Abstract: Prior to deposition of a silicon nitride (SiN) layer on a structure, a non-plasma enhanced operation is undertaken wherein the structure is exposed to silane (SiH4) flow, reducing the overall exposure of the structure to hydrogen radicals. This results in the silicon nitride being strongly bonded to the structure and in improved performance.

Abstract: Techniques and corresponding circuitry for deriving a supply a bias voltage for a memory cell array from a received reference voltage is presented. The circuit includes a voltage determination circuit, which is connected to receive the reference voltage and generate from it the bias voltage, a temperature sensing circuit, and a calibration circuit. The calibration circuit is connected to receive the bias voltage and to receive a temperature indication from the temperature sensing circuit and determine from the bias voltage and temperature indication a compensation factor that is supplied to the voltage determination circuit, which adjusts the bias voltage based upon the compensation factor.

Abstract: A charge pump circuit for generating an output voltage is described. Charge pump circuits typically have two branches. As the clocks supplying the branches of a charge pump circuit alternate, the output of each branch will alternately provide an output voltage, which are then combined to form the pump output. The techniques described here allow charge to be transferred between the two branches, so that as the capacitor of one branch discharges, it is used to charge up the capacitor in the other branch.

Abstract: A non-volatile memory device has individual pages of memory cells to be sensed in parallel. The memory device includes a source level tracking circuit coupled to receive a predetermined word line voltage from a word line voltage supply and the voltage level at the aggregate source node of one or more pages and coupled to provide to word lines of the memory an output voltage during the sensing operation, where the source level tracking circuit includes an op amp whereby the output voltage is the word line voltage offset by an amount to track the voltage level at the aggregate node and compensate for source bias errors due to a finite resistance in the ground loop.

Abstract: Prior to deposition of a silicon nitride (SiN) layer on a structure, a non-plasma enhanced operation is undertaken wherein the structure is exposed to silane (SiH4) flow, reducing the overall exposure of the structure to hydrogen radicals. This results in the silicon nitride being strongly bonded to the structure and in improved performance.

Abstract: A non-volatile memory device has individual pages of memory cells to be sensed in parallel. The memory device includes a source level tracking circuit coupled to receive a predetermined word line voltage from a word line voltage supply and the voltage level at the aggregate source node of one or more pages and coupled to provide to word lines of the memory an output voltage during the sensing operation, where the source level tracking circuit includes an op amp whereby the output voltage is the word line voltage offset by an amount to track the voltage level at the aggregate node and compensate for source bias errors due to a finite resistance in the ground loop.

Abstract: Techniques and corresponding circuitry for deriving a supply a bias voltage for a memory cell array from a received reference voltage is presented. The circuit includes a voltage determination circuit, which is connected to receive the reference voltage and generate from it the bias voltage, a temperature sensing circuit, and a calibration circuit. The calibration circuit is connected to receive the bias voltage and to receive a temperature indication from the temperature sensing circuit and determine from the bias voltage and temperature indication a compensation factor that is supplied to the voltage determination circuit, which adjusts the bias voltage based upon the compensation factor.

Abstract: A method for forming a single damascene and/or dual damascene, contact and interconnect structure, comprising: performing front end processing, depositing copper including a copper barrier, annealing the copper in at least 90% N2 with less than 10% H2, performing planarization, performing in-situ low-H NH3 plasma treatment and low Si—H SiN etch stop layer deposition, and performing remaining back end processing.

Abstract: A non-volatile memory device has individual pages of memory cells to be sensed in parallel. The memory device includes a source level tracking circuit coupled to receive a predetermined word line voltage from a word line voltage supply and the voltage level at the aggregate source node of one or more pages and coupled to provide to word lines of the memory an output voltage during the sensing operation, where the source level tracking circuit includes an op amp whereby the output voltage is the word line voltage offset by an amount to track the voltage level at the aggregate node and compensate for source bias errors due to a finite resistance in the ground loop.

