Abstract: A supply flow passage branches into a plurality of upstream flow passages. The plurality of upstream flow passages include a branching upstream flow passage that branches into a plurality of downstream flow passages. A plurality of discharge ports are respectively disposed at a plurality of positions differing in distance from a rotational axis and discharge processing liquids, supplied via the plurality of upstream flow passages, toward an upper surface of a substrate held by a substrate holding unit.

Abstract: A substrate processing device is provided with: a spin base disposed below a substrate grasped by a plurality of chuck members, the spin base transmitting the drive force of a spin motor to the chuck members; and a nozzle for supplying a processing fluid for processing the substrate to the top surface and/or bottom surface of the substrate. An IH heating mechanism of the substrate processing device has: a heat-generating member disposed between the substrate and the spin base; a heating coil disposed below the spin base; and an IH circuit for supplying electric power to the heating coil, whereby an alternating magnetic field applied to the heat-generating member is generated, and the heat-generating member is caused to generate heat.

Abstract: A supply flow passage branches into a plurality of upstream flow passages. The plurality of upstream flow passages include a branching upstream flow passage that branches into a plurality of downstream flow passages. A plurality of discharge ports are respectively disposed at a plurality of positions differing in distance from a rotational axis and discharge processing liquids, supplied via the plurality of upstream flow passages, toward an upper surface of a substrate held by a substrate holding unit.

Abstract: A supply flow passage branches into a plurality of upstream flow passages. The plurality of upstream flow passages include a branching upstream flow passage that branches into a plurality of downstream flow passages. A plurality of discharge ports are respectively disposed at a plurality of positions differing in distance from a rotational axis and discharge processing liquids, supplied via the plurality of upstream flow passages, toward an upper surface of a substrate held by a substrate holding unit.

Abstract: A substrate processing apparatus including a plurality of baking chambers stacked in a prescribed direction, each baking chamber carrying out heat treatment of a substrate in its interior, a processing unit having a liquid processing chamber separate from the baking chambers and carrying out liquid processing of the substrate using the processing liquid, and an enclosing isolating space that encloses the sides of the plurality of baking chambers and isolates the baking chambers from the surrounding area.

Abstract: A substrate processing apparatus includes a spin chuck, rotating a disk-shaped substrate around a rotational axis while holding it horizontally, a cylindrical guard, receiving a processing liquid scattered outward from the substrate held by the spin chuck, and a centering unit, which brings a center of the substrate close to the rotational axis. The centering unit includes a pusher, contacting the substrate on the spin chuck, and a linear motor, moving the pusher horizontally to move the substrate horizontally with respect to the spin chuck. At least a portion of the linear motor is disposed above the guard such as to overlap with the guard in plan view.

Abstract: A substrate processing apparatus includes a spin base on which a chuck member that holds a peripheral edge of a substrate is disposed, a motor which rotates the spin base, a heater unit which is positioned between the substrate held by the chuck member and an upper surface of the spin base, a processing liquid supply unit which supplies a processing liquid toward a surface of the substrate held by the chuck member, and a microwave generating unit which generates microwaves to a lower surface of the substrate from the heater unit. The microwave generating unit may include a microwave generating member which includes a waveguide disposed in the heater unit, microwave oscillator which is disposed outside the heater unit and a coaxial cable which connects the waveguide to the microwave oscillator.

Abstract: A supply flow passage branches into a plurality of upstream flow passages. The plurality of upstream flow passages include a branching upstream flow passage that branches into a plurality of downstream flow passages. A plurality of discharge ports are respectively disposed at a plurality of positions differing in distance from a rotational axis and discharge processing liquids, supplied via the plurality of upstream flow passages, toward an upper surface of a substrate held by a substrate holding unit.

Abstract: A substrate processing device is provided with: a spin base disposed below a substrate grasped by a plurality of chuck members, the spin base transmitting the drive force of a spin motor to the chuck members; and a nozzle for supplying a processing fluid for processing the substrate to the top surface and/or bottom surface of the substrate. An IH heating mechanism of the substrate processing device has: a heat-generating member disposed between the substrate and the spin base; a heating coil disposed below the spin base; and an IH circuit for supplying electric power to the heating coil, whereby an alternating magnetic field applied to the heat-generating member is generated, and the heat-generating member is caused to generate heat.

Abstract: A supply flow passage branches into a plurality of upstream flow passages. The plurality of upstream flow passages include a branching upstream flow passage that branches into a plurality of downstream flow passages. A plurality of discharge ports are respectively disposed at a plurality of positions differing in distance from a rotational axis and discharge processing liquids, supplied via the plurality of upstream flow passages, toward an upper surface of a substrate held by a substrate holding unit.

Abstract: A supply flow passage branches into a plurality of upstream flow passages. A plurality of discharge ports are respectively disposed at a plurality of positions differing in distance from a rotational axis of a substrate. A return flow passage is connected to the upstream flow passage. A downstream heater heats liquid flowing through the upstream flow passage. A downstream switching unit supplies the liquid, supplied to the plurality of upstream flow passages from the supply flow passage, to one of the plurality of discharge ports and the return flow passage, selectively.

