Patents by Inventor Tou Chin

Tou Chin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10772194
    Abstract: A circuit board that includes a substrate that has an upper surface on which a circuit pattern is formed, and a lower surface to which a plurality of bus bars that are spaced apart are fixed; a placement through hole that extends through the upper surface and the lower surface and faces a bus bar of the plurality of bus bars and in which an electronic component is placed; and a terminal conductor foil that protrudes inward into the placement through hole from the lower surface and to which a terminal of the electronic component is connected.
    Type: Grant
    Filed: April 6, 2017
    Date of Patent: September 8, 2020
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Tou Chin, Arinobu Nakamura
  • Patent number: 10652994
    Abstract: Provided is a circuit assembly in which the mounting area of a substrate can be increased. A circuit assembly includes an electronic component having a plurality of terminals, a conductive member for supporting the electronic component (10), at least one of the terminals of the electronic component being electrically connected to the conductive member, and a substrate provided with a conductive pattern to which another terminal of the electronic component is electrically connected, in which the substrate is fixed to a surface of the conductive member that is opposite to a surface of the conductive member that supports the electronic component.
    Type: Grant
    Filed: October 21, 2016
    Date of Patent: May 12, 2020
    Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Arinobu Nakamura, Tou Chin
  • Patent number: 10601315
    Abstract: A DC-DC converter is provided with: a first switching circuit in which a first element unit and a second element unit are provided in series between a first conductive path and a reference conductive path; a second switching circuit in which a third element unit and a fourth element unit are provided in series between the first conductive path and the reference conductive path; a first inductor that is connected between a connection node that connects the third element unit and the fourth element unit, and a second conductive path; and a second inductor that is connected between a connection node that connects the first element unit and the second element unit, and the connection node that connects the third element unit and the fourth element unit. A drive unit controls the first switching circuit and the second switching circuit.
    Type: Grant
    Filed: October 24, 2017
    Date of Patent: March 24, 2020
    Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Kazuki Masuda, Tou Chin
  • Patent number: 10582607
    Abstract: Provided is a circuit assembly including: a circuit board; a bus bar having a top face fixed to a bottom face of the circuit board; an electronic component disposed on a top face of the bus bar; a heat dissipation member disposed on a bottom face of the bus bar; a heat transfer member interposed between the bus bar and the heat dissipation member, to transfer heat of the bus bar to the heat dissipation member; and a screw extending through a stack of the circuit board and the bus bar, the screw screwed to the heat dissipation member, fixing the stack to the heat dissipation member; and a spacer interposed between the circuit board and the heat dissipation member, the spacer surrounding at least a portion of an outer circumference of a shaft portion of the screw, and maintaining a thickness of the heat transfer member substantially uniform.
    Type: Grant
    Filed: May 11, 2017
    Date of Patent: March 3, 2020
    Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Arinobu Nakamura, Tou Chin
  • Publication number: 20190289711
    Abstract: A circuit board that includes a substrate that has an upper surface on which a circuit pattern is formed, and a lower surface to which a plurality of bus bars that are spaced apart are fixed; a placement through hole that extends through the upper surface and the lower surface and faces a bus bar of the plurality of bus bars and in which an electronic component is placed; and a terminal conductor foil that protrudes inward into the placement through hole from the lower surface and to which a terminal of the electronic component is connected.
    Type: Application
    Filed: April 6, 2017
    Publication date: September 19, 2019
    Applicants: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Tou CHIN, Arinobu NAKAMURA
  • Publication number: 20190267895
    Abstract: A DC-DC converter is provided with: a first switching circuit in which a first element unit and a second element unit are provided in series between a first conductive path and a reference conductive path; a second switching circuit in which a third element unit and a fourth element unit are provided in series between the first conductive path and the reference conductive path; a first inductor that is connected between a connection node that connects the third element unit and the fourth element unit, and a second conductive path; and a second inductor that is connected between a connection node that connects the first element unit and the second element unit, and the connection node that connects the third element unit and the fourth element unit. A drive unit controls the first switching circuit and the second switching circuit.
    Type: Application
    Filed: October 24, 2017
    Publication date: August 29, 2019
    Inventors: Kazuki Masuda, Tou Chin
  • Patent number: 10389099
    Abstract: A circuit assembly includes: a circuit substrate that has an upper surface on which a circuit pattern has been formed; a plurality of bus bars that are connected to the circuit substrate, and are fixed to a lower surface of the circuit substrate, the plurality of bus bars being spaced apart from each other; an electronic component that includes a package disposed on the bus bar, and a terminal provided within a contour of a lower surface of the package; a sheet substrate that includes one end connected to the terminal and the other end disposed outside the contour of the lower surface of the package; and a pressure-sensitive adhesive sheet that bonds the circuit substrate and the sheet substrate to the plurality of bus bars.
