Abstract: A coil-embedded ceramic substrate includes a plurality of ceramic layers including multi-turn coil patterns provided thereon. At least one ceramic layer of the plurality of ceramic layers includes thereon a multi-turn coil pattern and dummy patterns not electrically connected to the multi-turn coil pattern. The multi-turn coil pattern winds around and extends parallel or substantially parallel to sides of the ceramic layer. The dummy patterns are each parallel or substantially parallel to corresponding ones of the sides of the ceramic layer as an extension of portion of the coil pattern in an extending direction.

Abstract: A resin multilayer substrate includes a first resin layer including a thermoplastic resin as a main material, a second resin layer including the thermoplastic resin as a main material and superposed on the first resin layer, a first interlayer-connection conductor passing through the first resin layer in a thickness direction, and a first conductor pattern at an area including a region in which the first interlayer-connection conductor is exposed at the surface of the first resin layer between the first resin layer and the second resin layer. The first conductor pattern includes a portion in or at which a portion of the first interlayer-connection conductor is disposed. The first conductor pattern includes a first portion covering the region exposed at the surface of the first resin layer; and a second portion disposed surrounding the first portion. The first portion and the second portion have different thicknesses from each other.

Abstract: A module includes a wiring board, an insulating layer that is laminated on the bottom surface of the wiring board, a ring-shaped coil core that is embedded in the insulating layer, a coil electrode that is wound around the coil core, electronic components that are disposed in an inner region surrounded by the coil core in the insulating layer, and an electronic component that is mounted on or in the top surface of the wiring board. With this configuration, the areas of main surfaces of the wiring board and main surfaces of the insulating layer are not large, whereas if the electronic components were mounted on or in the top surface of the wiring board, the areas of the main surfaces of the wiring board and the main surfaces of the insulating layer would be large, and a reduction in the size of the module can be facilitated.

Abstract: A coil-embedded ceramic substrate includes a plurality of ceramic layers including multi-turn coil patterns provided thereon. At least one ceramic layer of the plurality of ceramic layers includes thereon a multi-turn coil pattern and dummy patterns not electrically connected to the multi-turn coil pattern. The multi-turn coil pattern winds around and extends parallel or substantially parallel to sides of the ceramic layer. The dummy patterns are each parallel or substantially parallel to corresponding ones of the sides of the ceramic layer as an extension of portion of the coil pattern in an extending direction.

Abstract: A component-embedded substrate includes a multilayer body including a plurality of insulating layers stacked in a stacking direction, an embedded component embedded in the multilayer body, and planar conductors disposed on both sides of the embedded component in the stacking direction, the planar conductors overlapping the embedded component. The planar conductors each include a plurality of openings that overlap the embedded component over substantially the entire region occupied by the embedded component, as seen in the stacking direction.

Abstract: A resin substrate includes a first portion including a plurality of resin sheets provided at one end in a stacking direction and a second portion including a plurality of resin sheets provided at the other end in the stacking direction. The thickness of the plurality of resin sheets is the same or substantially the same as the thickness of the first portion and the second portion. The density of planar conductor patterns of the first portion with respect to the volume of the first portion is lower than the density of planar conductor patterns of the second portion with respect to the volume of the second portion. The average of the diameters of the first interlayer connection conductor provided in the first portion is greater than the average of the diameters of the second interlayer connection conductor provided in the second portion.

Abstract: A resin substrate includes a first portion including a plurality of resin sheets provided at one end in a stacking direction and a second portion including a plurality of resin sheets provided at the other end in the stacking direction. The thickness of the plurality of resin sheets is the same or substantially the same as the thickness of the first portion and the second portion. The density of planar conductor patterns of the first portion with respect to the volume of the first portion is lower than the density of planar conductor patterns of the second portion with respect to the volume of the second portion. The average of the diameters of the first interlayer connection conductor provided in the first portion is greater than the average of the diameters of the second interlayer connection conductor provided in the second portion.

