Abstract: A membrane-electrode assembly including an electrolyte membrane (1), a pair of catalyst layers (3, 3) facing each other sandwiching the electrolyte membrane (1), and a pair of gas diffusion layers facing each other sandwiching the electrolyte membrane (1) and the pair of catalyst layers (3, 3), wherein at least one of the pair of catalyst layers (3, 3) includes unwoven cloth (6A) including fiber-like structures (6) each having proton conduction performance, and wherein a portion of the unwoven cloth is buried in the electrolyte membrane (1) adjacent to the catalyst layer (3) including the unwoven cloth (6A).

Abstract: An engine includes a variable valve mechanism capable of switching a valve characteristic to a first valve characteristic according to which at least one of an operation of pre-opening an intake valve during an exhaust stroke prior to a valve opening time in an intake stroke and an operation of re-opening an exhaust valve during the intake stroke subsequently to the opening/closing thereof during the exhaust stroke is performed, and to a second valve characteristic according to which neither the pre-opening of the intake valve nor the re-opening of the exhaust valve is performed. In the engine, when the valve characteristic is the first valve characteristic, if the presence of a request for switching to the second valve characteristic resulting from an increase in engine load is detected, a pressure reducing operation for reducing the pressure in an exhaust passage of the engine is performed.

Abstract: A semiconductor device (1) includes: a semiconductor chip (2) having a first main surface and a second main surface opposite to the first main surface; a heat dissipating plate (3) opposed to the first main surface; a first electrode (5) disposed between the first main surface and the heat dissipating plate (3) so as to be electrically connected to the semiconductor chip (2); a pressure contact member (4) opposed to the second main surface; a second electrode (6) disposed between the second main surface and the pressure contact member (4) so as to be electrically connected to the semiconductor chip (2); and a pressure generating mechanism that generates a pressure for pressing the first electrode (5) into contact with the heat dissipating plate (3) and the semiconductor chip (2) and pressing the second electrode (6) into contact with the pressure contact member (4) and the semiconductor chip (2).

Abstract: A pressed-contact type semiconductor device includes a power semiconductor element, on an upper surface of which at least a first electrode is formed and on a lower surface of which at least a second electrode is formed, lead frames which face the first electrode and the second electrode of the power semiconductor element respectively, and a clip which applies a pressure to the lead frames while the power semiconductor element is sandwiched by the lead frames, wherein a metallic porous plating part is formed on a surface which faces the first electrode or the second electrode, the surface being a surface of at least one of the lead frames.

Abstract: A semiconductor device which can reduce a heat stress to a solder layer while suppressing an increase of thermal resistance is provided. A semiconductor device includes a semiconductor element, a solder layer which is arranged on at least one surface of the semiconductor element and a lead frame which is arranged on the solder layer so that a porous nickel plating part is sandwiched between the lead frame and the solder layer. Compared with a case that the semiconductor element and the lead frame are jointed by a solder directly, an increased part of a thermal resistance of the solder junction is held down only to a part of the porous nickel plating part and a thermal resistance applied to the solder layer can be reduced.

Abstract: A semiconductor device (1) includes: a semiconductor chip (2) having a first main surface and a second main surface opposite to the first main surface; a heat dissipating plate (3) opposed to the first main surface; a first electrode (5) disposed between the first main surface and the heat dissipating plate (3) so as to be electrically connected to the semiconductor chip (2); a pressure contact member (4) opposed to the second main surface; a second electrode (6) disposed between the second main surface and the pressure contact member (4) so as to be electrically connected to the semiconductor chip (2); and a pressure generating mechanism that generates a pressure for pressing the first electrode (5) into contact with the heat dissipating plate (3) and the semiconductor chip (2) and pressing the second electrode (6) into contact with the pressure contact member (4) and the semiconductor chip (2).

Abstract: There is provided a flip-chip mounting resin composition which can be used for a flip-chip mounting process that is high in productivity and reliability and thus can be applicable to a flip-chip mounting of a next-generation LSI. This flip-chip mounting resin composition comprises a resin, metal particles and a convection additive 12 that boils upon heating the resin 13. Upon the heating of the resin 13, the metal particles melt and the boiling convection additive 12 convects within the resin 13. This flip-chip mounting resin composition is supplied between a circuit substrate 10 and a semiconductor chip 20, and subsequently the resin 13 is heated so that the molten metal particles self-assemble into the region between each electrode of the circuit substrate and each electrode of the semiconductor chip. As a result, an electrical connection is formed between each electrode of the circuit substrate and each electrode of the semiconductor chip.

