Abstract: A wiring substrate (1) comprises an insulating base (10) with connection holes (11), buried conductors (12) provided in the connection holes (11) without reaching a rear surface of the insulating base (10), and wiring layers 14 connected to the buried conductors (12). The buried conductors (12) thicken the wiring layers (14), and can form aligning parts (110) on the rear surface of the connection holes (11) to be used for three-dimensional mounting structure. Each wiring layer (14) includes thin terminals (14A), wirings (14B) and thick electrodes (14C). Not only the terminals (14A) and wirings (14B) but also the buried conductors (12) are raised by the same manufacturing process. A semiconductor element (2) is attached to the electrodes (14C) of the wiring substrate (1).

Abstract: A wiring substrate (1) comprises an insulating base (10) with connection holes (11), buried conductors (12) provided in the connection holes (11) without reaching a rear surface of the insulating base (10), and wiring layers 14 connected to the buried conductors (12). The buried conductors (12) thicken the wiring layers (14), and can form aligning parts (110) on the rear surface of the connection holes (11) to be used for three-dimensional mounting structure. Each wiring layer (14) includes thin terminals (14A), wirings (14B) and thick electrodes (14C). Not only the terminals (14A) and wirings (14B) but also the buried conductors (12) are raised by the same manufacturing process. A semiconductor element (2) is attached to the electrodes (14C) of the wiring substrate (1).

Abstract: A semiconductor package substrate is provided, which can meet the move toward high integration of semiconductors. A nickel layer is plated on an electroplated copper foil to form a wiring pattern. An LSI chip is mounted on the copper foil, and terminals of the LSI chip and the wiring pattern are connected by wire bonding, followed by sealing with a semiconductor-sealing epoxy resin. Only the copper foil is dissolved away with an alkali etchant to expose nickel. With a nickel stripper having low copper-dissolving power, the nickel layer is removed to expose the wiring pattern. A solder resist is coated, and a pattern is formed in such a way that connecting terminal portions are exposed. Solder balls are placed at the exposed portions of the wiring pattern and are then fused. The wiring pattern is connected to an external printed board via the solder balls.

Abstract: A moving-picture conversion apparatus includes a block generator configured to generate blocks by dividing each frame forming moving picture data into the blocks, an amount-of-movement detector configured to detect an amount of movement of a subject corresponding to each block generated by the block generator, a block processor configured to receive the blocks generated by the block generator and information concerning the amount of movement detected by the amount-of-movement detector to perform decimation processing on the blocks, and a packing processor configured to receive the blocks decimated by the block processor to generate a packed block including pixel data forming the decimated blocks. The packing processor generates a packed block by correcting positions of pixels forming the packed block substantially to relative positions of the corresponding pixels forming an original image.

Abstract: A silicone rubber coating composition comprising (A) a diorganopolysiloxane containing an average of at least two alkenyl groups, (B) silica powder having a specific surface area of at least 50 m2/g, (C) an organosilicon compound containing a ureido group, an isocyanuric acid ester modified with an organosilicon compound or a (partial) hydrolytic condensate thereof, and (D) a curing agent is applied and vulcanized to base fabric to form a coated fabric, from which airbags are prepared. The composition has a sufficient adhesion to withstand high temperature and abrupt elongation upon inflation of the airbag even after long-term storage under hot humid conditions.

Abstract: A process for preparing an urethane compound for medical instruments, characterized by reacting a hydroxyl compound (A) with an isocyanate compound (B) in the absence of a catalyst or in the presence of a reaction catalyst other than an organic tin compound to give an urethane compound (I). According to the process, the urethane compound showing high safety can be easily prepared, in particular, while molecular weight of the compound is controlled.

Abstract: A process for preparing an ocular lens with a urethane compound comprising the steps of a) preparing a urethane compound by reacting at least one hydroxyl compound and at least one isocyanate compound in the presence of an organic iron compound, b) removing the organic iron compound from the urethane compound obtained in the step a) c) mixing the urethane compound obtained in the step b) with at least one compound selected from the group consisting of another copolymerizable compound, a crosslinking agent, a UV absorbent, a dye, a polymerization initiator, a photosensitizer, and an organic solvent to obtain a mixture, and d) curing the mixture obtained in the step c) to prepare a lens.

Abstract: A semiconductor package substrate is provided, which can meet the move toward high integration of semiconductors. A nickel layer is plated on an electroplated copper foil to form a wiring pattern. An LSI chip is mounted on the copper foil, and terminals of the LSI chip and the wiring pattern are connected by wire bonding, followed by sealing with a semiconductor-sealing epoxy resin. Only the copper foil is dissolved away with an alkali etchant to expose nickel. With a nickel stripper having low copper-dissolving power, the nickel layer is removed to expose the wiring pattern. A solder resist is coated, and a pattern is formed in such a way that connecting terminal portions are exposed. Solder balls are placed at the exposed portions of the wiring pattern and are then fused. The wiring pattern is connected to an external printed board via the solder balls.

Abstract: A semiconductor package substrate is provided, which can meet the move toward high integration of semiconductors. A nickel layer is plated on an electroplated copper foil to form a wiring pattern. An LSI chip is mounted on the copper foil, and terminals of the LSI chip and the wiring pattern are connected by wire bonding, followed by sealing with a semiconductor-sealing epoxy resin. Only the copper foil is dissolved away with an alkali etchant to expose nickel. With a nickel stripper having low copper-dissolving power, the nickel layer is removed to expose the wiring pattern. A solder resist is coated, and a pattern is formed in such a way that connecting terminal portions are exposed. Solder balls are placed at the exposed portions of the wiring pattern and are then fused. The wiring pattern is connected to an external printed board via the solder balls.

