Abstract: Thermal energy exposed at the outer surface of an information handling system housing is managed by spreading the thermal energy across the housing X and Y axes while restricting heat transfer from the housing at the Z axis. For example, a graphene outer surface couples to an aerogel substrate strengthened by a carbon fiber laminate. The graphene spreads thermal energy that escapes through the housing across the housing outer surface to limit the impact of thermal energy at any particular location, such as proximate to the location of a processor.

Abstract: An information handling system includes a processor configured to operate in one of a plurality of power states. An audio circuit measures an ambient audio environment within the information handling system, classifies the measured ambient audio into one of a plurality of categories, and implements a power management policy for the processor in response to the measured ambient audio being classified into the one of the categories.

Abstract: An information handling system includes a processor configured to operate in one of a plurality of power states. An audio circuit measures an ambient audio environment within the information handling system, classifies the measured ambient audio into one of a plurality of categories, and implements a power management policy for the processor in response to the measured ambient audio being classified into the one of the categories.

Abstract: An information handling system (IHS) includes a base station that has a transmitter coil to generate a magnetic field for charging a portable power source of a battery-powered electronic device. A receiver coil magnetically receives power from the transmitter coil of the base station. A power control module connected to the portable power source and the receiver coil charges the portable power source with the received power. A flexible ferrite shield is positioned on a side of the receiver coil opposite to the transmitter coil to shield the IHS electronics. A pneumatic diaphragm is formed by a portion of the flexible ferrite shield that is positioned for oscillating movement into a center cavity of the receiver coil. A diaphragm actuator is attached to the pneumatic diagram and is responsive to a triggering signal to oscillate the pneumatic diaphragm to disperse thermal energy that is generated by the receiver coil.

Abstract: A power adapter device may include a power field effect transistor (FET), a transformer including a radiant heat exchanger, and electrical conductors coupled between the power FET and the transformer. The electrical conductors may transfer heat generated by the power FET from the power FET to the transformer. The radiant heat exchanger may dissipate a portion of the heat to cool the power FET. As such, the radiant heat exchanger may function as a heat sink for the power FET, enabling efficient heat dissipation using a compact design.

Abstract: A power adapter device may include a power field effect transistor (FET), a transformer including a radiant heat exchanger, and electrical conductors coupled between the power FET and the transformer. The electrical conductors may transfer heat generated by the power FET from the power FET to the transformer. The radiant heat exchanger may dissipate a portion of the heat to cool the power FET. As such, the radiant heat exchanger may function as a heat sink for the power FET, enabling efficient heat dissipation using a compact design.

Abstract: A heat exchanger includes a flat tube microchannel. A major surface of the microchannel has a first width at a first and a second opposite end portion to couple each end portion to a corresponding fluid distribution header. A middle portion of the microchannel between the first and second end portions has a second width that is greater than the first width. Fins are attached to the middle portion of the first major surface of the flat tube microchannel.

Abstract: A multilayer thermal laminate with aerogel is used for a battery cell enclosure to improve thermal properties and to reduce thermal inhomogeneity in the form of localized hotspots that exceed a desired rated temperature, thereby enabling a more compact design within rated thermal design limits for a given electrical performance.

Abstract: A direct-contact liquid-cooled (DL) Rack Information Handling System (RIHS) includes liquid cooled (LC) nodes having a chassis received in a respective chassis-receiving bay of the rack and containing heat-generating functional components. The LC node configured with a system of conduits to receive direct contact of cooling liquid to regulate the ambient temperature of the node and provide cooling to the functional components inside the node by removing heat generated by the heat-generating functional components. The chassis has a leak containment barrier configured with a trough that underlays a portion of the system of conduits of the LC node and that forms a drain path to a drain port of the chassis. In one or more embodiments, the storage drive carrier has vibration absorbing material that mitigates vibrations of a storage drive placed in the storage drive carrier.

Abstract: In accordance with embodiments of the present disclosure, a method may include based on a power consumed by at least one information handling resource and thermal resistances associated with heat-rejecting media thermally coupled to the at least one information handling resource, calculating an exhaust temperature of the heat-rejecting media proximate to an exhaust of an enclosure housing the at least one information handling resource. The method may also include based on the exhaust temperature, controlling at least one of an operating frequency of the at least one information handling resource and a flow rate of fluid proximate to the heat-rejecting media.

Abstract: A method and an information handling system for selecting or scaling system performance. The method of scaling performance of an information handling system includes a controller receiving component data that identifies a heat removal effectiveness of a cooling component, selecting a performance characteristics of the information handling system based on the received component data, and adjusting the operating parameters of the information system to achieve the selected performance characteristics and heat removal capability. The controller communicates with the cooling component through a serial signal bus. The cooling component includes a cooling device and storage.