Abstract: A substrate processing apparatus includes a spin base on which a chuck member that holds a peripheral edge of a substrate is disposed, a motor which rotates the spin base, a heater unit which is positioned between the substrate held by the chuck member and an upper surface of the spin base, a processing liquid supply unit which supplies a processing liquid toward a surface of the substrate held by the chuck member, and a microwave generating unit which generates microwaves to a lower surface of the substrate from the heater unit. The microwave generating unit may include a microwave generating member which includes a waveguide disposed in the heater unit, microwave oscillator which is disposed outside the heater unit and a coaxial cable which connects the waveguide to the microwave oscillator.

Abstract: A substrate processing apparatus includes a spin chuck, rotating a disk-shaped substrate around a rotational axis while holding it horizontally, a cylindrical guard, receiving a processing liquid scattered outward from the substrate held by the spin chuck, and a centering unit, which brings a center of the substrate close to the rotational axis. The centering unit includes a pusher, contacting the substrate on the spin chuck, and a linear motor, moving the pusher horizontally to move the substrate horizontally with respect to the spin chuck. At least a portion of the linear motor is disposed above the guard such as to overlap with the guard in plan view.

Abstract: A substrate treatment apparatus is used for treating a major surface of a substrate with a chemical liquid. The substrate treatment apparatus includes: a substrate holding unit which holds the substrate; a chemical liquid supplying unit having a chemical liquid nozzle which supplies the chemical liquid onto the major surface of the substrate held by the substrate holding unit; a heater having an infrared lamp to be located in opposed relation to the major surface of the substrate held by the substrate holding unit to heat the chemical liquid supplied onto the major surface of the substrate by irradiation with infrared radiation emitted from the infrared lamp, the heater having a smaller diameter than the substrate; and a heater moving unit which moves the heater along the major surface of the substrate held by the substrate holding unit.

Abstract: A substrate processing apparatus includes a substrate rotating mechanism for rotating a substrate, a nozzle part for discharging droplets of a processing liquid toward a main surface of the substrate, and a nozzle moving mechanism for moving the nozzle part in a direction along the main surface. The nozzle part includes two guide surfaces (511), two gas ejection ports (512), and two processing liquid supply ports (513). The gas ejection port ejects gas along the guide surface, to thereby form a gas flow flowing along the guide surface. The processing liquid supply port is provided in the guide surface, for supplying the processing liquid to between the gas flow and the guide surface.

Abstract: A substrate processing apparatus including a plurality of baking chambers stacked in a prescribed direction, each baking chamber carrying out heat treatment of a substrate in its interior, a processing unit having a liquid processing chamber separate from the baking chambers and carrying out liquid processing of the substrate using the processing liquid, and an enclosing isolating space that encloses the sides of the plurality of baking chambers and isolates the baking chambers from the surrounding area.

Abstract: In a state of mapping sensors having been advanced into a carrier by a sensor advance/withdraw mover, a sensor lifting and lowering device moves the mapping sensors up and down. With this movement, the mapping sensors detect presence or absence of substrates in a horizontal direction crossing a fore-and-aft direction in which the substrates are moved into and out of the carrier, and a height sensor detects heights of the mapping sensors. Consequently, substrate heights are detected in two different locations in the fore-and-aft direction. Based on the substrate heights, a substrate condition acquiring unit acquires a tilt of each substrate relative to the horizontal in the fore-and-aft direction. The tilt of each substrate inside the carrier is acquired in advance, thereby to be able to prevent substrate damage due to contact between a hand of a substrate transport mechanism and the substrates.

Abstract: The method includes holding a substrate horizontally with a holding and rotating mechanism; introducing processing liquid from a fluid introduction portion of, in a processing liquid pipe in which a processing liquid nozzle having a discharge port at a tip end is provided at one end, the other end of the processing liquid pipe into the processing liquid pipe so as to discharge the processing liquid from the discharge port toward the substrate; introducing, after stopping the processing liquid discharge step, a gas from the fluid introduction portion into the processing liquid pipe so as to extrude the processing liquid within the processing liquid pipe and within the processing liquid nozzle outwardly; and stopping, after starting the introduction of the gas, the introduction of the gas into the processing liquid pipe with the processing liquid being left within the processing liquid pipe and/or the processing liquid nozzle.

Abstract: An object of the present invention is to provide a technique capable of reducing a volume occupied exclusively by a substrate processing apparatus. In order to achieve this object, a substrate processing apparatus includes: multiple processing parts that process a substrate W; a transport robot that makes rectilinear motion along one rectilinear axis or each of more rectilinear axes and rotative motion about a vertical axis to transport a substrate to each of the processing parts; a transport chamber defined as operating space for the transport robot; and a transport controller that controls operation of the transport robot. A first partial area defined in the transport chamber has a width (specifically, a width extending along a horizontal axis perpendicular to the one rectilinear axis or the more rectilinear axes) is smaller than a rotative diameter of the transport robot. The transport controller prohibits the rotative motion of the transport robot in the first partial area.

Abstract: A method for treating substrates with treating liquids, using a treating tank for storing the treating liquids, a holding mechanism for holding the substrates and placing the substrates in a treating position inside the treating tank, a first and a second treating liquid supply device, a temperature control device, and a control device. A first treating liquid is supplied into the treating tank, then a second treating liquid of lower surface tension and higher boiling point than the first treating liquid, is supplied into the treating tank, and placed in a temperature range above the boiling point of the first treating liquid and below the boiling point of the second treating liquid, and then controlling the second treating liquid supply device to replace the first treating liquid stored in the treating tank with the second treating liquid, and controlling the temperature control device to maintain the second treating liquid in the same said temperature range.