Abstract: A supply flow passage branches into a plurality of upstream flow passages. A plurality of discharge ports are respectively disposed at a plurality of positions differing in distance from a rotational axis of a substrate. A return flow passage is connected to the upstream flow passage. A downstream heater heats liquid flowing through the upstream flow passage. A downstream switching unit supplies the liquid, supplied to the plurality of upstream flow passages from the supply flow passage, to one of the plurality of discharge ports and the return flow passage, selectively.

Abstract: A supply flow passage branches into a plurality of upstream flow passages. The plurality of upstream flow passages include a branching upstream flow passage that branches into a plurality of downstream flow passages. A plurality of discharge ports are respectively disposed at a plurality of positions differing in distance from a rotational axis and discharge processing liquids, supplied via the plurality of upstream flow passages, toward an upper surface of a substrate held by a substrate holding unit.

Abstract: In a state of mapping sensors having been advanced into a carrier by a sensor advance/withdraw mover, a sensor lifting and lowering device moves the mapping sensors up and down. With this movement, the mapping sensors detect presence or absence of substrates in a horizontal direction crossing a fore-and-aft direction in which the substrates are moved into and out of the carrier, and a height sensor detects heights of the mapping sensors. Consequently, substrate heights are detected in two different locations in the fore-and-aft direction. Based on the substrate heights, a substrate condition acquiring unit acquires a tilt of each substrate relative to the horizontal in the fore-and-aft direction. The tilt of each substrate inside the carrier is acquired in advance, thereby to be able to prevent substrate damage due to contact between a hand of a substrate transport mechanism and the substrates.

Abstract: The method includes holding a substrate horizontally with a holding and rotating mechanism; introducing processing liquid from a fluid introduction portion of, in a processing liquid pipe in which a processing liquid nozzle having a discharge port at a tip end is provided at one end, the other end of the processing liquid pipe into the processing liquid pipe so as to discharge the processing liquid from the discharge port toward the substrate; introducing, after stopping the processing liquid discharge step, a gas from the fluid introduction portion into the processing liquid pipe so as to extrude the processing liquid within the processing liquid pipe and within the processing liquid nozzle outwardly; and stopping, after starting the introduction of the gas, the introduction of the gas into the processing liquid pipe with the processing liquid being left within the processing liquid pipe and/or the processing liquid nozzle.

Abstract: An object of the present invention is to provide a technique capable of reducing a volume occupied exclusively by a substrate processing apparatus. In order to achieve this object, a substrate processing apparatus includes: multiple processing parts that process a substrate W; a transport robot that makes rectilinear motion along one rectilinear axis or each of more rectilinear axes and rotative motion about a vertical axis to transport a substrate to each of the processing parts; a transport chamber defined as operating space for the transport robot; and a transport controller that controls operation of the transport robot. A first partial area defined in the transport chamber has a width (specifically, a width extending along a horizontal axis perpendicular to the one rectilinear axis or the more rectilinear axes) is smaller than a rotative diameter of the transport robot. The transport controller prohibits the rotative motion of the transport robot in the first partial area.

Abstract: A substrate treatment apparatus is used for treating a major surface of a substrate with a chemical liquid. The substrate treatment apparatus includes: a substrate holding unit which holds the substrate; a chemical liquid supplying unit having a chemical liquid nozzle which supplies the chemical liquid onto the major surface of the substrate held by the substrate holding unit; a heater having an infrared lamp to be located in opposed relation to the major surface of the substrate held by the substrate holding unit to heat the chemical liquid supplied onto the major surface of the substrate by irradiation with infrared radiation emitted from the infrared lamp, the heater having a smaller diameter than the substrate; and a heater moving unit which moves the heater along the major surface of the substrate held by the substrate holding unit.

