Abstract: An intermediate connection electrical connector includes a plurality of blades and a supporting member for supporting the blades arranged in an arrangement direction. The supporting member includes a surrounding wall portion for surrounding the blades and a regulating portion for positioning the blades. The surrounding wall portion includes a side wall portion and an edge wall portion. The side wall portion is at least partially formed of an electromagnetic wave absorbing material. The regulating portion is disposed inside the surrounding wall portion to define a blade accommodating space for accommodating the blades.

Abstract: A semiconductor light emitting device that is excellent in radiating heat and that can be molded into a sealing shape having intended optical characteristics by die molding is provided. The semiconductor light emitting device includes: a lead frame including a plate-like semiconductor light emitting element mounting portion having an LED chip mounted on a main surface, and a plate-like metal wire connecting portion extending over a same plane as the semiconductor light emitting element mounting portion; a metal wire electrically connecting the LED chip and the metal wire connecting portion; a thermosetting resin molded by die molding or dam-sheet molding so as to completely cover the LED chip and the metal wire; and a resin portion provided to surround the lead frame and having the thickness not greater than the thickness of the lead frame.

Abstract: The present invention involves connectors for reducing Far-End Crosstalk (FEXT) through the use of novel polarity swapping to negate the cumulative effect of FEXT. Skew adjustment is used to improve the FEXT cancellation from polarity swapping. The polarity reversal location or locations among FEXT sources are optimized to achieve maximum FEXT cancellation. The novelty polarity swapping technique can be applied to a wide variety of connectors, such as mezzanine connectors, backplane connectors, and any other connectors that can benefit from FEXT reduction.

Abstract: An electrical connector includes a housing having an opening portion in an upper surface thereof including a width edge in a short side direction and a side edge in a long side direction; a terminal disposed in the housing; and a suction member detachably attached to the housing. The suction member includes a plate portion for covering the housing and an attachment portion for attaching to the housing at a middle portion of the side edge. The plate portion includes an attachment region between both end portions of the attachment portion in the long side direction and a non-attachment region outside the attachment region extending to a distal end portion of the plate portion in the long side direction. The non-attachment region includes a deformable portion with a free end portion to be deformable.

Abstract: A low density parity check codes decoder decodes an LDPC code with an arbitrary coding rate by the same configuration. The low density parity check codes decoder enables decoding of an LDPC code constituted by a base matrix of Mbmax rows and Nbmax columns and a permutation matrix as an element of the base matrix. It stores therein Mbmax×Nbmax validity/invalidity flags, shift amounts of valid permutation matrices, a permutation matrix size in a processing target code, and the number of rows of a base matrix in the processing target code, determined depending on a check matrix for the processing target LDPC code, and generates column addresses and a row address to be given to column processing calculation sections and a row processing calculation section that perform calculation in accordance with a BP algorithm by utilizing the stored information, so that it can process an LDPC code for a smaller base matrix than the aforementioned base matrix as well.

Abstract: A low density parity check codes decoder decodes an LDPC code with an arbitrary coding rate by the same configuration. The low density parity check codes decoder enables decoding of an LDPC code constituted by a base matrix of Mbmax rows and Nbmax columns and a permutation matrix as an element of the base matrix. It stores therein Mbmax×Nbmax validity/invalidity flags, shift amounts of valid permutation matrices, a permutation matrix size in a processing target code, and the number of rows of a base matrix in the processing target code, determined depending on a check matrix for the processing target LDPC code, and generates column addresses and a row address to be given to column processing calculation sections and a row processing calculation section that perform calculation in accordance with a BP algorithm by utilizing the stored information, so that it can process an LDPC code for a smaller base matrix than the aforementioned base matrix as well.

Abstract: It is an object of the present invention to provide a low density parity check codes decoder that can decode an LDPC code with an arbitrary coding rate by the same configuration. The low density parity check codes decoder according to the present invention is configured to enable decoding of an LDPC code constituted by a base matrix of Mbmax rows and Nbmax columns and a permutation matrix as an element of the base matrix.

