Patents by Inventor Toshio Uchida
Toshio Uchida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12140430Abstract: A sensor device includes a sensor element, a supporting member, a substrate, and a bonding wire. The supporting member is electrically connected to the sensor element. The substrate is electrically connected to the supporting member. The bonding wire forms at least part of a connection path that electrically connects the sensor element and the supporting member together. The substrate and an installation member on which the sensor element is installed intersect with each other. The sensor element and the supporting member are separated from each other.Type: GrantFiled: November 6, 2020Date of Patent: November 12, 2024Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Hideki Ueda, Yusuke Nakamura, Koichiro Nakashima, Takashi Uchida, Toshio Yamazaki, Hiroyuki Fujii, Chikara Nara
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Patent number: 9421605Abstract: An object is to propose a mold release agent improving the state of a mold surface by repeating casting cycle so as to extend the life of the metal mold actively, and a casting method using the mold release agent. A water-soluble mold release agent applied on a mold surface of a metal mold contains organic acid or organic acid salt which is reducing and ligand, wherein concentration of a total thereof is not less than 0.01 wt % in using concentration and is not more than a fixed concentration which is stability limit of emulsion of the mold release agent in undiluted concentration. Construction weight ratio of the organic acid or organic acid salt which is reducing and the ligand is in the range from 99/1 to 30/70.Type: GrantFiled: October 23, 2006Date of Patent: August 23, 2016Assignee: Toyota Jidosha Kabushiki KaishaInventors: Yuichi Furukawa, Toshio Uchida, Setsuyu Hayakawa
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Patent number: 9139745Abstract: The present invention provides an aggregate of spherical core-shell cerium oxide/polymer hybrid nanoparticles, a process for producing the same, and a product such as an anti-reflection film having a high refractive index layer.Type: GrantFiled: July 23, 2010Date of Patent: September 22, 2015Assignee: National Institute of Advanced Industrial Science and TechnologyInventors: Noriya Izu, Toshio Uchida, Ichiro Matsubara, Toshio Itoh, Woosuck Shin, Maiko Nishibori
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Patent number: 8846785Abstract: The invention provides a method for manufacturing spherical, monodispersed core-shell type ceria-polymer hybrid nanoparticles including, a mixing step in which a cerium salt and a polymer are mixed together in a high-boiling-point organic solvent to obtain a mixture, and a heating and reflux step in which this mixture is heated and refluxed at a temperature of 110° C. or more to thereby generate a boiling phenomenon in the heating and reflux step, and rapidly cooling the mixture after the heating and reflux step to precipitate cerium oxide, and a liquid dispersion thereof.Type: GrantFiled: December 23, 2009Date of Patent: September 30, 2014Assignee: National Institute of Advanced Industrial Science and TechnologyInventors: Noriya Izu, Ichiro Matsubara, Toshio Itoh, Woosuck Shin, Maiko Nishibori, Toshio Uchida
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Publication number: 20130158850Abstract: Evaluation display systems, methods, and programs display a current position of a vehicle on a map around on a display unit. The systems, methods, and programs acquire a current evaluation indicating a fuel efficiency evaluation of each unit interval in a current travel of the vehicle, and acquire a past evaluation indicating a fuel efficiency evaluation of the each unit interval in a past travel that is earlier than the current travel. The systems, methods, and programs display the current evaluation and the past evaluation of each unit interval on the map and, if a distance between the current position of the vehicle and a display position of at least one past evaluation on the map becomes equal to or smaller than a predetermined distance, erases the at least one past evaluation from the map.Type: ApplicationFiled: October 23, 2012Publication date: June 20, 2013Inventors: Toshio UCHIDA, Toru SAKAI, Naoki MIURA
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Patent number: 8223496Abstract: A power supply unit of an arc discharge device includes a semiconductor module 1 and a radiator fitted onto the semiconductor module 1. The semiconductor module 1 includes a module casing 2 and common units 3a to 3c retained by the module casing 2. Each of the common units 3a to 3c has: a ceramic substrate 50 having a circuit surface disposed with a semiconductor element 54 and a radiation surface on a side opposite to the circuit surface and a package 35 that exposes the radiation surface and seals the circuit surface with heat resistant resin. The radiator is fitted onto the module casing 2 to be thereby brought into abutting contact with all of the radiation surfaces of the common units 3a to 3c.Type: GrantFiled: May 18, 2007Date of Patent: July 17, 2012Assignee: Sansha Electric Manufacturing Co., Ltd.Inventors: Osamu Soda, Yuji Ohnishi, Kazunori Inami, Toshio Uchida
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Publication number: 20120142808Abstract: The present invention provides an aggregate of spherical core-shell cerium oxide/polymer hybrid nanoparticles, a process for producing the same, and a product such as an anti-reflection film having a high refractive index layer.Type: ApplicationFiled: July 23, 2010Publication date: June 7, 2012Applicant: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGYInventors: Noriya Izu, Toshio Uchida, Ichiro Matsubara, Toshio Itoh, Woosuck Shin, Maiko Nishibori