Abstract: A substrate treatment apparatus is used for treating a major surface of a substrate with a chemical liquid. The substrate treatment apparatus includes: a substrate holding unit which holds the substrate; a chemical liquid supplying unit having a chemical liquid nozzle which supplies the chemical liquid onto the major surface of the substrate held by the substrate holding unit; a heater having an infrared lamp to be located in opposed relation to the major surface of the substrate held by the substrate holding unit to heat the chemical liquid supplied onto the major surface of the substrate by irradiation with infrared radiation emitted from the infrared lamp, the heater having a smaller diameter than the substrate; and a heater moving unit which moves the heater along the major surface of the substrate held by the substrate holding unit.

Abstract: A method for treating substrates with treating liquids, using a treating tank for storing the treating liquids, a holding mechanism for holding the substrates and placing the substrates in a treating position inside the treating tank, a first and a second treating liquid supply device, a temperature control device, and a control device. A first treating liquid is supplied into the treating tank, then a second treating liquid of lower surface tension and higher boiling point than the first treating liquid, is supplied into the treating tank, and placed in a temperature range above the boiling point of the first treating liquid and below the boiling point of the second treating liquid, and then controlling the second treating liquid supply device to replace the first treating liquid stored in the treating tank with the second treating liquid, and controlling the temperature control device to maintain the second treating liquid in the same said temperature range.

Abstract: A method for treating substrates with treating liquids, using a treating tank for storing the treating liquids, a holding mechanism for holding the substrates in a treating position inside the treating tank, first and second treating liquid supply devices, a temperature control device, and a control device. A first treating liquid is supplied into the treating tank, then a second treating liquid of lower surface tension and higher boiling point than the first treating liquid is supplied, and placed in a temperature range above the boiling point of the first treating liquid and below the boiling point of the second treating liquid. Then the second treating liquid supply device may be controlled to replace the first treating liquid with the second treating liquid, while controlling the temperature control device to maintain the second treating liquid in the same temperature range.

Abstract: A substrate treating method for treating substrates with a treating liquid includes a deionized water cleaning step for supplying deionized water from an injection pipe and cleaning the substrates inside a cleaning tank with deionized water, then a replacing step for injecting a solvent from a solvent injector and replacing the deionized water with the solvent, a separating and removing step for switching a channel to a branch pipe and causing a separator to remove the deionized water from the treating liquid, and an adsorbing and removing step for switching the channel to another branch pipe and causing a deionized water remover to adsorb and remove the deionized water from the treating liquid.

Abstract: A substrate treating method for treating substrates with a treating liquid includes a deionized water cleaning step for supplying deionized water from an injection pipe and cleaning the substrates inside a cleaning tank with deionized water, then a replacing step for injecting a solvent from a solvent injector and replacing the deionized water with the solvent, a separating and removing step for switching a channel to a branch pipe and causing a separator to remove the deionized water from the treating liquid, and an adsorbing and removing step for switching the channel to another branch pipe and causing a deionized water remover to adsorb and remove the deionized water from the treating liquid.

Abstract: A substrate processing apparatus and a substrate processing method, with which a resist can be removed satisfactorily from the substrate and a processing solution used for removing the resist can be recycled, are provided. The substrate processing apparatus includes: a substrate holding means holding a substrate; a peroxosulfuric acid generating means generating a peroxosulfuric acid using sulfuric acid; a mixing means mixing the peroxosulfuric acid generated by the peroxosulfuric acid generating means and sulfuric acid of higher temperature and higher concentration than the sulfuric acid used in the peroxosulfuric acid generating means; and a discharging means discharging, toward the substrate held by the substrate holding means, the mixed solution of the peroxosulfuric acid and the sulfuric acid mixed by the mixing means as a processing solution for removing a resist from the substrate.

Abstract: A method for treating substrates with treating liquids, using a treating tank for storing the treating liquids, a holding mechanism for holding the substrates and placing the substrates in a treating position inside the treating tank, a first and a second treating liquid supply device, a temperature control device, and a control device. A first treating liquid is supplied into the treating tank, then a second treating liquid of lower surface tension and higher boiling point than the first treating liquid, is supplied into the treating tank, and placed in a temperature range above the boiling point of the first treating liquid and below the boiling point of the second treating liquid, and then controlling the second treating liquid supply device to replace the first treating liquid stored in the treating tank with the second treating liquid, and controlling the temperature control device to maintain the second treating liquid in the same said temperature range.

