Abstract: Provided is a circuit assembly including a heatsink, an insulating sheet that is placed on the heatsink, and a circuit board that is placed on the heatsink via the insulating sheet. The circuit board is fixed to the heatsink by screwing, and a heat conductive member is arranged between insulating sheet and the circuit board.

Abstract: Provided is a circuit assembly in which the mounting area of a substrate can be increased. A circuit assembly includes an electronic component having a plurality of terminals, a conductive member for supporting the electronic component (10), at least one of the terminals of the electronic component being electrically connected to the conductive member, and a substrate provided with a conductive pattern to which another terminal of the electronic component is electrically connected, in which the substrate is fixed to a surface of the conductive member that is opposite to a surface of the conductive member that supports the electronic component.

Abstract: A circuit assembly includes an electronic component including a plurality of terminals, a first board that is constituted by an insulating plate provided with a conductive path and an insertion hole into which the electronic component is inserted, a busbar that overlaps the first board, and a second board that is constituted by an insulating plate provided with a conductive path and overlapping the first board, at least a portion of the second board being arranged on the same level as the busbar. The plurality of terminals of the electronic component is connected to the busbar and the conductive path of the second board.

Abstract: A circuit structure that has a high rigidity, has high cooling performance for an electronic component, and can reduce electrical resistance between the electronic component and a bus bar. The circuit structure has a circuit board, bus bars, a binding material, metal chips, and electronic components. The circuit board has opening portions that penetrate in the thickness direction. The bus bars are overlaid on the circuit board. The binding material is interposed between the circuit board and the bus bars and binds them. The metal chips are arranged inside the opening portions and also placed on the bus bars. The metal chips each have a top face, which is located in approximately the same plane as an opening end face of an opening portion, and a bottom face, approximately the entire surface of which is joined to a bus bar. The electronic components are soldered to the circuit board and the top faces of the metal chips.

Abstract: A circuit structure is provided to which an electronic component can be easily mounted (electrical connection of terminals). A circuit structure that includes a substrate provided with a conductive pattern on one face, a conductive member fixed to another face of the substrate, and an electronic component that has first terminals and, which are a portion of a plurality of terminals, electrically connected to the conductive member, and a terminal, which is a portion of the plurality of terminals, electrically connected to the conductive pattern provided on the substrate, wherein the conductive member has a shape in which at least a portion of the second terminal of the electronic component is not overlapped.

Abstract: A circuit structure is provided to which an electronic component can be easily mounted (electrical connection of terminals). A circuit structure that includes a substrate provided with a conductive pattern on one face thereof; a conductive member fixed to the other face of the substrate; an electronic component that has first terminals and of a plurality of terminals, that are electrically connected to the conductive member, and a second terminal of the plurality of terminals that is electrically connected to the conductive pattern provided on the substrate; and a relay member for electrically connecting the second terminal and the conductive pattern provided on the substrate, at least a portion of the relay member being fixed to the conductive member via an insulating material.

Abstract: Provided are a circuit assembly in which it is possible to eliminate or reduce a level difference between a mounting surface of a substrate and portions to which terminals that are electrically connected to a conductive member are connected, and that can be easily produced, and a method for manufacturing the same. A circuit assembly includes a substrate provided with openings and an electronic component mounted on one side of the substrate, a conductive member that is a plate-shaped member fixed to another side of the substrate, the conductive member constituting a conductive path, and a relay member that is fixed to a surface on the substrate side of the conductive member and made of an electrically conductive material, the relay member being accommodated in the openings formed in the substrate, at least one terminal of the electronic component being connected to the relay member.

Abstract: A circuit structure includes an electronic component, a circuit board having a conductive path, the electronic component being mounted on the circuit board, a heat dissipation member on top of which the circuit board is placed and which dissipates heat of the circuit board, a sheet-like spacer sheet provided in a predetermined region between the circuit board and the heat dissipation member, and a bonding portion for bonding the circuit board and the heat dissipation member to each other, the bonding portion having adhesive properties or tackiness and being provided in a region between the circuit board and the heat dissipation member where the spacer sheet is not provided.

Abstract: A circuit assembly includes a circuit board, a heat dissipation member on which the circuit board is placed and that is configured to release heat of the circuit board, an insulating layer that is formed on a surface on the circuit board side of the heat dissipation member, a bonding portion made of a bonding agent that is arranged in a predetermined region between the circuit board and the heat dissipation member, and an adhesive portion that is arranged in a region other than the predetermined region between the circuit board and the heat dissipation member and that is made of an adhesive with which the circuit board and the heat dissipation member are bonded to each other with lower bonding force than with the bonding agent.

Abstract: Provided is a circuit assembly including a heatsink, an insulating sheet that is placed on the heatsink, and a circuit boarder that is placed on the heatsink via the insulating sheet. The circuit board is fixed to the heatsink by screwing, and a heat conductive member is arranged between insulating sheet and the circuit board.

Abstract: A circuit-constituting unit forming a distribution circuit or the like in a vehicle. The circuit-constituting unit includes a plurality of bus bars for constituting a power circuit; a semiconductor switching device provided in the power circuit; and a control circuit board. The bus bars are bonded to a surface of the control circuit board such that the bus bars are arranged to be generally coplanar with each other. The semiconductor switching device is mounted on both of the corresponding bus bars and the control circuit board. An opening may be formed through the control circuit board. In this case, one of terminals of the semiconductor switching device may be connected to a surface of the control circuit board facing away from the surface to which the bus bars are bonded. The other terminals may be connected respectively to the bus bar through the opening.

Abstract: A circuit-constituting unit forming a distribution circuit or the like in a vehicle. The circuit-constituting unit includes a plurality of bus bars for constituting a power circuit; a semiconductor switching device provided in the power circuit; and a control circuit board. The bus bars are bonded to a surface of the control circuit board such that the bus bars are arranged to be generally coplanar with each other. The semiconductor switching device is mounted on both of the corresponding bus bars and the control circuit board. An opening may be formed through the control circuit board. In this case, one of terminals of the semiconductor switching device may be connected to a surface of the control circuit board facing away from the surface to which the bus bars are bonded. The other terminals may be connected respectively to the bus bar through the opening.