Abstract: A pressed-contact type semiconductor device includes a power semiconductor element, on an upper surface of which at least a first electrode is formed and on a lower surface of which at least a second electrode is formed, lead frames which face the first electrode and the second electrode of the power semiconductor element respectively, and a clip which applies a pressure to the lead frames while the power semiconductor element is sandwiched by the lead frames, wherein a metallic porous plating part is formed on a surface which faces the first electrode or the second electrode, the surface being a surface of at least one of the lead frames.

Abstract: A semiconductor device which can reduce a heat stress to a solder layer while suppressing an increase of thermal resistance is provided. A semiconductor device includes a semiconductor element, a solder layer which is arranged on at least one surface of the semiconductor element and a lead frame which is arranged on the solder layer so that a porous nickel plating part is sandwiched between the lead frame and the solder layer. Compared with a case that the semiconductor element and the lead frame are jointed by a solder directly, an increased part of a thermal resistance of the solder junction is held down only to a part of the porous nickel plating part and a thermal resistance applied to the solder layer can be reduced.

Abstract: An engine 1 includes a variable valve mechanism 18 capable of switching a valve characteristic to a first valve characteristic according to which at least one of an operation of pre-opening an intake valve 14 during an exhaust stroke prior to a valve opening time in an intake stroke and an operation of re-opening an exhaust valve 15 during the intake stroke subsequently to the opening/closing thereof during the exhaust stroke is performed, and to a second valve characteristic according to which neither the pre-opening of the intake valve 14 nor the re-opening of the exhaust valve 15 is performed. In the engine 1, when the valve characteristic is the first valve characteristic, if the presence of a request for switching to the second valve characteristic resulting from an increase in engine load is detected, a pressure reducing operation for reducing the pressure in an exhaust passage 40 of the engine 1 is performed (e.g., a regulate valve 68 is opened).

Abstract: On a circuit board configured to transmit a signal, a pulse transformer is provided on a path used for transmitting the signal of the circuit board. A shield member is provided on the circuit board to prevent noise, which is generated due to noise current flowing in a noise line pattern, from entering the pulse transformer. The shield member covers a part of a surface of at least one pulse transformer, the part intersecting concentric circles (which represent a magnetic field generated by the noise current) whose central axis extends along the direction in which the noise current flows.

Abstract: An objective lens system for an optical pickup apparatus, includes in order from an object side: a first lens group having negative paraxial power P1 (mm?1); and a second lens group having positive paraxial power P2 (mm?1) for converging a light flux emitted from the first lens group on an information recording surface of an optical information recording medium.

Abstract: A mounted body (100) of the present invention includes: a semiconductor element (10) having a surface (10a) on which element electrodes (12) are formed and a rear surface (10b) opposing the surface (10a); and a mounting board (30) on which wiring patterns (35) each having an electrode terminal (32) are formed. The rear surface (10b) of the semiconductor element (10) is in contact with the mounting board (30), and the element electrodes (12) of the semiconductor element (10) are connected electrically to the electrode terminals (32) of the wiring pattern (35) formed on the mounting board (30) via solder connectors (20) formed of solder particles assembled into a bridge shape. With this configuration, fine pitch connection between the element electrodes of the semiconductor element and the electrode terminals of the mounting board becomes possible.

Abstract: An optical pickup apparatus for reproducing information from an optical information recording medium or for recording information onto an optical information recording medium, is provided with a first light source for emitting first light flux having a first wavelength; a second light source for emitting second light flux having a second wavelength, the first wavelength being different from the second wavelength; a converging optical system having an optical axis and a diffractive portion, and a photo detector; wherein in case that the first light flux passes through the diffractive portion to generate at least one diffracted ray, an amount of n-th ordered diffracted ray of the first light flux is greater than that of any other ordered diffracted ray of the first light flux, and in case that the second light flux passes through the diffractive portion to generate at least one diffracted ray, an amount of n-th ordered diffracted ray of the second light flux is greater than that of any other ordered diffracted

