Abstract: In order to perform an autofocus operation, a controller of a focus control device selects subject information relating to the current magnification from subject information including previous focus states stored in a storage unit in advance, and determines a focus lens driving range on the basis of a focal length associated with the selected subject information. After the focus lens driving range is determined, a contrast-based autofocus operation is performed within that driving range. Therefore, it is possible to reduce the time taken to obtain the focus state and improve reliability of the focusing.

Abstract: A focus control apparatus reduces the degree of out-of-focus of an image of an intense point light source during zooming in contrast-based autofocus control. A zooming lens moves in an optical axis direction to perform magnification change and a focusing lens moves in the optical axis direction to perform focus adjustment and is driven in accordance with a trace curve corresponding to the distance to a subject. A controller evaluates, during the magnification change operation, based on the rate of change in the number of high-luminance pixels at which the number of high-luminance pixels in an output image from the imaging apparatus changes with the zoom magnification, whether or not the focusing lens is driven in accordance with a trace curve corresponding to the distance to the subject before the magnification change operation is performed or a trace curve corresponding to a distance to the subject of infinity.

Abstract: A controller sets a plurality of detection regions within an imaging area. The controller then compares a difference in a contrast signal level between a maximum contrast signal level and a minimum contrast signal level calculated from among contrast signal levels of contrast signals generated for the plurality of detection regions with a level difference threshold. The controller then sets a priority level in subject information concerning a subject on the basis of a comparison result. The controller then stores the subject information in a storage unit in accordance with the priority level set in the subject information. The controller then drives a focus lens on the basis of the subject information read from the storage unit so as to bring the focus lens into focus.

Abstract: A focus control apparatus reduces the degree of out-of-focus of an image of an intense point light source during zooming in contrast-based autofocus control. A zooming lens moves in an optical axis direction to perform magnification change and a focusing lens moves in the optical axis direction to perform focus adjustment and is driven in accordance with a trace curve corresponding to the distance to a subject. A controller evaluates, during the magnification change operation, based on the rate of change in the number of high-luminance pixels at which the number of high-luminance pixels in an output image from the imaging apparatus changes with the zoom magnification, whether or not the focusing lens is driven in accordance with a trace curve corresponding to the distance to the subject before the magnification change operation is performed or a trace curve corresponding to a distance to the subject of infinity.

Abstract: In an imaging device having a driving device using a stepping motor, improvement in recovery speed after a step out of the motor is realized. An imaging device having a driving device which carries out lens driving, diaphragm driving or pan-tilt-zoom driving with a stepping motor, includes: a motor driving unit which controls a current or voltage supplied to an exciting coil of the stepping motor; a system control unit which outputs a motor driving stop instruction to the motor driving unit; and a detection unit which detects a current or voltage flowing through the exciting coil after the stop instruction is outputted. The system control unit finds a direction of correction and an amount of correction to recover from a movement of a rotor due to a step out of the stepping motor, based on the current or voltage detected by the detection unit, and moves the stepping motor based on the direction of correction and the amount of correction.

Abstract: For preventing frequent use of auto-focus control and also for acquiring stable in-focus positions for target-objects, this invention comprises system control section 60 having a second mode to drive magnification adjustment lens 11 or focus adjustment lens 12 upon a user command, and a third mode to transition to a first mode under pre-determined conditions in the second mode, and to set in-focus states of a lens group, wherein system control section 60 stores a reference target-object distance in reference target-object distance storage section 43 when focus adjustment lens 12 is driven by user commands in the second mode, drives focus adjustment lens 12 not based on a current target-object distance but the lens in-focus trajectory data to retain the reference target-object distance when the magnification adjustment lens 11 is driven by user commands, and re-transitions to the second mode without updating the reference target-object distance, after the third mode.

