Abstract: An initial operating speed of a cooling fan at an information handling system is determined. A microphone is located at the system to favor acquisition of ambient sound relative to acquisition of sound emanating from the cooling fan. An audio signal is received from the microphone. The operating speed of the cooling fan is adjusted based on a level of the audio signal.

Abstract: A chassis and a method of manufacturing a chassis of an information handling system are disclosed. The chassis includes a carbon-fiber composite and a plurality vents of formed in the carbon-fiber composite. Each of the plurality of vents is a channel extending through the carbon-fiber composite.

Abstract: In accordance with embodiments of the present disclosure, an information handling system may include a processor, a user interface communicatively coupled to the processor, and a thermal management application. The thermal management application may include a program of instructions embodied in non-transitory computer-readable media, and may be configured to, when executed by the processor receive measurements associated with a plurality of parameters of a thermal system of the information handling system, calculate a calculated thermal resistance based on the measurements, and report information regarding the calculated thermal resistance via the user interface.

Abstract: A tablet information handling system has power contacts disposed on an outer surface of a planar housing to accept power from a power connector without affixing the power connector to the power contacts at the planar housing. For example, the power connector is disposed at a support surface of a stand in a position that aligns with power contacts of the planar housing when the planar housing rests on the support surface. The power connector provides power without a port or similar structure so that the planar housing may be place on and taken off the support surface at a variety of orientations rotated about the axis at which the power connector and power contacts meet.

Abstract: Thermal energy exposed at the outer surface of an information handling system housing is managed by spreading the thermal energy across the housing X and Y axes while restricting heat transfer from the housing at the Z axis. For example, a graphene outer surface couples to an aerogel substrate strengthened by a carbon fiber laminate. The graphene spreads thermal energy that escapes through the housing across the housing outer surface to limit the impact of thermal energy at any particular location, such as proximate to the location of a processor.

Abstract: A system for heat exchange includes a first condenser that places a first working fluid vapor in proximity to a second working fluid liquid. The two working fluids have respective saturation temperatures that enable the second working fluid to absorb sufficient amounts of heat from the first working fluid vapor to vaporize, while the first working fluid vapor condenses back into a liquid. The second working fluid vapor exits the first condenser via a first conduit and enters a first heat exchanger which places the second working fluid vapor in proximity to a third working fluid. The relative saturation temperatures of the second and third working fluids enables the transfer of sufficient amounts of heat from the second working fluid vapor to cause the second working fluid vapor to condense back into liquid while at least a portion of the third working fluid liquid vaporizes into third working fluid vapor.

Abstract: A chassis and a method of manufacturing a chassis of an information handling system are disclosed. The chassis includes a carbon-fiber composite and a plurality vents of formed in the carbon-fiber composite. Each of the plurality of vents is a channel extending through the carbon-fiber composite.

Abstract: An IHS chassis defines an IHS housing that houses a plurality of IHS components. The IHS chassis includes an outer surface located opposite the IHS chassis from the IHS housing. A first layer of the IHS chassis provides the outer surface of the IHS chassis. The first layer includes a first layer oxidized surface located opposite the first layer from the outer surface of the chassis base. A second layer of the chassis base is located immediately adjacent the IHS housing. The second layer includes a carbide-based composite material that provides a thermal conductivity of less than 1 watt per meter-kelvin in a direction that is generally perpendicular to the outer surface of the IHS chassis, while providing a thermal conductivity of at least 100 W/mK in directions that are generally parallel to the outer surface of the IHS chassis.