Abstract: A resin multilayer substrate includes a first resin layer including a thermoplastic resin as a main material, a second resin layer including the thermoplastic resin as a main material and superposed on the first resin layer, a first interlayer-connection conductor passing through the first resin layer in a thickness direction, and a first conductor pattern at an area including a region in which the first interlayer-connection conductor is exposed at the surface of the first resin layer between the first resin layer and the second resin layer. The first conductor pattern includes a portion in or at which a portion of the first interlayer-connection conductor is disposed. The first conductor pattern includes a first portion covering the region exposed at the surface of the first resin layer; and a second portion disposed surrounding the first portion. The first portion and the second portion have different thicknesses from each other.

Abstract: A component-embedded substrate includes a laminate and an electronic component. The electronic component is embedded in the laminate. The laminate includes a frame-shaped conductor pattern. When the laminate is viewed in a laminating direction, the frame-shaped conductor pattern is arranged so as to substantially surround the entire periphery of the electronic component. The frame-shaped conductor pattern includes a first individual conductor pattern and a second individual conductor pattern. The first individual conductor pattern and the second individual conductor pattern are separated from each other. The first individual conductor pattern is arranged close to a first external terminal electrode of the electronic component, and the second individual conductor pattern is arranged close to a second external terminal electrode of the electronic component.

Abstract: A component-embedded substrate includes: a resin substrate having a mount surface and a peripheral surface surrounding a perimeter of the mount surface; a first mounted component mounted on the mount surface; a second mounted component mounted on the mount surface and spaced from the first mounted component; a first chip-type electronic component disposed in the resin substrate; and a second chip-type electronic component disposed in the resin substrate and spaced from the first chip-type electronic component. The first and second chip-type electronic components are spaced from each other along a cross direction crossing an arrangement direction along which the first mounted component and the second mounted component that are arranged with respect to each other. The first and second chip-type electronic components are each arranged to cross the cross direction.

Abstract: A component-embedded substrate includes: a resin substrate having a mount surface and a peripheral surface surrounding a perimeter of the mount surface; a first mounted component mounted on the mount surface; a second mounted component mounted on the mount surface and spaced from the first mounted component; and a first embedded chip-type electronic component disposed in the resin substrate. The first embedded chip-type electronic component is located close to the peripheral surface of the resin substrate. The mount surface includes: a first region located between the first and second mounted components and extending along a cross direction crossing an arrangement direction along which the first and second mounted components are arranged with respect to each other; and a second region located outside the first region. The first embedded chip-type electronic component is arranged to extend in the first and second regions as seen from above the mount surface.

Abstract: A module includes a wiring board, an insulating layer that is laminated on the bottom surface of the wiring board, a ring-shaped coil core that is embedded in the insulating layer, a coil electrode that is wound around the coil core, electronic components that are disposed in an inner region surrounded by the coil core in the insulating layer, and an electronic component that is mounted on or in the top surface of the wiring board. With this configuration, the areas of main surfaces of the wiring board and main surfaces of the insulating layer are not large, whereas if the electronic components were mounted on or in the top surface of the wiring board, the areas of the main surfaces of the wiring board and the main surfaces of the insulating layer would be large, and a reduction in the size of the module can be facilitated.

Abstract: A component-embedded substrate includes a multilayer body including a plurality of insulating layers stacked in a stacking direction, an embedded component embedded in the multilayer body, and planar conductors disposed on both sides of the embedded component in the stacking direction, the planar conductors overlapping the embedded component. The planar conductors each include a plurality of openings that overlap the embedded component over substantially the entire region occupied by the embedded component, as seen in the stacking direction.

Abstract: A component-embedded substrate includes a laminate and an electronic component. The electronic component is embedded in the laminate. The laminate includes a frame-shaped conductor pattern. When the laminate is viewed in a laminating direction, the frame-shaped conductor pattern is arranged so as to substantially surround the entire periphery of the electronic component. The frame-shaped conductor pattern includes a first individual conductor pattern and a second individual conductor pattern. The first individual conductor pattern and the second individual conductor pattern are separated from each other. The first individual conductor pattern is arranged close to a first external terminal electrode of the electronic component, and the second individual conductor pattern is arranged close to a second external terminal electrode of the electronic component.