Abstract: A direct-interface liquid-cooled (DL) Rack Information Handling System (RIHS) includes liquid cooled (LC) nodes that include a system of conduits supplying cooling liquid through the node enclosure and including a supply conduit extending from a node inlet coupling and a return conduit terminating in a node outlet coupling. The node inlet port and the node outlet port are positioned in an outward facing direction at a rear of the node enclosure and aligned to releasably seal to the respective inlet liquid port and outlet liquid port in the node-receiving slot for fluid transfer through the system of conduits. An air-spring reducer conduit is in fluid communication with the system of conduits and shaped to trap an amount of compressible fluid that compresses during sealing engagement between the node inlet coupling and node outlet coupling and the inlet liquid port and outlet liquid port, respectively.

Abstract: Systems and methods for component population optimization are described. In some embodiments, an Information Handling System (IHS) may include a logic circuit and a memory coupled to the logic circuit, the memory having information stored thereon that, upon access by the logic circuit, enable the IHS to: identify a connector provided on a Printed Circuit Board (PCB), wherein the connector is configured to receive a device and to couple the device to a processor; and visually indicate a status of the connector.

Abstract: A Rack Information Handling System (RIHS) has a liquid-to-liquid heat exchanger (LTLHE) that is received in a rear section of a rack and includes node-receiving supply port/s and return port/s. LTLHE includes a first liquid manifold extending between the node-receiving supply port/s and the node-receiving return port/s. LTLHE includes a second liquid manifold capable of being in sealed fluid connection to a supply conduit and a return conduit of a liquid cooling supply for fluid transfer of a second cooling liquid. LTLHE includes a transfer plate formed of thermally conductive material separating the first and second liquid manifolds for transferring heat from the first cooling liquid to the second cooling liquid. RIHS includes a node-receiving chassis configured to receive inserted liquid cooled nodes that sealingly engage for fluid transfer of the first liquid to LTLHE embedded in the rack for heat absorption and transfer by the second liquid.

Abstract: In some examples, a computing device may include a set of components (e.g., processor, memory, and the like) and a conductive sheet (or cable). The conductive sheet (or cable) may include a first graphene layer to dissipate at least a portion of heat generated by a component (e.g., the processor) of the first set of components and a second graphene layer that is used as an electrical ground by signals communicated between a first component and a second component of the set of components. The computing device may include a single housing or a first housing (with a first display device) attached to a second housing (with a second display device) by one or more hinges.

Abstract: In some examples, a computing device may include a first housing coupled to a second housing by one or more hinges. The first housing may include a first set of components and a heat sink in contact with at least one component of the first set of components. The second housing may include a second set of components. The first set of components may generate more heat than the first set of components. A thermal spreader may include a first portion located in the first housing and a second portion located in the second housing. The first portion may be thermally coupled to the second portion. The first portion may, through contact with the heat sink, gather heat generated by the at least one component and transfer the heat to the second portion. The second portion may dissipate at least some of the heat.

Abstract: A wireless charging device includes an enclosure base and an enclosure top. A portion of the enclosure top is inclined relative to the base. A power transmission antenna is disposed on an under-surface of the inclined portion. A first inlet is located proximate to the enclosure base for receiving ambient air. An outlet is located proximate to an apex of the inclined portion for exhausting air. Airflow from the inlet to the outlet is based only on passive air convection.

Abstract: A computer-implemented method regulates exhaust air temperature from direct interface liquid-cooled (DL) nodes in a rack information handling system (RIHS). The method includes receiving a first input corresponding to a desired ambient temperature of an exterior space and a second input is corresponding to an amount of heat being dissipated from functional components operating within an interior space of at least one LC node. An ambient temperature reading of the exterior space is received. A flow rate is calculated for liquid flowing through an air-to-liquid heat exchange (ATLHE) subsystem that results in an amount of heat exchange in the ATLHE subsystem, which generates exhaust air at a temperature that causes a change in the ambient temperature towards the desired ambient temperature. The flow rate is dynamically adjusted of the liquid flowing through the ATLHE subsystem to the calculated flow rate.

Abstract: Embodiments of apparatuses and methods are provided herein for characterizing a heat pipe, and for controlling an operating parameter of at least one heat generating component thermally coupled to the heat pipe based on a temperature difference measured across a first section and a second section of the heat pipe. For example, a characterization method is provided for determining at least one threshold value, which can be used to predict heat pipe dry-out within the heat pipe, and a thermal time constant (time lag) between the onset of heat pipe dry-out and a heat pipe dry-out limit. During subsequent system operation, the predetermined threshold value and thermal time constant may be used to extend the performance of the heat pipe to the edge of its cooling capacity.

Abstract: In some examples, a computing device may include a first housing coupled to a second housing by one or more hinges. The first housing may include a first set of components and a heat sink in contact with at least one component of the first set of components. The second housing may include a second set of components. The first set of components may generate more heat than the first set of components. A thermal spreader may include a first portion located in the first housing and a second portion located in the second housing. The first portion may be thermally coupled to the second portion. The first portion may, through contact with the heat sink, gather heat generated by the at least one component and transfer the heat to the second portion. The second portion may dissipate at least some of the heat.