Abstract: A tubular product comprises a side section having outer surfaces disposed along a parallelogram and a bottom section formed on one end of the side section. The outer surfaces of the side section are pressure formed by a roller. The tubular product preferably is manufactured from a tubular material by a process comprising the use of a device having a roller that is configured to engage with a side section of the tubular material. The device also comprises a mandrel configured to position the tubular material so that the roller can apply pressure against at least a portion of the outer surfaces of the side section and can extend the side section of the tubular material to form the product.

Abstract: A chemical mechanical polishing apparatus includes a container, a platen, first and second brushes, a polishing pad, a carrier, and a slurry supplier. The container has a bottom wall and a side wall. The side wall has an inwardly-extending upper portion. The platen is supported over the bottom wall. The platen is positioned lower than the inwardly-extending upper portion. The first brush brushes the side wall. The first brush is fixed to a side surface of the platen. The second brush brushes a side surface of the platen. The second brush is fixed to the bottom wall. The polishing pad is attached to the platen. The carrier presses a workpiece to be polished against the polishing pad. The slurry supplier supplies a slurry onto the polishing pad.

Abstract: Application data generated by an ECU is wireless transmitted by a transmission device in a subject vehicle so as to periodically change a communications distance by changing, every transmission timing, at least one of (i) a transmission rate, which is used in transforming a transmission packet into a transmission signal in a modulation section, and (ii) a transmission power, which is configured by an amplification section to amplify the transmission signal. As a result, the data transmission from the subject vehicle can be made (i) in high repetition times with respect to a nearby vehicle having a greater risk of collision (i.e., time to collision being shorter), and (ii) in low repetition times with respect to a distant vehicle having a less risk of collision (i.e., time to collision being longer).

Abstract: This polishing apparatus includes a head that holds a semiconductor wafer, a polishing pad that polishes a surface to be polished of the semiconductor wafer held by the head, and a dresser that reconditions the polishing pad by cutting the polishing pad. The polishing apparatus polishes a surface to be polished of the semiconductor wafer while causing the head and the polishing pad to rotate and reconditions the polishing pad by use of the dresser before and after polishing the surface to be polished. The polishing apparatus of the present invention supports at least two dressers so that the dressers can rotate on their own axes and further includes a dresser oscillator that causes the dressers to oscillate simultaneously on the polishing pad.

Abstract: A polishing apparatus includes a polishing pad for polishing a wafer and a polishing head for holding the wafer. The polishing head includes a retainer ring, a membrane sheet, and a head body. The retainer ring retains the wafer in a horizontal direction. The membrane sheet depresses the wafer to the polishing pad. The head body supports the retainer ring and the membrane sheet. The retainer ring includes a fixed retainer ring and a released retainer ring. The released retainer ring is interposed between the inner periphery of the fixed retainer ring and the periphery of the wafer to retain the wafer in the horizontal direction.

Abstract: An alignment mark structure includes a first pair of first side walls and a second pair of second side walls. The first pair of first side walls faces each other and extends in a first direction. The first pair of first side walls crosses a first data detection line. The second pair of second side walls faces each other and extends in a second direction being different from the first direction. The second pair of second side walls crosses the first data detection line.

Abstract: A communication device for acquiring a traffic information includes: a communicating element; a request message transmitting element for transmitting a request message, which includes a request vehicle identification information, a target zone information and an information for specifying the traffic information; a request message receiving element for receiving the request message; a request message transferring element for transferring the request message; a response message transmitting element for transmitting a response message when the automotive vehicle is disposed in the target zone and when the traffic information is capable of retrieving; a response message receiving element for receiving the response message; a response message transferring element for transferring the response message when a vehicle is not a request vehicle; and an outputting element for outputting the traffic information when the vehicle is the request vehicle.

Abstract: A dresser adapted to a chemical mechanical polishing apparatus is used to perform dressing on a polishing pad for polishing a semiconductor wafer such that a circular-shaped support surface thereof is positioned opposite to and in contact with the polishing surface of the polishing pad. In the dresser, at least three polish retainers having band-like shapes are formed and elongated in radial directions from substantially the center of the support surface so as to form a plurality of sectorial regions. A plurality of parallel portions are formed in parallel with the polish retainer in each sectorial region. A plurality of band-shaped non-polish retainers are formed between the polish retainer and its parallel portion in each sectorial region. The dresser ensures adequate fuzziness of the polishing pad by way of dressing; hence, it is possible to maintain desired polishing performance of the polishing pad for a long time.

Abstract: A polishing device includes a polishing pad for polishing a wafer and a polishing head for holding the wafer. The polishing head has a retainer ring for retaining the wafer in the in-plane direction of the wafer, a membrane sheet for pressing the wafer against the polishing pad, and a head body for supporting the retainer ring and the membrane sheet. The retainer ring has a subordinate retainer member having a ring portion and a plurality of fins extending from the ring portion to retain the peripheral surface of the wafer. The subordinate retainer member has a thickness equal to the thickness of the wafer. The membrane sheet has a diameter larger than the wafer, and presses the wafer and the vicinity of the inner edge of the subordinate retainer member.

Abstract: This polishing apparatus includes a head that holds a semiconductor wafer, a polishing pad that polishes a surface to be polished of the semiconductor wafer held by the head, and a dresser that reconditions the polishing pad by cutting the polishing pad. The polishing apparatus polishes a surface to be polished of the semiconductor wafer while causing the head and the polishing pad to rotate and reconditions the polishing pad by use of the dresser before and after polishing the surface to be polished. The polishing apparatus of the present invention supports at least two said dressers so that the dressers can rotate on their own axes and further includes a dresser oscillator that causes the dressers to oscillate simultaneously on the polishing pad.

