Patents by Inventor Toshiyuki Kojima

Toshiyuki Kojima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7668065
    Abstract: An optical pickup apparatus for reproducing information from an optical information recording medium or for recording information onto an optical information recording medium, is provided with a first light source for emitting first light flux having a first wavelength; a second light source for emitting second light flux having a second wavelength, the first wavelength being different from the second wavelength; a converging optical system having an optical axis and a diffractive portion, and a photo detector; wherein in case that the first light flux passes through the diffractive portion to generate at least one diffracted ray, an amount of n-th ordered diffracted ray of the first light flux is greater than that of any other ordered diffracted ray of the first light flux, and in case that the second light flux passes through the diffractive portion to generate at least one diffracted ray, an amount of n-th ordered diffracted ray of the second light flux is greater than that of any other ordered diffracted
    Type: Grant
    Filed: October 26, 2007
    Date of Patent: February 23, 2010
    Assignee: Konica Corporation
    Inventors: Norikazu Arai, Toshiyuki Kojima, Toshihiko Kiriki, Kohei Ota, Shinichiro Saito
  • Patent number: 7611040
    Abstract: A method for forming solder bumps for realizing high density mounting and a highly reliable method for mounting a semiconductor device is provided. A flat plate having a plurality of projections or recesses thereon is prepared; the flat plate is aligned to oppose an electronic component and a resin composition including a solder powder is supplied to a gap between the flat plate and the electronic component; the resin composition is annealed to melt the solder powder included in the resin composition for growing the solder powder up to the level of the surface of the flat plate by allowing the melted solder powder to self-assemble on terminals, so as to form solder bumps on the terminals; and the flat plate is removed after cooling and solidifying the solder bumps. Thus, the solder bumps having pits corresponding to the projections or having protrusions corresponding to the recesses are formed.
    Type: Grant
    Filed: April 25, 2006
    Date of Patent: November 3, 2009
    Assignee: Panasonic Corporation
    Inventors: Takashi Kitae, Seiichi Nakatani, Toshiyuki Kojima, Shingo Komatsu, Yoshihisa Yamashita
  • Publication number: 20090262635
    Abstract: An objective lens system for an optical pickup apparatus, includes in order from an object side: a first lens group having negative paraxial power P1 (mm?1); and a second lens group having positive paraxial power P2 (mm?1) for converging a light flux emitted from the first lens group on an information recording surface of an optical information recording medium.
    Type: Application
    Filed: June 29, 2009
    Publication date: October 22, 2009
    Inventors: Tohru Kimura, Junji Hashimura, Yuichi Atarashi, Toshiyuki Kojima
  • Patent number: 7593307
    Abstract: An objective lens system for an optical pickup apparatus, includes in order from an object side: a first lens group having negative paraxial power P1 (mm?1); and a second lens group having positive paraxial power P2 (mm?1) for converging a light flux emitted from the first lens group on an information recording surface of an optical information recording medium.
    Type: Grant
    Filed: April 7, 2005
    Date of Patent: September 22, 2009
    Assignee: Konica Minolta Opto, Inc.
    Inventors: Tohru Kimura, Junji Hashimura, Yuichi Atarashi, Toshiyuki Kojima
  • Publication number: 20090230546
    Abstract: A mounted body of the present invention includes: a multilayer semiconductor chip 20 including a plurality of semiconductor chips 10 (10a, 10b) that are stacked; and a mounting board 13 on which the multilayer semiconductor chip 20 is mounted. In this mounted body, each of the semiconductor chips 10 (10a, 10b) in the multilayer semiconductor chip 20 has a plurality of element electrodes 12 (12a, 12b) on a chip surface 21 (21a, 21b) facing toward the mounting board 13. On the mounting board 13, electrode terminals 14 are formed so as to correspond to the plurality of element electrodes (12a, 12b), respectively, and the electrode terminals 14 of the mounting board and the element electrodes (12a, 12b) are connected electrically to each other via solder bump formed as a result of assembly of solder particles. With this configuration, a mounted body on which a stacked package is mounted can be manufactured easily.
