Abstract: In one aspect, the present invention provides light emitting devices, including light fixtures and luminaires. In some embodiments, a light emitting device comprises at least one light source, a lightguide operable to receive light from the at least one light source at a first location on the lightguide, at least one light extraction region optically coupled to the lightguide and a substantially non-scattering region along a portion of the lightguide.

Abstract: An image sensor pixel that includes a photoelectric conversion unit supported by a substrate and an insulator adjacent to the substrate. The pixel includes a light guide that is located within an opening of the insulator and extends above the insulator such that a portion of the light guide has an air interface. The air interface improves the internal reflection of the light guide. Additionally, the light guide and an adjacent color filter are constructed with a process that optimizes the upper aperture of the light guide. These characteristics of the light guide eliminate the need for a microlens.

Abstract: A solid state light module incorporating light emitting diodes (LEDs) disposed on a metal substrate, a solid state lighting system employing such modules, and method of replacing LEDs of the light modules are provided. The metal substrate may allow for lower LED junction temperature and, hence, a longer device lifetime. In addition, the metal substrate may allow for the potential omission of a heat sink, which may reduce light module size, when compared to conventional solid state light emitters.

Abstract: The invention relates to tear-back thermoformed high impact polystyrene lids having from at least 10% to about 15% of filler and the specified configuration of the tear-back portion. In particular, the tear back lid comprises a tear back portion defined by two sets of tear back indentations and a left and a right notch cut into a skirt defined by the outer diameter of the lid. The combination of the filler amount and tear-back configuration allows an improved tearability for the filled polystyrene lids.

Abstract: An intrinsically phase-balanced direct current (DC) uninterruptible power supply (UPS) is provided. The DC UPS includes first, second, and third alternating current (AC) phase inputs. First, second, and third rectifiers are coupled to the first, second, and third AC phase inputs. A common node is coupled to the first, second, and third rectifiers. At least one DC output is coupled to the common node. The at least one DC output is adapted for connection to at least one electrical load. A battery is coupled to the common node. A blocking diode is coupled between the battery and the common node.

Abstract: Fluorescent lighting fixture modules for indirect lighting of interior spaces, each module including at least one, and preferably a pair of side-by-side parallel linear indirect fluorescent lighting fixture elements suspended at fixed grid pattern locations beneath the ceiling of the open interior space. Each of the linear indirect lighting fixture elements is preferably no greater than approximately six feet in length with a suitable length being somewhat greater than four feet where a four foot lamp is used. Where the fixture elements are provided in pairs, each is suspended below the ceiling at its fixed grid location by a suitable hanger structure with a preferred overall fixture module width of approximately four feet.

Abstract: A structure includes a semiconductor die that has an arrangement of die pads on a surface of the semiconductor die. A first row of die pads consists of a first group of four die pads and run in a first direction. A second row of die pads are adjacent to the first row and consist of a second group of four die pads running in the first direction. The second row begins at a first offset in the first direction from where the first row begins. A third row of die pads are adjacent to the second row and comprise a third group of four die pads that run in the first direction. The third row begins at a second offset in the first direction from where the second row begins. This allows for relatively easy access to all of the die pads.

Abstract: The present disclosure provides methods and systems for controlling temperature. The method has particular utility in connection with controlling temperature in a deposition process, e.g., in depositing a heat-reflective material via CVD. One exemplary embodiment provides a method that involves monitoring a first temperature outside the deposition chamber and a second temperature inside the deposition chamber. An internal temperature in the deposition chamber can be increased in accordance with a ramp profile by (a) comparing a control temperature to a target temperature, and (b) selectively delivering heat to the deposition chamber in response to a result of the comparison. The target temperature may be determined in accordance with the ramp profile, but the control temperature in one implementation alternates between the first temperature and the second temperature.

Abstract: A method for the separation of multiple dies during semiconductor fabrication is described. On an upper surface of a semiconductor wafer containing multiple dies, a seed metal layer may be used to grow hard metal layers above it for handling. Metal may be plated above these metal layers everywhere except where a block of stop electroplating (EP) material exists. The stop EP material may be obliterated, and a barrier layer may be formed above the entire remaining structure. The substrate may be removed, and the individual dies may have any desired bonding pads and/or patterned circuitry added to the semiconductor surface. The remerged hard metal after laser cutting and heating should be strong enough for handling. Tape may be added to the wafer, and a breaker may be used to break the dies apart. The resulting structure may be flipped over, and the tape may be expanded to separate the individual dies.

Abstract: A collapsible easel for holding items to be displayed, the easel having a top assembly and a base assembly. The base assembly includes two front legs and a rear leg, each leg pivotally mounted to the top assembly with cushion members forcing part of the top assembly to provide a slight restriction against pivoted movement of the two front legs. A V-shaped spring assembly is pivotally mounted on the rear leg, and is removably attached to each front leg. Insertion of portions of the spring assembly into apertures in the front legs, allows the easel to stand in a tripod configuration. Removal of portions of the V-shaped spring assembly from the apertures in the front legs allows the legs to be folded together. In another embodiment, a collapsible brace assembly connects the rear leg to the front legs. The collapsible brace assembly comprises a pair of lateral struts extending between and engaging each of the front legs and a bracket connecting the lateral struts.