Abstract: Controlling a bitline bias voltage by sensing the bitline bias voltage, modifying a bitline bias control signal in accordance with the sensed bitline bias voltage, and controlling the bitline bias voltage in accordance with the modified bitline bias control signal. The modifying the bitline bias control signal is carried out by enabling a pull up circuit and disabling a pull down circuit in response to a first control signal and disabling the pull up circuit and enabling the pull down circuit in response to a second control signal.

Abstract: Controlling a bitline bias voltage by sensing the bitline bias voltage, modifying a bitline bias control signal in accordance with the sensed bitline bias voltage, and controlling the bitline bias voltage in accordance with the modified bitline bias control signal. The modifying the bitline bias control signal is carried out by enabling a pull up circuit and disabling a pull down circuit in response to a first control signal and disabling the pull up circuit and enabling the pull down circuit in response to a second control signal.

Abstract: Controlling a bitline bias voltage by sensing the bitline bias voltage, modifying a bitline bias control signal in accordance with the sensed bitline bias voltage, and controlling the bitline bias voltage in accordance with the modified bitline bias control signal. The modifying the bitline bias control signal is carried out by enabling a pull up circuit and disabling a pull down circuit in response to a first control signal and disabling the pull up circuit and enabling the pull down circuit in response to a second control signal.

Abstract: According to different embodiments of the present invention, various methods, devices and systems are described for managing power in charge pumps in a non-volatile memory system having a high voltage charge pump and associated regulator. A method includes the following operations, receiving an operation command corresponding to an operation, pumping up a charge pump output voltage to a desired output voltage, turning off the regulator and the charge pump when the output voltage is approximately the desired output voltage compensating for charge sharing by turning on the charge pump and setting a pump clock rate to a slow clock rate in order to avoid overshooting the desired output voltage by the charge pump while the operation is being carried out, and compensating for junction leakage by turning on the regulator and the charge pump until the charge pump output voltage is the desired output voltage.

Abstract: According to different embodiments of the present invention, various methods, devices and systems are described for managing power in charge pumps in a non-volatile memory system having a high voltage charge pump and associated regulator. A method includes the following operations, receiving an operation command corresponding to an operation, pumping up a charge pump output voltage to a desired output voltage, turning off the regulator and the charge pump when the output voltage is approximately the desired output voltage compensating for charge sharing by turning on the charge pump and setting a pump clock rate to a slow clock rate in order to avoid overshooting the desired output voltage by the charge pump while the operation is being carried out, and compensating for junction leakage by turning on the regulator and the charge pump until the charge pump output voltage is the desired output voltage.

Abstract: In a Dickson type charge pump in which a plurality of serially connected diodes sequentially respond to anti-phase 50/50 clock cross over or overlapped (?1, ?2), efficiency of the charge pump is increased by providing with each diode a charge transfer transistor in parallel therewith between two adjacent nodes, and driving the charge transfer transistor to conduction during a time when the parallel diode is conducting thereby transferring any residual trapped charge at one node through the charge transfer transistor to the next node. Operating frequency can be increased by providing a pre-charge diode coupling an input node to the gate of the charge transfer transistor to facilitate conductance of the charge transfer transistor, and by coupling the control terminal of the charge transfer transistor to an input node in response to charge on an output node to thereby equalize charge on the control terminal and on the input node during a recovery period.

Abstract: In a Dickson type charge pump in which a plurality of serially connected diodes sequentially respond to anti-phase 50/50 clock cross over or overlapped (?1, ?2), efficiency of the charge pump is increased by providing with each diode a charge transfer transistor in parallel therewith between two adjacent nodes, and driving the charge transfer transistor to conduction during a time when the parallel diode is conducting thereby transferring any residual trapped charge at one node through the charge transfer transistor to the next node. Operating frequency can be increased by providing a pre-charge diode coupling an input node to the gate of the charge transfer transistor to facilitate conductance of the charge transfer transistor, and by coupling the control terminal of the charge transfer transistor to an input node in response to charge on an output node to thereby equalize charge on the control terminal and on the input node during a recovery period.