    Type: Grant
    Filed: February 28, 2017
    Date of Patent: August 20, 2019
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Tou Chin, Arinobu Nakamura
  • Patent number: 10334734
    Abstract: A circuit assembly includes a circuit board provided with a connection opening, a plurality of busbars provided on a back surface of the circuit board, an electronic component provided with connection terminals that are soldered to the corresponding busbar exposed through the connection opening, and a solder restricting layer that is provided between the circuit board and the plurality of busbars and includes a pattern surrounding a soldering region of the busbar to which the connection terminals are soldered.
    Type: Grant
    Filed: August 30, 2016
    Date of Patent: June 25, 2019
    Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Tou Chin, Arinobu Nakamura
  • Publication number: 20190166683
    Abstract: Provided is a circuit assembly including: a circuit board; a bus bar having a top face fixed to a bottom face of the circuit board; an electronic component disposed on a top face of the bus bar; a heat dissipation member disposed on a bottom face of the bus bar; a heat transfer member interposed between the bus bar and the heat dissipation member, to transfer heat of the bus bar to the heat dissipation member; and a screw extending through a stack of the circuit board and the bus bar, the screw screwed to the heat dissipation member, fixing the stack to the heat dissipation member; and a spacer interposed between the circuit board and the heat dissipation member, the spacer surrounding at least a portion of an outer circumference of a shaft portion of the screw, and maintaining a thickness of the heat transfer member substantially uniform.
    Type: Application
    Filed: May 11, 2017
    Publication date: May 30, 2019
    Inventors: Arinobu Nakamura, Tou Chin
  • Patent number: 10285274
    Abstract: A circuit structure is provided to which an electronic component can be easily mounted (electrical connection of terminals). A circuit structure that includes a substrate provided with a conductive pattern on one face thereof; a conductive member fixed to the other face of the substrate; an electronic component that has first terminals and of a plurality of terminals, that are electrically connected to the conductive member, and a second terminal of the plurality of terminals that is electrically connected to the conductive pattern provided on the substrate; and a relay member for electrically connecting the second terminal and the conductive pattern provided on the substrate, at least a portion of the relay member being fixed to the conductive member via an insulating material.
    Type: Grant
    Filed: January 13, 2016
    Date of Patent: May 7, 2019
    Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Arinobu Nakamura, Tou Chin
  • Patent number: 10278278
    Abstract: A circuit structure includes an electronic component, a circuit board having a conductive path, the electronic component being mounted on the circuit board, a heat dissipation member on top of which the circuit board is placed and which dissipates heat of the circuit board, a sheet-like spacer sheet provided in a predetermined region between the circuit board and the heat dissipation member, and a bonding portion for bonding the circuit board and the heat dissipation member to each other, the bonding portion having adhesive properties or tackiness and being provided in a region between the circuit board and the heat dissipation member where the spacer sheet is not provided.
    Type: Grant
    Filed: December 15, 2014
    Date of Patent: April 30, 2019
    Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
    Inventor: Tou Chin
  • Patent number: 10263405
    Abstract: A circuit assembly includes an electronic component including a plurality of terminals, a first board that is constituted by an insulating plate provided with a conductive path and an insertion hole into which the electronic component is inserted, a busbar that overlaps the first board, and a second board that is constituted by an insulating plate provided with a conductive path and overlapping the first board, at least a portion of the second board being arranged on the same level as the busbar. The plurality of terminals of the electronic component is connected to the busbar and the conductive path of the second board.
    Type: Grant
    Filed: September 9, 2016
    Date of Patent: April 16, 2019
    Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Tou Chin, Arinobu Nakamura
  • Patent number: 10251268
    Abstract: A circuit structure is provided to which an electronic component can be easily mounted (electrical connection of terminals). A circuit structure that includes a substrate provided with a conductive pattern on one face, a conductive member fixed to another face of the substrate, and an electronic component that has first terminals and, which are a portion of a plurality of terminals, electrically connected to the conductive member, and a terminal, which is a portion of the plurality of terminals, electrically connected to the conductive pattern provided on the substrate, wherein the conductive member has a shape in which at least a portion of the second terminal of the electronic component is not overlapped.
    Type: Grant
    Filed: January 13, 2016
    Date of Patent: April 2, 2019
    Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Arinobu Nakamura, Tou Chin
  • Patent number: 10251261
    Abstract: A circuit structure includes a circuit substrate surface having a circuit pattern; a plurality of bus bars are fixed to another surface of the circuit substrate with an interval therebetween; an electronic component straddles an interval between two adjacent bus bars, a first terminal is electrically connected to one bus bar and a second terminal is electrically connected to the circuit pattern; and a flexible sheet member is fixed to the bus bar to insulate the bus bar and the second terminal from each other, while electrically connecting the second terminal and the circuit pattern. The flexible sheet member includes: an adhesive layer fixed to the bus bar; a terminal conductor foil piece electrically connecting the second terminal and the circuit pattern; and an insulating layer that is interposed between the adhesive layer and the terminal conductor foil piece insulating the bus bar and the terminal conductor foil piece.