Abstract: In order to obtain stable lens positions to have an object imaged in focus when the temperature of lenses changes, an imaging device of the present invention comprises a system control section 60 having a imaging mode and a correction mode, the imaging mode in which a group of lenses 10 are controlled and moved to focusing positions for a predetermined distance at first and are further moved to correct the focusing positions for the predetermined distance to the object during imaging according to the temperature compensation data, the correction mode in which the group of lenses 10 are controlled and moved to have the temperature compensation data corrected when the temperature change is larger than or equal to a predetermined temperature difference, a correction coefficient calculation section 50 for calculating the correction coefficient to correct the temperature compensation data based on first focusing positions of the group of lenses to which the group of lenses are moved according to the temperature co

Abstract: For preventing frequent use of auto-focus control and also for acquiring stable in-focus positions for target-objects, this invention comprises system control section 60 having a second mode to drive magnification adjustment lens 11 or focus adjustment lens 12 upon a user command, and a third mode to transition to a first mode under pre-determined conditions in the second mode, and to set in-focus states of a lens group, wherein system control section 60 stores a reference target-object distance in reference target-object distance storage section 43 when focus adjustment lens 12 is driven by user commands in the second mode, drives focus adjustment lens 12 not based on a current target-object distance but the lens in-focus trajectory data to retain the reference target-object distance when the magnification adjustment lens 11 is driven by user commands, and re-transitions to the second mode without updating the reference target-object distance, after the third mode.

Abstract: A wafer polish monitoring method and device for detecting the end point of the polishing of a conductive film with high precision and accuracy by monitoring the variation of the film thickness of the conductive film without adverse influence of slurry or the like after the film thickness of the conductive film decreases to an extremely small film thickness defined by the skin depth. A high-frequency transmission path is formed in a portion facing the conductive film on the surface of the wafer, the polishing removal state of the conductive film is evaluated based at least on the transmitted electromagnetic waves passing through the high-frequency transmission path or the reflected electromagnetic waves that are reflected without passing through the high-frequency transmission path, and the end point of the polishing removal and the point equivalent to the end point of the polishing removal are detected.

Abstract: In order to obtain stable lens positions to have an object imaged in focus when the temperature of lenses changes, an imaging device of the present invention comprises a system control section 60 having a imaging mode and a correction mode, the imaging mode in which a group of lenses 10 are controlled and moved to focusing positions for a predetermined distance at first and are further moved to correct the focusing positions for the predetermined distance to the object during imaging according to the temperature compensation data, the correction mode in which the group of lenses 10 are controlled and moved to have the temperature compensation data corrected when the temperature change is larger than or equal to a predetermined temperature difference, a correction coefficient calculation section 50 for calculating the correction coefficient to correct the temperature compensation data based on first focusing positions of the group of lenses to which the group of lenses are moved according to the temperature co

Abstract: Coil is made to be disposed with gap opposed to the surface of wafer, and wafer stage is made to move in X and Y direction and R and ? direction. When supplying an alternating current to coil with the frequency swept by impedance analyzer, the magnetic field made to be induced in coil will operate on the conductive film of wafer. By changing a parameter (a frequency or an angle) influencing the skin effect of the conductive film and giving the parameter to coil, the state where a magnetic field is not made to penetrate relatively the film of wafer and the state where the magnetic field is made to penetrate relatively the film can be formed. From the variation of various values corresponding to the eddy current induced based on the change of state influenced by the skin effect of the conductive film, the film thickness of wafer can be measured with sufficient accuracy.

Abstract: A method and device for forecasting/detecting a polishing end point and for monitoring a real-time film thickness to suppress Joule heat loss due to the eddy current to the minimum, to precisely forecast/detect a polishing end point, to precisely calculate the remaining film thickness to be removed, and polishing rate.

Abstract: The present invention provides a bottomed cylindrical container, comprising a body wall, a bottom wall, and a ring-shaped foot downwardly extending from the bottom wall, said container being produced by thermo-molding a resin sheet, characterized in that said foot is formed by folding an inner wall by compressed fluid to be fusion-bonded with an outer wall, so as to form the foot comprising the inner wall and the outer wall. The present invention also provides a bottomed cylindrical container, comprising a body wall having a grounding edge at a lower end thereof, and a bottom wall, said container being produced by thermo-molding a resin sheet, characterized in that said bottom wall connects with an upper edge of an inner wall produced by folding back the body wall along the grounding edge and by fusion-bonding it to an inner periphery of the body wall. In addition, the present invention provides the methods for thermo-molding these containers and their apparatuses.

Abstract: A method and device for forecasting and detecting a polishing endpoint and real time film thickness monitoring capable of suppressing to a minimum Joule heat loss due to an eddy current, and precisely forecasting and detecting the polishing endpoint, and precisely calculating a remaining film amount to be removed and a polishing rate. A high frequency inductor sensor is positioned close to the conductive film, and monitors a flux change induced in the conductive film. When a film thickness becomes a film thickness corresponding to a skin depth of the conductive film a method of calculating on the spot a polishing rate and a remaining film amount to be removed is provided.