Abstract: A component-embedded substrate includes: a resin substrate having a mount surface and a peripheral surface surrounding a perimeter of the mount surface; a first mounted component mounted on the mount surface; a second mounted component mounted on the mount surface and spaced from the first mounted component; and a first embedded chip-type electronic component disposed in the resin substrate. The first embedded chip-type electronic component is located close to the peripheral surface of the resin substrate. The mount surface includes: a first region located between the first and second mounted components and extending along a cross direction crossing an arrangement direction along which the first and second mounted components are arranged with respect to each other; and a second region located outside the first region. The first embedded chip-type electronic component is arranged to extend in the first and second regions as seen from above the mount surface.

Abstract: A component-embedded substrate includes: a resin substrate having a mount surface and a peripheral surface surrounding a perimeter of the mount surface; a first mounted component mounted on the mount surface; a second mounted component mounted on the mount surface and spaced from the first mounted component; a first chip-type electronic component disposed in the resin substrate; and a second chip-type electronic component disposed in the resin substrate and spaced from the first chip-type electronic component. The first and second chip-type electronic components are spaced from each other along a cross direction crossing an arrangement direction along which the first mounted component and the second mounted component that are arranged with respect to each other. The first and second chip-type electronic components are each arranged to cross the cross direction.

Abstract: Disclosed is a ferritic stainless steel for hot-water tanks with welded structure, comprising, in terms of % by mass, at most 0.02% of C, from 0.01 to 0.30% of Si, at most 1% of Mn, at most 0.04% of P, at most 0.03% of S, from more than 21 to 26% of Cr, at most 2% of Mo, from 0.05 to 0.6% of Nb, from 0.05 to 0.4% of Ti, at most 0.025% of N, and from 0.02 to 0.3% of Al, and optionally containing at least one of at most 2%, preferably from 0.1 to 2% of Ni and at most 1%, preferably from 0.1 to 1% of Cu, with a balance of Fe and inevitable impurities.

Abstract: According to one embodiment, a system is provided, which provides moving picture data representing a road-traffic state. This system synthesizes the moving picture data with additional data such as advertisement data, generating output data. The system distributes the output data to the facilities built along the road and the vehicles running on the road.

Abstract: A hot water tank having, on the inner surface thereof, a back bead formed by TIG-welding with no back gas sealing of steel members to each other having a composition comprising, % by mass, C: at most 0.025%, Si: at most 1%, Mn: at most 1%, P: at most 0.045%, S: at most 0.01%, Ni: from 0.1 to 1%, Cr: from more than 21 to 25%, Mo: from 0.1 to 2%, Al: from 0.02 to 0.3%, N: at most 0.025%, and Cu: from 0 to 1%, and containing at least one of Ti: from 0.05 to 0.4% and Nb: from 0.05 to 0.5%, with the balance of Fe and inevitable impurities, wherein the Cr concentration in the steel basis material in the area having oxide scale soluble in an aqueous chloride solution, as formed therein in the heat-affected zone on the welded back side thereof, is at least 16% by mass in the depth region of at least 10 nm from the steel basis material/oxide scale interface.

Abstract: Disclosed is a ferritic stainless steel for hot-water tanks with welded structure, comprising, in terms of % by mass, at most 0.02% of C, from 0.01 to 0.30% of Si, at most 1% of Mn, at most 0.04% of P, at most 0.03% of S, from more than 21 to 26% of Cr, at most 2% of Mo, from 0.05 to 0.6% of Nb, from 0.05 to 0.4% of Ti, at most 0.025% of N, and from 0.02 to 0.3% of Al, and optionally containing at least one of at most 2%, preferably from 0.1 to 2% of Ni and at most 1%, preferably from 0.1 to 1% of Cu, with a balance of Fe and inevitable impurities.