    Type: Application
    Filed: February 28, 2006
    Publication date: September 17, 2009
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD
    Inventors: Shingo Komatsu, Seiichi Nakatani, Seiji Karashima, Toshiyuki Kojima, Takashi Kitae, Yoshihisa Yamashita
  • Publication number: 20090223705
    Abstract: An electronic component mounting method includes a step of applying a resin composition (3) including solder powder, convective additive and resin having fluidity at the melting temperature of the solder powder on a main surface of a wiring substrate (1) provided with conductive wirings and connecting terminals, a step of preparing a group of electronic components consisting of a plurality of electronic components (7, 8 and 9) including at least a passive component, the respective electronic components comprising electrode terminals, position-aligning connecting terminals with the electrode terminals, and making the group of electronic components abut a surface of the resin composition, a step of heating at least the resin composition so as to melt solder powder and make the solder powder self-assembled between the connecting terminals and the electrode terminals by the convective additive, and thereby connecting the connecting terminals and the electrode terminals by soldering, and a step of fixedly adhering
    Type: Application
    Filed: March 23, 2006
    Publication date: September 10, 2009
    Inventors: Yoshihisa Yamashita, Seiji Karashima, Takashi Kitae, Seiichi Nakatani, Toshiyuki Kojima, Shingo Komatsu
  • Publication number: 20090202142
    Abstract: A circuit board according to the present invention comprises an insulating layer, a first electronic component mounted on the insulating layer, and a solder marker provided on the insulating layer. A first solder having a first melting point constitutes the solder marker. The first electronic component is mounted on the insulating layer via a second solder having a second melting point lower than the first melting point.
    Type: Application
    Filed: March 30, 2007
    Publication date: August 13, 2009
    Inventors: Yukihiro Ishimaru, Toshiyuki Kojima, Rikiya Okimoto
  • Publication number: 20090115067
    Abstract: An electronic component embedded module that can improve reliability of electric connection of inner vias, and a manufacturing method therefor are provided. A first electronic component (11) is embedded in a second electrical insulating layer (13) and connected electrically to a first wiring pattern (14) through first inner vias (16) that penetrate a first electrical insulating layer (12). The first wiring pattern (14) and a second wiring pattern (15) are connected electrically to each other through second inner vias (17) that penetrate the first electrical insulating layer (12) and third inner vias (18) that penetrate the second electrical insulating layer (13). The second inner vias (17) and the third inner vias (18) are arranged continuously.
    Type: Application
    Filed: November 16, 2006
    Publication date: May 7, 2009
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Rikiya Okimoto, Toshiyuki Kojima, Yukihiro Ishimaru
  • Publication number: 20090016195
    Abstract: An optical pickup apparatus for reproducing information from an optical information recording medium or for recording information onto an optical information recording medium, is provided with a first light source for emitting first light flux having a first wavelength; a second light source for emitting second light flux having a second wavelength, the first wavelength being different from the second wavelength; a converging optical system having an optical axis and a diffractive portion, and a photo detector; wherein in case that the first light flux passes through the diffractive portion to generate at least one diffracted ray, an amount of n-th ordered diffracted ray of the first light flux is greater than that of any other ordered diffracted ray of the first light flux, and in case that the second light flux passes through the diffractive portion to generate at least one diffracted ray, an amount of n-th ordered diffracted ray of the second light flux is greater than that of any other ordered diffracted
    Type: Application
    Filed: October 19, 2007
    Publication date: January 15, 2009
    Inventors: Norikazu Arai, Toshiyuki Kojima, Toshihiko Kiriki, Kohei Ota, Shinichiro Saito
  • Publication number: 20080316900
    Abstract: An optical pickup apparatus for reproducing information from an optical information recording medium or for recording information onto an optical information recording medium, is provided with a first light source for emitting first light flux having a first wavelength; a second light source for emitting second light flux having a second wavelength, the first wavelength being different from the second wavelength; a converging optical system having an optical axis and a diffractive portion, and a photo detector; wherein in case that the first light flux passes through the diffractive portion to generate at least one diffracted ray, an amount of n-th ordered diffracted ray of the first light flux is greater than that of any other ordered diffracted ray of the first light flux, and in case that the second light flux passes through the diffractive portion to generate at least one diffracted ray, an amount of n-th ordered diffracted ray of the second light flux is greater than that of any other ordered diffracted
    Type: Application
    Filed: October 19, 2007
    Publication date: December 25, 2008
    Inventors: Norikazu Arai, Toshiyuki Kojima, Toshihiko Kiriki, Kohei Ota, Shinichiro Saito
  • Publication number: 20080298023
    Abstract: An electronic component-containing module includes an electrically insulating substrate; and a first electronic component and second electronic component embedded in the electrically insulating substrate, wherein the first electronic component protrudes partially from at least one surface of the electrically insulating substrate, and the second electronic component is contained in the electrically insulating substrate.
    Type: Application
    Filed: May 27, 2008
    Publication date: December 4, 2008
    Applicant: Matsushita Electric Industrial Co., Ltd.