Abstract: An electronic component mounting method includes a step of applying a resin composition (3) including solder powder, convective additive and resin having fluidity at the melting temperature of the solder powder on a main surface of a wiring substrate (1) provided with conductive wirings and connecting terminals, a step of preparing a group of electronic components consisting of a plurality of electronic components (7, 8 and 9) including at least a passive component, the respective electronic components comprising electrode terminals, position-aligning connecting terminals with the electrode terminals, and making the group of electronic components abut a surface of the resin composition, a step of heating at least the resin composition so as to melt solder powder and make the solder powder self-assembled between the connecting terminals and the electrode terminals by the convective additive, and thereby connecting the connecting terminals and the electrode terminals by soldering, and a step of fixedly adhering

Abstract: An optical pickup apparatus for reproducing information from an optical information recording medium or for recording information onto an optical information recording medium, is provided with a first light source for emitting first light flux having a first wavelength; a second light source for emitting second light flux having a second wavelength, the first wavelength being different from the second wavelength; a converging optical system having an optical axis and a diffractive portion, and a photo detector; wherein in case that the first light flux passes through the diffractive portion to generate at least one diffracted ray, an amount of n-th ordered diffracted ray of the first light flux is greater than that of any other ordered diffracted ray of the first light flux, and in case that the second light flux passes through the diffractive portion to generate at least one diffracted ray, an amount of n-th ordered diffracted ray of the second light flux is greater than that of any other ordered diffracted

Abstract: A mounted body of the present invention includes: a multilayer semiconductor chip 20 including a plurality of semiconductor chips 10 (10a, 10b) that are stacked; and a mounting board 13 on which the multilayer semiconductor chip 20 is mounted. In this mounted body, each of the semiconductor chips 10 (10a, 10b) in the multilayer semiconductor chip 20 has a plurality of element electrodes 12 (12a, 12b) on a chip surface 21 (21a, 21b) facing toward the mounting board 13. On the mounting board 13, electrode terminals 14 are formed so as to correspond to the plurality of element electrodes (12a, 12b), respectively, and the electrode terminals 14 of the mounting board and the element electrodes (12a, 12b) are connected electrically to each other via solder bump formed as a result of assembly of solder particles. With this configuration, a mounted body on which a stacked package is mounted can be manufactured easily.

Abstract: An optical pickup apparatus for reproducing information from an optical information recording medium or for recording information onto an optical information recording medium, is provided with a first light source for emitting first light flux having a first wavelength; a second light source for emitting second light flux having a second wavelength, the first wavelength being different from the second wavelength; a converging optical system having an optical axis and a diffractive portion, and a photo detector; wherein in case that the first light flux passes through the diffractive portion to generate at least one diffracted ray, an amount of n-th ordered diffracted ray of the first light flux is greater than that of any other ordered diffracted ray of the first light flux, and in case that the second light flux passes through the diffractive portion to generate at least one diffracted ray, an amount of n-th ordered diffracted ray of the second light flux is greater than that of any other ordered diffracted

Abstract: A mounted body (100) of the present invention includes: a semiconductor element (10) having a surface (10a) on which element electrodes (12) are formed and a rear surface (10b) opposing the surface (10a); and a mounting board (30) on which wiring patterns (35) each having an electrode terminal (32) are formed. The rear surface (10b) of the semiconductor element (10) is in contact with the mounting board (30), and the element electrodes (12) of the semiconductor element (10) are connected electrically to the electrode terminals (32) of the wiring pattern (35) formed on the mounting board (30) via solder connectors (20) formed of solder particles assembled into a bridge shape. With this configuration, fine pitch connection between the element electrodes of the semiconductor element and the electrode terminals of the mounting board becomes possible.

Abstract: A mounted body (100) of the present invention includes: a semiconductor element (10) having a surface (10a) on which element electrodes (12) are formed and a rear surface (10b) opposing the surface (10a); and a mounting board (30) on which wiring patterns (35) each having an electrode terminal (32) are formed. The rear surface (10b) of the semiconductor element (10) is in contact with the mounting board (30), and the element electrodes (12) of the semiconductor element (10) are connected electrically to the electrode terminals (32) of the wiring pattern (35) formed on the mounting board (30) via solder connectors (20) formed of solder particles assembled into a bridge shape. With this configuration, fine pitch connection between the element electrodes of the semiconductor element and the electrode terminals of the mounting board becomes possible.