Abstract: Drill bits for subterranean drilling comprising a bit body including at least one blade that includes a blade face comprising a contact zone and a sweep zone are disclosed. In particular, drill bits including at least one blade that extends at least partially over a nose region of the bit body, a shoulder region of the bit body and a gage region of the bit body and that include a sweep zone that rotationally trails the contact zone with respect to a direction of intended bit rotation about a longitudinal axis of the bit body and include a contact zone that defines a range of about 90% to about 30% of the blade face surface area is disclosed. Additionally, drill bits comprising a sweep zone located at least partially within a gage region are disclosed. Also, methods of off-center drilling and methods of manufacturing drill bits are disclosed.

Abstract: A method to detect leaks in a rotating control device includes positioning a leak detection device in communication with a chamber located between an upper sealing element and a lower sealing element of the rotating control device, and signaling with the leak detection device when a pressure of the chamber exceeds a selected critical pressure.

Abstract: A method filters pixels in a sequence of images. Each image in the sequence is partitioned into blocks of pixels, and the images are processed sequentially. The energy is determined for each block of pixels in each image. The energy of each block is based on variances of intensities of the pixels in the sequence of images. A 3D fuzzy filter is applied to each current pixel in each current block during the sequential processing. The 3D fuzzy filter considers the energy of the block, and the intensities of pixels spatially adjacent and temporally adjacent to the current pixel to remove blocking and ringing artifacts.

Abstract: A light emitting device comprises two light-emitting diode (LED) groups, a group of luminophor layers, and an input terminal. The first LED group includes at least one blue LED emitting light having a dominant wavelength in a range between 400 nm and 480 nm, and the second LED group includes at least one red-orange LED emitting light having a dominant wavelength in a range between 610 nm and 630 nm. The group of luminophor layers, which are selected from one of silicates, nitrides, and nitrogen oxides, are positioned above the first LED group and partially converts the light emitted by the first LED group into light having a dominant wavelength in a range between 500 nm and 555 nm. The input terminal is connected to the two LED groups for providing desired electric energy thereto.

Abstract: An image sensor pixel that includes a photoelectric conversion unit supported by a substrate and an insulator adjacent to the substrate. The pixel includes a cascaded light guide that is located within an opening of the insulator and extends above the insulator such that a portion of the cascaded light guide has an air interface. The air interface improves the internal reflection of the cascaded light guide. The cascaded light guide may include a self-aligned color filter having air-gaps between adjacent color filters. Air-gaps may be sealed from above by a transparent sealing film. The transparent sealing film may have a concave surface over the air-gap to diverge light that crosses the concave surface into the air-gap away from the air-gap into adjacent color filters. These characteristics of the light guide eliminate the need for a microlens.

Abstract: An image sensor pixel that includes a photoelectric conversion unit supported by a substrate and an insulator adjacent to the substrate. The pixel includes a light guide that is located within an opening of the insulator and extends above the insulator such that a portion of the light guide has an air interface. The air interface improves the internal reflection of the light guide. Additionally, the light guide and an adjacent color filter are constructed with a process that optimizes the upper aperture of the light guide. These characteristics of the light guide eliminate the need for a microlens.

Abstract: A posterior chamber phakic lens made from an elastomeric, foldable, highly biocompatible and permeable material. The lens has a generally circular optic and a plurality of integrally formed, filament-like haptics. The haptics project posteriorly from the optic and contain a raised feature or ridge that is sandwiched between the posterior iris and the zonules when implanted in an eye. Such a construction has a low vaulting force under compression, is size insensitive, provides for a stable lens once implanted in the eye, helps to avoid pupillary blockage and allows for improved aqueous flow around the natural lens.

Abstract: A drill bit is disclosed that in one aspect includes a cutting device on a selected section of the drill bit, which cutting device is configured to cut formation on the high side of a wellbore during drilling of the wellbore. In one aspect, the cutting device comprises a cutting element disposed on a substantially non-rotating member placed around the selected section. In another aspect, the selected section may be a gage section of the drill bit.

Abstract: A die-wafer package includes a singulated semiconductor die having a first plurality of bond pads on a first surface and a second plurality of bond pads on a second, opposing surface thereof. Each of the first and second pluralities of bond pads includes an under-bump metallization (UBM) layer. The singulated semiconductor die is disposed on a semiconductor die site of a semiconductor wafer and a first plurality of conductive bumps electrically couples the first plurality of bond pads of the singulated semiconductor die with a first set of bond pads formed on the semiconductor die site. A second plurality of conductive bumps is disposed on a second set of bond pads of the semiconductor die site. A third plurality of conductive bumps is disposed on the singulated semiconductor die's second plurality of bond pads. The second and third pluralities of conductive bumps are configured for electrical interconnection with an external device.

Abstract: Method, apparatus and system embodiments to provide user-level creation, control and synchronization of OS-invisible “shreds” of execution via an abstraction layer for a system that includes one or more sequencers that are sequestered from operating system control. For at least one embodiment, the abstraction layer provides sequestration logic, proxy execution logic, transition detection and shred suspension logic, and sequencer arithmetic logic. Other embodiments are also described and claimed.