Abstract: An electrical connector includes a housing having an opening portion in an upper surface thereof including a width edge in a short side direction and a side edge in a long side direction; a terminal disposed in the housing; and a suction member detachably attached to the housing. The suction member includes a plate portion for covering the housing and an attachment portion for attaching to the housing at a middle portion of the side edge. The plate portion includes an attachment region between both end portions of the attachment portion in the long side direction and a non-attachment region outside the attachment region extending to a distal end portion of the plate portion in the long side direction. The non-attachment region includes a deformable portion with a free end portion to be deformable.

Abstract: The present invention involves chip-to-chip communication systems for reducing Far-End Crosstalk (FEXT) through the use of novel polarity swapping to negate the cumulative effect of FEXT. Skew adjustment is used to improve the FEXT cancellation from polarity swapping. The polarity reversal location or locations among FEXT sources are optimized to achieve maximum FEXT cancellation. The novelty polarity swapping technique can be applied to a wide variety of systems that can benefit from FEXT reduction.

Abstract: The present invention involves connectors for reducing Far-End Crosstalk (FEXT) through the use of novel polarity swapping to negate the cumulative effect of FEXT. Skew adjustment is used to improve the FEXT cancellation from polarity swapping. The polarity reversal location or locations among FEXT sources are optimized to achieve maximum FEXT cancellation. The novelty polarity swapping technique can be applied to a wide variety of connectors, such as mezzanine connectors, backplane connectors, and any other connectors that can benefit from FEXT reduction.

Abstract: An electrical connector assembly has a fixed connector, a middle connector, and a plug connector. The fixed connector is attached to a circuit member of an electrical device. The middle connector is connected and pulled out to and from the fixed connector in a direction same as that of the plug connector being connected and pulled out to and from the middle connector. Each of the fixed connector, the middle connector, and the plug connector is provided with engagement portions at both end portions thereof in a direction parallel to a straight line extending in a different direction from an insertion and pull-out direction. With the engagement portions, it is possible to prevent the fixed connector from coming off from the middle connector when the plug connector is pulled out.

Abstract: An electrical connector for a circuit board is provided with a relay member connection body and a relay member receiving body. The relay member connection body is provided with terminals and a terminal holding body to hold the terminals. The relay member receiving body is fitted into the relay member connection body and receives a relay member that is to be connected with the terminals. The relay member receiving body is provided with receiving grooves extending in the assemble direction to receive the relay member. One end side of the terminal is held, and a contact portion elastically bendable inward of the receiving groove is provided in the other end side of the terminal. A distal portion of the terminal on the other end side abuts against the relay member receiving body, so that the terminals receive pre-compression in an elastically bending direction of the contact portion.

Abstract: An electrical connector assembly has a fixed connector, a middle connector, and a plug connector. The fixed connector is attached to a circuit member of an electrical device. The middle connector is connected and pulled out to and from the fixed connector in a direction same as that of the plug connector being connected and pulled out to and from the middle connector. Each of the fixed connector, the middle connector, and the plug connector is provided with engagement portions at both end portions thereof in a direction parallel to a straight line extending in a different direction from an insertion and pull-out direction. With the engagement portions, it is possible to prevent the fixed connector from coming off from the middle connector when the plug connector is pulled out.

Abstract: A semiconductor light emitting device that is excellent in radiating heat and that can be molded into a sealing shape having intended optical characteristics by die molding is provided. The semiconductor light emitting device includes: a lead frame including a plate-like semiconductor light emitting element mounting portion having an LED chip mounted on a main surface, and a plate-like metal wire connecting portion extending over a same plane as the semiconductor light emitting element mounting portion; a metal wire electrically connecting the LED chip and the metal wire connecting portion; a thermosetting resin molded by die molding or dam-sheet molding so as to completely cover the LED chip and the metal wire; and a resin portion provided to surround the lead frame and having the thickness not greater than the thickness of the lead frame.