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Patent number: 7994635Abstract: To suppress warpage of a ceramic substrate, and to prevent a reduction in radiation efficiency. A power semiconductor module includes a module casing fitted with a radiator, and a common unit retained by the module casing. The common unit has: a ceramic substrate having a circuit surface disposed with a semiconductor element, and a radiation surface brought into abutting contact with the radiator; and a package formed by exposing the radiation surface and sealing the circuit surface with heat resistant resin. The circuit surface and the radiation surface are respectively formed of metal layers 51 formed on the ceramic substrate, and the metal layer 51 forming the radiation surface has: by forming a buffer pattern 512 including a groove part extending along a circumferential part thereof, a radiation pattern 510 formed on an inner side of the buffer pattern 512; and an outer peripheral pattern 511 formed on an outer side of the buffer pattern 512.Type: GrantFiled: May 18, 2007Date of Patent: August 9, 2011Assignee: Sansha Electric Manufacturing Co., Ltd.Inventors: Osamu Soda, Yuji Ohnishi, Kazunori Inami, Toshio Uchida
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Patent number: 7948424Abstract: In order to provide a radio wave absorber that can be produced easily and has excellent radio wave absorption characteristics, a conductive surface 2 of a conductive paint 6 is formed on one surface 1a of a mat-shaped inorganic fiber bulk material 1.Type: GrantFiled: August 23, 2007Date of Patent: May 24, 2011Assignees: Mitsubishi Cable Industries, Ltd., Asahi Building-Wall Co., Ltd., Asahi Fiber Glass Co., Ltd.Inventors: Toshio Kudo, Toshio Uchida, Akira Inoue, Kazuaki Yagi
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Publication number: 20110042029Abstract: An object is to propose a mold release agent improving the state of a mold surface by repeating casting cycle so as to extend the life of the metal mold actively, and a casting method using the mold release agent. A water-soluble mold release agent applied on a mold surface of a metal mold contains organic acid or organic acid salt which is reducing and ligand, wherein concentration of a total thereof is not less than 0.01 wt % in using concentration and is not more than a fixed concentration which is stability limit of emulsion of the mold release agent in undiluted concentration. Construction weight ratio of the organic acid or organic acid salt which is reducing and the ligand is in the range from 99/1 to 30/70.Type: ApplicationFiled: October 23, 2006Publication date: February 24, 2011Applicants: TOYOTA JIDOSHA KABUSHIKI KAISHA, TETRA CO., LTDInventors: Yuichi Furukawa, Toshio Uchida, Setsuyu Hayakawa
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Publication number: 20100209710Abstract: The invention provides a method for manufacturing spherical, monodispersed core-shell type ceria-polymer hybrid nanoparticles including, a mixing step in which a cerium salt and a polymer are mixed together in a high-boiling-point organic solvent to obtain a mixture, and a heating and reflux step in which this mixture is heated and refluxed at a temperature of 110° C. or more to thereby generate a boiling phenomenon in the heating and reflux step, and rapidly cooling the mixture after the heating and reflux step to precipitate cerium oxide, and a liquid dispersion thereof.Type: ApplicationFiled: December 23, 2009Publication date: August 19, 2010Applicant: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGYInventors: Noriya IZU, Ichiro Matsubara, Toshio Itoh, Woosuck Shin, Maiko Nishibori, Toshio Uchida
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Publication number: 20100182188Abstract: In order to provide a radio wave absorber that can be produced easily and has excellent radio wave absorption characteristics, a conductive surface 2 of a conductive paint 6 is formed on one surface 1a of a mat-shaped inorganic fiber bulk material 1.Type: ApplicationFiled: August 23, 2007Publication date: July 22, 2010Inventors: Toshio Kudo, Toshio Uchida, Akira Inoue, Kazuaki Yagi
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Publication number: 20100127387Abstract: [Summary] [Object] To suppress warpage of a ceramic substrate, and to prevent a reduction in radiation efficiency. [Means for Settlement] A power semiconductor module includes a module casing fitted with a radiator, and a common unit retained by the module casing. The common unit has: a ceramic substrate having a circuit surface disposed with a semiconductor element, and a radiation surface brought into abutting contact with the radiator; and a package formed by exposing the radiation surface and sealing the circuit surface with heat resistant resin. The circuit surface and the radiation surface are respectively formed of metal layers 51 formed on the ceramic substrate, and the metal layer 51 forming the radiation surface has: by forming a buffer pattern 512 including a groove part extending along a circumferential part thereof, a radiation pattern 510 formed on an inner side of the buffer pattern 512; and an outer peripheral pattern 511 formed on an outer side of the buffer pattern 512.Type: ApplicationFiled: May 18, 2007Publication date: May 27, 2010Applicant: Sansha Electric Manufacturing Co., Ltd.Inventors: Osamu Soda, Yuki Ohnishi, Kazunori Inami, Toshio Uchida