Abstract: A dresser adapted to a chemical mechanical polishing apparatus is used to perform dressing on a polishing pad for polishing a semiconductor wafer such that a circular-shaped support surface thereof is positioned opposite to and in contact with the polishing surface of the polishing pad. In the dresser, at least three polish retainers having band-like shapes are formed and elongated in radial directions from substantially the center of the support surface so as to form a plurality of sectorial regions. A plurality of parallel portions are formed in parallel with the polish retainer in each sectorial region. A plurality of band-shaped non-polish retainers are formed between the polish retainer and its parallel portion in each sectorial region. The dresser ensures adequate fuzziness of the polishing pad by way of dressing; hence, it is possible to maintain desired polishing performance of the polishing pad for a long time.

Abstract: A tubular product comprises a side section having outer surfaces disposed along a parallelogram and a bottom section formed on one end of the side section. The outer surfaces of the side section are pressure formed by a roller. The tubular product preferably is manufactured from a tubular material by a process comprising the use of a device having a roller that is configured to engage with a side section of the tubular material. The device also comprises a mandrel configured to position the tubular material so that the roller can apply pressure against at least a portion of the outer surfaces of the side section and can extend the side section of the tubular material to form the product.

Abstract: A polishing apparatus includes a polishing pad for polishing a wafer and a polishing head for holding the wafer. The polishing head includes a retainer ring, a membrane sheet, and a head body. The retainer ring retains the wafer in a horizontal direction. The membrane sheet depresses the wafer to the polishing pad. The head body supports the retainer ring and the membrane sheet. The retainer ring includes a fixed retainer ring and a released retainer ring. The released retainer ring is interposed between the inner periphery of the fixed retainer ring and the periphery of the wafer to retain the wafer in the horizontal direction.

Abstract: A functional membrane and a production method thereof including: an ion irradiation step in which a polymer film substrate is irradiated with high energy heavy ions at 10 4 to 10 14 ions/cm2, to generate active species in the film substrate; and a graft polymerization step in which after the ion irradiation step, the film substrate is added with one or more monomers selected from a group A consisting of monomers each having a functional group and 1 to 80 mol % of a monomer including a group B consisting of a crosslinking agent(s) for the group A monomer(s), and the film substrate and the monomer(s) are graft-polymerized. There is obtained a functional membrane having high functionality in conjunction with the gas barrier property intrinsically possessed by a polymer film substrate, in particular, a polymer electrolyte membrane optimal as a polymer electrolyte membrane for use in fuel cells, high in proton conductivity and excellent in gas barrier property.

Abstract: A functional membrane is provided, which has high functionality combined with the gas barrier performance and mechanical strength inherent in a polymer film substrate. In particular, a polymer electrolyte membrane is provided, which is excellent in terms of high proton conductivity and gas barrier performance and is most appropriate to serve as a polymer electrolyte membrane for fuel cells. A method for producing a functional membrane is provided, which comprises: a step of ion irradiation, in which active species are generated in a polymer film substrate containing nonconductive inorganic particles by irradiating the polymer film substrate with high-energy heavy ions to the extent of 104/cm2 to 1014/cm2; and a step of graft polymerization subsequent to the step of ion irradiation, in which one or more monomers selected from group A consisting of monomers containing useful functional groups are added such that the monomers are graft polymerized with the polymer film substrate.

Abstract: A polishing device includes a polishing pad for polishing a wafer and a polishing head for holding the wafer. The polishing head has a retainer ring for retaining the wafer in the in-plane direction of the wafer, a membrane sheet for pressing the wafer against the polishing pad, and a head body for supporting the retainer ring and the membrane sheet. The retainer ring has a subordinate retainer member having a ring portion and a plurality of fins extending from the ring portion to retain the peripheral surface of the wafer. The subordinate retainer member has a thickness equal to the thickness of the wafer. The membrane sheet has a diameter larger than the wafer, and presses the wafer and the vicinity of the inner edge of the subordinate retainer member.

Abstract: A polishing device includes a polishing head for pressing and holding a semiconductor wafer, a pair of polishing pads having the same diameter as the polishing head for polishing the semiconductor wafer, and a subordinate polishing pad having a smaller diameter for polishing a peripheral portion of the semiconductor wafer. Both the pair of polishing pads are rotated in one direction, or in opposite directions. The rotational speed of the first and/or second polishing pad is controlled so that an equal polishing rate is obtained for the first and second polishing pads when the polishing pads are rotated in opposite directions.

Abstract: Improved polymer-based materials are described, for example for use as an electrode binder in a fuel cell. A fuel cell according to an example of the present invention comprises a first electrode including a catalyst and an electrode binder, a second electrode, and an electrolyte located between the first electrode and the second electrode. The electrolyte may be a proton-exchange membrane (PEM). The electrode binder includes one or more polymers, such as a polyphosphazene.

Abstract: A polishing equipment includes a polishing head mounting thereon a wafer and a polishing pad having a polishing surface for polishing the wafer. The polishing surface has a groove for guiding slurry on the polishing surface. The groove has a depth larger in the intermediate area of the polishing surface than in the central area and peripheral area of the polishing surface, in consideration of a higher abrasion rate of the polishing surface in the intermediate area in which the polishing surface is abraded in a larger amount.

Abstract: A communication device for acquiring a traffic information includes: a communicating element; a request message transmitting element for transmitting a request message, which includes a request vehicle identification information, a target zone information and an information for specifying the traffic information; a request message receiving element for receiving the request message; a request message transferring element for transferring the request message; a response message transmitting element for transmitting a response message when the automotive vehicle is disposed in the target zone and when the traffic information is capable of retrieving; a response message receiving element for receiving the response message; a response message transferring element for transferring the response message when a vehicle is not a request vehicle; and an outputting element for outputting the traffic information when the vehicle is the request vehicle.