    Inventors: Rikiya Okimoto, Tsukasa Shiraishi, Yukihiro Ishimaru, Toshiyuki Kojima
  • Publication number: 20080296053
    Abstract: A method of manufacturing an electronic component module includes mounting an electronic component on at least one surface of a first board, subsequently inspecting the first board for functions, forming a resin layer burying or covering the electronic component on the one surface of the first board to flatten the one surface side of the first board, aligningly stacking the first board, a plate-like member and a second board so that the other surface of the first board is opposite one surface of the plate-like member and so that the other surface of the plate-like member is opposite one surface of the second board, pressurizing the first board, the plate-like member and the second board which have been stacked, and heating the first board, the plate-like member, and the second board which have been stacked.
    Type: Application
    Filed: May 27, 2008
    Publication date: December 4, 2008
    Applicant: Matsushita Electric Industrial Co., Ltd.
    Inventors: Yukihiro Ishimaru, Toshiyuki Kojima, Rikiya Okimoto
  • Publication number: 20080251894
    Abstract: A mounted body (100) of the present invention includes: a semiconductor element (10) having a surface (10a) on which element electrodes (12) are formed and a rear surface (10b) opposing the surface (10a); and a mounting board (30) on which wiring patterns (35) each having an electrode terminal (32) are formed. The rear surface (10b) of the semiconductor element (10) is in contact with the mounting board (30), and the element electrodes (12) of the semiconductor element (10) are connected electrically to the electrode terminals (32) of the wiring pattern (35) formed on the mounting board (30) via solder connectors (20) formed of solder particles assembled into a bridge shape. With this configuration, fine pitch connection between the element electrodes of the semiconductor element and the electrode terminals of the mounting board becomes possible.
    Type: Application
    Filed: February 21, 2006
    Publication date: October 16, 2008
    Applicant: Matsushita Electric Industrial Co., Ltd.
    Inventors: Toshiyuki Kojima, Seiichi Nakatani, Yoshihisa Yamashita, Takashi Kitae, Shingo Komatsu
  • Publication number: 20080197173
    Abstract: [Problem] To provide a method for forming solder bumps for realizing high density mounting and a highly reliable method for mounting a semiconductor device. [Means for Solving Problem] A flat plate 10 or 30 having a plurality of projections 12 or recesses 32 thereon is prepared; the flat plate is aligned to oppose an electronic component 14 or 34 and a resin composition 18 or 19 including a solder powder 22 or 23 is supplied to a gap between the flat plate and the electronic component; the resin composition is annealed to melt the solder powder included in the resin composition for growing the solder powder up to the level of the surface of the flat plate by allowing the melted solder powder to self-assemble on terminals 16 or 36, so as to form solder bumps 24 or 38 on the terminals; and the flat plate is removed after cooling and solidifying the solder bumps.
    Type: Application
    Filed: April 25, 2006
    Publication date: August 21, 2008
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Takashi Kitae, Seiichi Nakatani, Toshiyuki Kojima, Shingo Komatsu, Yoshihisa Yamashita
  • Publication number: 20080175128
    Abstract: An optical pickup apparatus for reproducing information from an optical information recording medium or for recording information onto an optical information recording medium, is provided with a first light source for emitting first light flux having a first wavelength; a second light source for emitting second light flux having a second wavelength, the first wavelength being different from the second wavelength; a converging optical system having an optical axis and a diffractive portion, and a photo detector; wherein in case that the first light flux passes through the diffractive portion to generate at least one diffracted ray, an amount of n-th ordered diffracted ray of the first light flux is greater than that of any other ordered diffracted ray of the first light flux, and in case that the second light flux passes through the diffractive portion to generate at least one diffracted ray, an amount of n-th ordered diffracted ray of the second light flux is greater than that of any other ordered diffracted
    Type: Application
    Filed: October 19, 2007
    Publication date: July 24, 2008
    Inventors: Norikazu Arai, Toshiyuki Kojima, Toshihiko Kiriki, Kohei Ota, Shinichiro Saito
  • Publication number: 20080137514
    Abstract: An optical pickup apparatus for reproducing information from an optical information recording medium or for recording information onto an optical information recording medium, is provided with a first light source for emitting first light flux having a first wavelength; a second light source for emitting second light flux having a second wavelength, the first wavelength being different from the second wavelength; a converging optical system having an optical axis and a diffractive portion, and a photo detector; wherein in case that the first light flux passes through the diffractive portion to generate at least one diffracted ray, an amount of n-th ordered diffracted ray of the first light flux is greater than that of any other ordered diffracted ray of the first light flux, and in case that the second light flux passes through the diffractive portion to generate at least one diffracted ray, an amount of n-th ordered diffracted ray of the second light flux is greater than that of any other ordered diffracted
    Type: Application
    Filed: October 26, 2007
    Publication date: June 12, 2008
    Inventors: Norikazu ARAI, Toshiyuki KOJIMA, Toshihiko KIRIKI, Kohei OTA, Shinichiro SAITO
  • Publication number: 20080128664
    Abstract: There is provided a flip-chip mounting resin composition which can be used for a flip-chip mounting process that is high in productivity and reliability and thus can be applicable to a flip-chip mounting of a next-generation LSI. This flip-chip mounting resin composition comprises a resin, metal particles and a convection additive 12 that boils upon heating the resin 13. Upon the heating of the resin 13, the metal particles melt and the boiling convection additive 12 convects within the resin 13. This flip-chip mounting resin composition is supplied between a circuit substrate 10 and a semiconductor chip 20, and subsequently the resin 13 is heated so that the molten metal particles self-assemble into the region between each electrode of the circuit substrate and each electrode of the semiconductor chip. As a result, an electrical connection is formed between each electrode of the circuit substrate and each electrode of the semiconductor chip.
