Abstract: Provided are a circuit board with enhanced moisture resist and the method of manufacturing the circuit board, and a circuit device and a method of manufacturing the circuit device. A circuit board of the present invention includes: a substrate; wirings formed on the main surface of the substrate; a cover layer covering the wirings excluding the regions to be connectors; back electrodes formed on the bottom surface of the substrate; and through-hole electrodes formed so as to penetrate the substrate, and thereby connecting the wirings and the back electrodes. On surfaces of each of the wirings in this circuit board, convex portions on the periphery of the substrate are set larger in width than convex portions in a center portion of the substrate. With this configuration, adhesion reliability between the wirings and the cover layer under a thermal cycle load can be enhanced.

Abstract: In case of printing a stamp logotype in a constitution in which a distance from a printing position to a cutting position is relatively short, it is designed to prevent useless space from being formed at the top region of a receipt and to appropriate relatively wide area for a stamp logotype printing region. A printer controller controls a head and a cutter so that, when a length of the stamp logotype is longer than a distance L from the printing position of the head to the cutting position of the cutter, the image of the stamp logotype is divided into a first logotype A equal to the distance L and a remaining second logotype B, so as to have the logotype A printed on the receipt before a preceding receipt is cut, and the logotype B printed on the receipt after the preceding receipt is cut.