu Soda, Yuji Ohnishi, Kazunori Inami, Toshio Uchida
  • Patent number: 7491079
    Abstract: A connector includes i) a plug including a pair of connecting members configured to connect the plug to a socket, a through-hole formed at a portion between the pair of connecting members, and plug contacts arranged on outer side faces of the respective connecting members, ii) a socket including a recess portion configured to receive the plug, and socket contacts arranged on inner side faces of the recess portion, and iii) a locking member configured to lock the plug into the socket, expanding the pair of the connecting members outward so as to contact each of the outer side faces of the connecting members onto a corresponding one of the inner side faces of the recess portion by inserting between the pair of the connecting members via the through-hole, and thereby bringing the plug contacts into contact with the socket contacts.
    Type: Grant
    Filed: July 6, 2007
    Date of Patent: February 17, 2009
    Assignee: NEC LCD Technologies, Ltd
    Inventor: Toshio Uchida
  • Publication number: 20080009160
    Abstract: A connector includes i) a plug including a pair of connecting members configured to connect the plug to a socket, a through-hole formed at a portion between the pair of connecting members, and plug contacts arranged on outer side faces of the respective connecting members, ii) a socket including a recess portion configured to receive the plug, and socket contacts arranged on inner side faces of the recess portion, and iii) a locking member configured to lock the plug into the socket, expanding the pair of the connecting members outward so as to contact each of the outer side faces of the connecting members onto a corresponding one of the inner side faces of the recess portion by inserting between the pair of the connecting members via the through-hole, and thereby bringing the plug contacts into contact with the socket contacts.
    Type: Application
    Filed: July 6, 2007
    Publication date: January 10, 2008
    Applicant: NEC LCD TECHNOLOGIES, LTD.
    Inventor: Toshio Uchida
  • Patent number: 6931914
    Abstract: A combustion condition detecting apparatus for an internal combustion engine has a current distributor that distributes an ion current, a band pass filter which extracts a knock vibration component from a current distributor output, a knock determination section which outputs a knock pulse if the extracted knock vibration component is larger than a knock detection threshold value, a combustion determination section which outputs a combustion pulse when an current distributor output is larger than a combustion pulse threshold value, an ignition signal determination section which makes a determination on the basis of an ignition signal as to whether energization of an ignition coil for ignition in another cylinder is started, and an ion current limiting section which limits its ion current output to the current distributor during a predetermined time period after the start of energization of the ignition coil for ignition in the another cylinder.
    Type: Grant
    Filed: April 25, 2003
    Date of Patent: August 23, 2005
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Masakazu Dohi, Toshio Uchida, Yoshiyuki Sera, Yasuhiro Takahashi
  • Publication number: 20040154703
    Abstract: A high strength Mg based alloy and a Mg based casting alloy having a good fluidity and a good mechanical property, and are used to provide a molded article using the alloy. A high strength Mg based alloy, which contains 12 to 20% of Al by weight; 0.1 to 10% of Zn; 0.1 to 15% of Sn; and 0.05 to 1.5% of Mn is used by being injection molded.
    Type: Application
    Filed: December 31, 2003
    Publication date: August 12, 2004
    Inventors: Kiyomi Nakamura, Teruo Hirane, Toshio Uchida, Teruyoshi Abe
  • Patent number: D697760
    Type: Grant
    Filed: February 28, 2013
    Date of Patent: January 21, 2014
    Assignee: Ishizuka Glass Kabushiki Kaisha
    Inventor: Toshio Uchida
  • Patent number: D697761
    Type: Grant
    Filed: February 28, 2013
    Date of Patent: January 21, 2014
    Assignee: Ishizuka Glass Kabushiki Kaisha
    Inventor: Toshio Uchida