    Type: Grant
    Filed: January 25, 2017
    Date of Patent: April 2, 2019
    Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Tou Chin, Arinobu Nakamura
  • Publication number: 20190081468
    Abstract: A circuit assembly includes: a circuit substrate that has an upper surface on which a circuit pattern has been formed; a plurality of bus bars that are connected to the circuit substrate, and are fixed to a lower surface of the circuit substrate, the plurality of bus bars being spaced apart from each other; an electronic component that includes a package disposed on the bus bar, and a terminal provided within a contour of a lower surface of the package; a sheet substrate that includes one end connected to the terminal and the other end disposed outside the contour of the lower surface of the package; and a pressure-sensitive adhesive sheet that bonds the circuit substrate and the sheet substrate to the plurality of bus bars.
    Type: Application
    Filed: February 28, 2017
    Publication date: March 14, 2019
    Applicants: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Tou CHIN, Arinobu NAKAMURA
  • Publication number: 20190074244
    Abstract: A circuit assembly that can be made small and a method for manufacturing the same are provided. A circuit assembly includes a substrate provided with a wiring pattern on one side, and a conductive member fixed to the other side of the substrate, and if portions (terminal portions) that are to be connected to an external electrical element are formed in the conductive member, the conductive member overlaps with the substrate, but not at the portions (terminal portions). A configuration may also be adopted in which the entire conductive member overlaps with the substrate.
    Type: Application
    Filed: August 31, 2016
    Publication date: March 7, 2019
    Inventors: Arinobu Nakamura, Tou Chin
  • Publication number: 20190045635
    Abstract: A circuit assembly includes a circuit board provided with a connection opening, a plurality of busbars provided on a back surface of the circuit board, an electronic component provided with connection terminals that are soldered to the corresponding busbar exposed through the connection opening, and a solder restricting layer that is provided between the circuit board and the plurality of busbars and includes a pattern surrounding a soldering region of the busbar to which the connection terminals are soldered.
    Type: Application
    Filed: August 30, 2016
    Publication date: February 7, 2019
    Inventors: Tou Chin, Arinobu NAKAMURA
  • Publication number: 20180368249
    Abstract: A circuit structure includes a circuit substrate surface having a circuit pattern; a plurality of bus bars are fixed to another surface of the circuit substrate with an interval therebetween; an electronic component straddles an interval between two adjacent bus bars, a first terminal is electrically connected to one bus bar and a second terminal is electrically connected to the circuit pattern; and a flexible sheet member is fixed to the bus bar to insulate the bus bar and the second terminal from each other, while electrically connecting the second terminal and the circuit pattern. The flexible sheet member includes: an adhesive layer fixed to the bus bar; a terminal conductor foil piece electrically connecting the second terminal and the circuit pattern; and an insulating layer that is interposed between the adhesive layer and the terminal conductor foil piece insulating the bus bar and the terminal conductor foil piece.
    Type: Application
    Filed: January 25, 2017
    Publication date: December 20, 2018
    Inventors: Tou Chin, Arinobu Nakamura
  • Patent number: 10154590
    Abstract: Provided are a circuit assembly in which it is possible to eliminate or reduce a level difference between a mounting surface of a substrate and portions to which terminals that are electrically connected to a conductive member are connected, and that can be easily produced, and a method for manufacturing the same. A circuit assembly includes a substrate provided with openings and an electronic component mounted on one side of the substrate, a conductive member that is a plate-shaped member fixed to another side of the substrate, the conductive member constituting a conductive path, and a relay member that is fixed to a surface on the substrate side of the conductive member and made of an electrically conductive material, the relay member being accommodated in the openings formed in the substrate, at least one terminal of the electronic component being connected to the relay member.
    Type: Grant
    Filed: December 8, 2015
    Date of Patent: December 11, 2018
    Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Tou Chin, Yu Muronoi
  • Patent number: 10136511
    Abstract: A circuit assembly includes a circuit board, a heat dissipation member on which the circuit board is placed and that is configured to release heat of the circuit board, an insulating layer that is formed on a surface on the circuit board side of the heat dissipation member, a bonding portion made of a bonding agent that is arranged in a predetermined region between the circuit board and the heat dissipation member, and an adhesive portion that is arranged in a region other than the predetermined region between the circuit board and the heat dissipation member and that is made of an adhesive with which the circuit board and the heat dissipation member are bonded to each other with lower bonding force than with the bonding agent.
    Type: Grant
    Filed: October 2, 2015
    Date of Patent: November 20, 2018
    Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Takehito Kobayashi, Arinobu Nakamura, Tou Chin, Shigeki Yamane