Abstract: An angular velocity of the present invention includes a resonator formed of a resonating member and a connecting member, a first base connected to the connecting member, a holding plate to hold the first base, a circuit board fixed onto the holding plate, an elastic body disposed on an end part of at least one selected from the holding plate and circuit board, a case housing the resonator, first base, holding plate, circuit board and elastic body and provided with an opening, and a second base put in place so as to close the opening of the case. The resonator has a short side and a long side.

Abstract: A wiring substrate (1) comprises an insulating base (10) with connection holes (11), buried conductors (12) provided in the connection holes (11) without reaching a rear surface of the insulating base (10), and wiring layers 14 connected to the buried conductors (12). The buried conductors (12) thicken the wiring layers (14), and can form aligning parts (110) on the rear surface of the connection holes (11) to be used for three-dimensional mounting structure. Each wiring layer (14) includes thin terminals (14A), wirings (14B) and thick electrodes (14C). Not only the terminals (14A) and wirings (14B) but also the buried conductors (12) are raised by the same manufacturing process. A semiconductor element (2) is attached to the electrodes (14C) of the wiring substrate (1).

Abstract: A process for preparing an ocular lens with a urethane compound comprising the steps of

Abstract: A process for preparing an urethane compound for medical instruments, characterized by reacting a hydroxyl compound (A) with an isocyanate compound (B) in the absence of a catalyst or in the presence of a reaction catalyst other than an organic tin compound to give an urethane compound (I). According to the process, the urethane compound showing high safety can be easily prepared, in particular, while molecular weight of the compound is controlled.

Abstract: A process for preparing an urethane compound for medical instruments, characterized by reacting a hydroxyl compound (A) with an isocyanate compound (B) in the absence of a catalyst or in the presence of a reaction catalyst other than an organic tin compound to give an urethane compound (I). According to the process, the urethane compound showing high safety can be easily prepared, in particular, while molecular weight of the compound is controlled.

Abstract: An angular velocity of the present invention includes a resonator formed of a resonating member and a connecting member, a first base connected to the connecting member, a holding plate to hold the first base, a circuit board fixed onto the holding plate, an elastic body disposed on an end part of at least one selected from the holding plate and circuit board, a case housing the resonator, first base, holding plate, circuit board and elastic body and provided with an opening, and a second base put in place so as to close the opening of the case. The resonator has a short side and a long side.

Abstract: A semiconductor device fabrication process comprising an encapsulation step of carrying out encapsulation by vacuum pressure differential printing by the use of a liquid resin encapsulant containing a solvent in an amount of from 5% by weight to 50% by weight, and preferably from 25% by weight to 50% by weight. The encapsulation step comprises: printing the liquid resin encapsulant by vacuum pressure differential printing in such a way that; the encapsulant covers at least an internal connecting terminal provided on a substrate, a semiconductor chip, and a wire interconnecting the internal connecting terminal and the semiconductor chip; and that the thickness of the encapsulant lying above the wire at the highest position of the wire comes to be at least 0.8 times the thickness of the encapsulant lying beneath the wire at the same position; and curing or drying the encapsulant.

Abstract: A personal cleansing sheet with which the skin and hair can be easily cleansed of oily soils such as sebum and aqueous soils such as sweat or salts, has a structure in which an oily substance absorption layer that serves as a region that absorbs oil substances is laminated with an aqueous cleansing liquid retention layer that serves as a region that retains an aqueous cleansing liquid.

Abstract: A semiconductor package substrate is provided, which can meet the move toward high integration of semiconductors. A nickel layer is plated on an electroplated copper foil to form a wiring pattern. An LSI chip is mounted on the copper foil, and terminals of the LSI chip and the wiring pattern are connected by wire bonding, followed by sealing with a semiconductor-sealing epoxy resin. Only the copper foil is dissolved away with an alkali etchant to expose nickel. With a nickel stripper having low copper-dissolving power, the nickel layer is removed to expose the wiring pattern. A solder resist is coated, and a pattern is formed in such a way that connecting terminal portions are exposed. Solder balls are placed at the exposed portions of the wiring pattern and are then fused. The wiring pattern is connected to an external printed board via the solder balls.

Abstract: A coating composition comprising (A) a urethane polymer having at least one aliphatic unsaturated hydrocarbon group on a side chain in a molecule, (B) an organohydrogenpolysiloxane having at least two hydrosilyl groups in a molecule, and (C) a hydrosilylation catalyst firmly bonds to surfaces of various substrates, especially silicone rubber substrates, without a need for pre-treatment and readily forms thereon a surface protective layer having wear resistance. A silicone rubber member in which a silicone rubber substrate is coated on its surface with the inventive coating composition is endowed on the surface with wear resistance and is useful as silicone rubber key pads and silicone rubber rolls.

Abstract: A semiconductor package substrate is provided, which can meet the move toward high integration of semiconductors. A nickel layer is plated on an electroplated copper foil to form a wiring pattern. An LSI chip is mounted on the copper foil, and terminals of the LSI chip and the wiring pattern are connected by wire bonding, followed by sealing with a semiconductor-sealing epoxy resin. Only the copper foil is dissolved away with an alkali etchant to expose nickel. With a nickel stripper having low copper-dissolving power, the nickel layer is removed to expose the wiring pattern. A solder resist is coated, and a pattern is formed in such a way that connecting terminal portions are exposed. Solder balls are placed at the exposed portions of the wiring pattern and are then fused. The wiring pattern is connected to an external printed board via the solder balls.