Abstract: The present invention provides a bottomed cylindrical container, comprising a body wall, a bottom wall, and a ring-shaped foot downwardly extending from the bottom wall, said container being produced by thermo-molding a resin sheet, characterized in that said foot is formed by folding an inner wall by compressed fluid to be fusion-bonded with an outer wall, so as to form the foot comprising the inner wall and the outer wall. The present invention also provides a bottomed cylindrical container, comprising a body wall having a grounding edge at a lower end thereof, and a bottom wall, said container being produced by thermo-molding a resin sheet, characterized in that said bottom wall connects with an upper edge of an inner wall produced by folding back the body wall along the grounding edge and by fusion-bonding it to an inner periphery of the body wall. In addition, the present invention provides the methods for thermo-molding these containers and their apparatuses.

Abstract: Coil is made to be disposed with gap opposed to the surface of wafer, and wafer stage is made to move in X and Y direction and R and ? direction. When supplying an alternating current to coil with the frequency swept by impedance analyzer, the magnetic field made to be induced in coil will operate on the conductive film of wafer. By changing a parameter (a frequency or an angle) influencing the skin effect of the conductive film and giving the parameter to coil, the state where a magnetic field is not made to penetrate relatively the film of wafer and the state where the magnetic field is made to penetrate relatively the film can be formed. From the variation of various values corresponding to the eddy current induced based on the change of state influenced by the skin effect of the conductive film, the film thickness of wafer can be measured with sufficient accuracy.

Abstract: The present invention provides a bottomed cylindrical container, comprising a body wall, a bottom wall, and a ring-shaped foot downwardly extending from the bottom wall, said container being produced by thermo-molding a resin sheet, characterized in that said foot is formed by folding an inner wall by compressed fluid to be fusion-bonded with an outer wall, so as to form the foot comprising the inner wall and the outer wall. The present invention also provides a bottomed cylindrical container, comprising a body wall having a grounding edge at a lower end thereof, and a bottom wall, said container being produced by thermo-molding a resin sheet, characterized in that said bottom wall connects with an upper edge of an inner wall produced by folding back the body wall along the grounding edge and by fusion-bonding it to an inner periphery of the body wall. In addition, the present invention provides the methods for thermo-molding these containers and their apparatuses.

Abstract: [Problem to be Solved] To provide a method and device for forecasting/detecting a polishing end point and a method and device for monitoring a real-time film thickness to suppress Joule heat loss due to the eddy current to the minimum, to precisely forecast/detect an polishing end point, to precisely calculate the remaining film thickness to be removed, polishing rate and the like on the spot, and to precisely evaluate whether the predetermined conductive film is appropriately removed [Solution] In order to achieve the object, according to the present invention, there is provided a method wherein an inductor 36 in a high frequency inductor type sensor is arranged adjacent to a predetermined conductive film 28, and a magnetic flux change induced in the predetermined conductive film 28 by a magnetic flux formed of the inductor 36 is monitored, and by use of a magnetic flux change when a film thickness becomes corresponding to skin depth in which a film thickness in polishing is determined by the material of the

Abstract: An object of the present invention is to provide a method of forecasting and detecting a polishing endpoint and the device thereof and a real time film thickness monitoring method and the device thereof capable of suppressing a Joule heat loss to the minimum due to an eddy current, and precisely forecasting and detecting the polishing endpoint, and moreover, precisely calculating a remaining film amount to be removed and a polishing rate and the like on the spot so as to be able to accurately evaluate whether the predetermined conductive film is appropriately removed.

Abstract: To eliminate the unevenness of the remaining film thickness of the wafers, and increase the polishing efficiency, reduce the running cost and enhance the yield. A CMP apparatus 1 is equipped with a polishing recipe preparing means 3 that prepares polishing conditions so that the polishing conditions such as polishing speed, polishing pressure, abrasive and the like for the wafers become optimal, a remaining film thickness forecasting means 4 that forecasts the remaining film thickness of the wafer to be polished under the polishing conditions after polishing, a remaining film thickness measuring apparatus 4 that measures the remaining film thickness of the wafer after the polishing, and a computer 6 that controls the polishing conditions on the basis of the measurement results of the remaining film thickness.