Abstract: The substrate treatment method includes: a cleaning step of supplying deionized water to a major surface of a substrate to clean the substrate; a pre-drying treatment step of supplying a pre-drying treatment liquid containing an organic solvent more volatile than the deionized water to the major surface of the substrate after the cleaning step to replace deionized water remaining on the major surface with the pre-drying treatment liquid; and a drying step of removing the pre-drying treatment liquid supplied to the major surface of the substrate after the pre-drying treatment step to dry the substrate.

Abstract: A substrate processing apparatus and a substrate processing method, with which a resist can be removed satisfactorily from the substrate and a processing solution used for removing the resist can be recycled, are provided. The substrate processing apparatus includes: a substrate holding means holding a substrate; a peroxosulfuric acid generating means generating a peroxosulfuric acid using sulfuric acid; a mixing means mixing the peroxosulfuric acid generated by the peroxosulfuric acid generating means and sulfuric acid of higher temperature and higher concentration than the sulfuric acid used in the peroxosulfuric acid generating means; and a discharging means discharging, toward the substrate held by the substrate holding means, the mixed solution of the peroxosulfuric acid and the sulfuric acid mixed by the mixing means as a processing solution for removing a resist from the substrate.

Abstract: A substrate treating apparatus for treating substrates with a treating liquid includes a treating tank having an inner tank for storing the treating liquid, and an outer tank for collecting the treating liquid overflowing the inner tank. A supply pipe interconnects the inner tank and the outer tank for circulating the treating liquid. A first branch pipe is shunted from the supply pipe, and a separator is mounted on the first branch pipe for separating deionized water and a solvent in the treating liquid, and discharging the deionized water. A second branch pipe interconnects positions upstream and downstream of the separator, and a deionized water remover is mounted on the second branch pipe for adsorbing and removing deionized water from the treating liquid. An injection pipe is connected to the supply pipe for injecting deionized water in a position downstream of the separator. A solvent injector injects the solvent into the injection pipe.

Abstract: A substrate treating apparatus for treating substrates with treating liquids.

Abstract: Holes having a variety of shapes exist on a surface of a substrate. When pure water is supplied on the substrate in a rinsing process, part of the pure water enters the holes. The pure water which have entered the holes can be hardly shaken off even though the substrate is rotated at a high speed. Therefore, HFE is held on the substrate so as to form an HFE layer after the rinsing process. In this case, the HFE enters the holes while the pure water emerges from the holes to the upper surface of the HFE due to a difference in specific gravity between the pure water and the HFE. Thus, the pure water is reliably prevented from remaining in the holes.

Abstract: The substrate treatment method includes: a cleaning step of supplying deionized water to a major surface of a substrate to clean the substrate; a pre-drying treatment step of supplying a pre-drying treatment liquid containing an organic solvent more volatile than the deionized water to the major surface of the substrate after the cleaning step to replace deionized water remaining on the major surface with the pre-drying treatment liquid; and a drying step of removing the pre-drying treatment liquid supplied to the major surface of the substrate after the pre-drying treatment step to dry the substrate.

Abstract: Seven gas ejection ports are provided in an upper surface of a transport arm, and are connected to gas supply piping. The gas supply piping is connected through a valve to a nitrogen gas supply unit. When the valve is opened with a substrate held on the transport arm, nitrogen gas is supplied from the nitrogen gas supply unit and ejected toward the entire space between the substrate held by the transport arm and the transport arm. Supplying the nitrogen gas to the space between the substrate and the transport arm prior to the loading of the substrate into a chamber causes the ambient atmosphere in the space to be replaced with the nitrogen gas. The transport arm is prevented from bringing the ambient atmosphere into the chamber, whereby the increase in oxygen concentration within the chamber is reliably inhibited. This provides a heat treatment apparatus capable of reliably inhibiting the increase in oxygen concentration within the chamber.