    Type: Application
    Filed: December 14, 2005
    Publication date: June 5, 2008
    Inventors: Takashi Kitae, Seiji Karashima, Koichi Hirano, Toshiyuki Kojima, Seiichi Nakatani, Shingo Komatsu, Yoshihisa Yamashita
  • Patent number: 7366078
    Abstract: An optical pickup apparatus for reproducing information from an optical information recording medium or for recording information onto an optical information recording medium, is provided with a first light source for emitting first light flux having a first wavelength; a second light source for emitting second light flux having a second wavelength, the first wavelength being different from the second wavelength; a converging optical system having an optical axis and a diffractive portion, and a photo detector; wherein in case that the first light flux passes through the diffractive portion to generate at least one diffracted ray, an amount of n-th ordered diffracted ray of the first light flux is greater than that of any other ordered diffracted ray of the first light flux, and in case that the second light flux passes through the diffractive portion to generate at least one diffracted ray, an amount of n-th ordered diffracted ray of the second light flux is greater than that of any other ordered diffracted
    Type: Grant
    Filed: September 14, 2005
    Date of Patent: April 29, 2008
    Assignee: Konica Corporation
    Inventors: Norikazu Arai, Toshiyuki Kojima, Toshihiko Kiriki, Kohei Ota, Shinichiro Saito
  • Patent number: 7342851
    Abstract: An optical pickup apparatus for reproducing information from an optical information recording medium or for recording information onto an optical information recording medium, is provided with a first light source for emitting first light flux having a first wavelength; a second light source for emitting second light flux having a second wavelength, the first wavelength being different from the second wavelength; a converging optical system having an optical axis and a diffractive portion, and a photo detector; wherein in case that the first light flux passes through the diffractive portion to generate at least one diffracted ray, an amount of n-th ordered diffracted ray of the first light flux is greater than that of any other ordered diffracted ray of the first light flux, and in case that the second light flux passes through the diffractive portion to generate at least one diffracted ray, an amount of n-th ordered diffracted ray of the second light flux is greater than that of any other ordered diffracted
    Type: Grant
    Filed: May 27, 2005
    Date of Patent: March 11, 2008
    Assignee: Konica Corporation
    Inventors: Norikazu Arai, Toshiyuki Kojima, Toshihiko Kiriki, Kohei Ota, Shinichiro Saito
  • Patent number: 7173895
    Abstract: An optical pickup apparatus for reproducing information from an optical information recording medium or for recording information onto an optical information recording medium, is provided with a first light source for emitting first light flux having a first wavelength; a second light source for emitting second light flux having a second wavelength, the first wavelength being different from the second wavelength; a converging optical system having an optical axis and a diffractive portion, and a photo detector; wherein in case that the first light flux passes through the diffractive portion to generate at least one diffracted ray, an amount of n-th ordered diffracted ray of the first light flux is greater than that of any other ordered diffracted ray of the first light flux, and in case that the second light flux passes through the diffractive portion to generate at least one diffracted ray, an amount of n-th ordered diffracted ray of the second light flux is greater than that of any other ordered diffracted
    Type: Grant
    Filed: July 3, 2003
    Date of Patent: February 6, 2007
    Assignee: Konica Corporation
    Inventors: Norikazu Arai, Toshiyuki Kojima, Toshihiko Kiriki, Kohei Ota, Shinichiro Saito