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Publication number: 20100128441Abstract: [Object] To incorporate more semiconductor elements in a small-sized lightweight power semiconductor module provided in an arc discharge device. [Means for Settlement] A power supply unit of an arc discharge device includes a semiconductor module 1, and a radiator fitted onto the semiconductor module 1. The semiconductor module 1 includes a module casing 2, and common units 3a to 3c retained by the module casing 2. Each of the common units 3a to 3c has: a ceramic substrate 50 having a circuit surface disposed with a semiconductor element 54, and a radiation surface on a side opposite to the circuit surface; and a package 35 that exposes the radiation surface, and seals the circuit surface with heat resistant resin. The radiator is fitted onto the module casing 2 to be thereby brought into abutting contact with all of the radiation surfaces of the common units 3a to 3c. Based on such a configuration, more semiconductor elements can be incorporated in a small-sized lightweight power semiconductor module.Type: ApplicationFiled: May 18, 2007Publication date: May 27, 2010Applicant: Sansha Electric Manufacturing Co., LTdInventors: Osamu Soda, Yuji Ohnishi, Kazunori Inami, Toshio Uchida
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Patent number: 7491079Abstract: A connector includes i) a plug including a pair of connecting members configured to connect the plug to a socket, a through-hole formed at a portion between the pair of connecting members, and plug contacts arranged on outer side faces of the respective connecting members, ii) a socket including a recess portion configured to receive the plug, and socket contacts arranged on inner side faces of the recess portion, and iii) a locking member configured to lock the plug into the socket, expanding the pair of the connecting members outward so as to contact each of the outer side faces of the connecting members onto a corresponding one of the inner side faces of the recess portion by inserting between the pair of the connecting members via the through-hole, and thereby bringing the plug contacts into contact with the socket contacts.Type: GrantFiled: July 6, 2007Date of Patent: February 17, 2009Assignee: NEC LCD Technologies, LtdInventor: Toshio Uchida
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Publication number: 20080009160Abstract: A connector includes i) a plug including a pair of connecting members configured to connect the plug to a socket, a through-hole formed at a portion between the pair of connecting members, and plug contacts arranged on outer side faces of the respective connecting members, ii) a socket including a recess portion configured to receive the plug, and socket contacts arranged on inner side faces of the recess portion, and iii) a locking member configured to lock the plug into the socket, expanding the pair of the connecting members outward so as to contact each of the outer side faces of the connecting members onto a corresponding one of the inner side faces of the recess portion by inserting between the pair of the connecting members via the through-hole, and thereby bringing the plug contacts into contact with the socket contacts.Type: ApplicationFiled: July 6, 2007Publication date: January 10, 2008Applicant: NEC LCD TECHNOLOGIES, LTD.Inventor: Toshio Uchida
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Patent number: 6931914Abstract: A combustion condition detecting apparatus for an internal combustion engine has a current distributor that distributes an ion current, a band pass filter which extracts a knock vibration component from a current distributor output, a knock determination section which outputs a knock pulse if the extracted knock vibration component is larger than a knock detection threshold value, a combustion determination section which outputs a combustion pulse when an current distributor output is larger than a combustion pulse threshold value, an ignition signal determination section which makes a determination on the basis of an ignition signal as to whether energization of an ignition coil for ignition in another cylinder is started, and an ion current limiting section which limits its ion current output to the current distributor during a predetermined time period after the start of energization of the ignition coil for ignition in the another cylinder.Type: GrantFiled: April 25, 2003Date of Patent: August 23, 2005Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Masakazu Dohi, Toshio Uchida, Yoshiyuki Sera, Yasuhiro Takahashi
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Publication number: 20040154703Abstract: A high strength Mg based alloy and a Mg based casting alloy having a good fluidity and a good mechanical property, and are used to provide a molded article using the alloy. A high strength Mg based alloy, which contains 12 to 20% of Al by weight; 0.1 to 10% of Zn; 0.1 to 15% of Sn; and 0.05 to 1.5% of Mn is used by being injection molded.Type: ApplicationFiled: December 31, 2003Publication date: August 12, 2004Inventors: Kiyomi Nakamura, Teruo Hirane, Toshio Uchida, Teruyoshi Abe
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Patent number: D697760Type: GrantFiled: February 28, 2013Date of Patent: January 21, 2014Assignee: Ishizuka Glass Kabushiki KaishaInventor: Toshio Uchida
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Patent number: D697761Type: GrantFiled: February 28, 2013Date of Patent: January 21, 2014Assignee: Ishizuka Glass Kabushiki KaishaInventor: Toshio Uchida