Abstract: The present invention discloses a method for outputting a command by detecting a movement of an object, which includes the following steps. First, an image capturing device captures images generated by the movement of the object at different timings by. Next, a motion trajectory is calculated according to the plurality of images. Further next, a corresponding command is outputted according to the motion trajectory. The present invention also provides a system which employs the above-mentioned method.

Abstract: An image processing circuit includes a receiving circuit, a feature fetching module and a decision circuit. In the operations of the image processing circuit, the receiving circuit is configured to receive image data. The feature fetching module is configured to use a multi-topological-convolutional network to fetch the features of the image data, to generate a plurality of image features determined by the characteristics and weights of the convolution filter, where the image features may be smooth features or edge features. In the present invention, the convolution filters used by the feature fetching module are not limited by a square convention filter, and the convolution filters may include the multiple topological convolutional network having non-square convolution filters. By using the multiple topological convolutional network of the present invention, the feature fetching module can fetch the rich image features for identifying the contents of the image data.

Abstract: The present invention discloses a method for outputting a command by detecting a movement of an object, which includes the following steps. First, an image capturing device captures images generated by the movement of the object at different timings by. Next, a motion trajectory is calculated according to the plurality of images. Further next, a corresponding command is outputted according to the motion trajectory. The present invention also provides a system which employs the above-mentioned method.

Abstract: A device comprises a first package component, and a first metal trace and a second metal trace on a top surface of the first package component. The device further includes a dielectric mask layer covering the top surface of the first package component, the first metal trace and the second metal trace, wherein the dielectric mask layer has an opening therein exposing the first metal trace. The device also includes a second package component and an interconnect formed on the second package component, the interconnect having a metal bump and a solder bump formed on the metal bump, wherein the solder bump contacts the first metal trace in the opening of the dielectric mask layer.

Abstract: A package structure including a semiconductor die, a warpage control layer, an insulating encapsulant and a redistribution layer is provided. The semiconductor die has an active surface and a backside surface opposite to the active surface. The warpage control layer is disposed on the backside surface of the semiconductor die, wherein the warpage control layer comprises a material having a Young's Modulus of 100 GPa or more. The insulating encapsulant is encapsulating the semiconductor die and the warpage control layer. The redistribution layer is located on the insulating encapsulant and over the active surface of the semiconductor die.

Abstract: Glasses with gesture recognition function include a glasses frame and a gesture recognition system. The gesture recognition system is disposed on the glasses frame and configured to detect hand gestures in front of the glasses thereby generating a control command. The gesture recognition system transmits the control command to an electronic device to correspondingly control the electronic device.

Abstract: The present invention provides a package structure of an optical apparatus which includes a substrate, a light emitting device, a light sensing device, and a light barrier member. The light emitting device is disposed on the substrate and electrically connected to the substrate. The light emitting device is for emitting light. The light sensing device is disposed on the substrate and is a chip scale package (CSP) device. The light sensing device is for receiving light reflected by an object. The light barrier member is disposed around a periphery of the light sensing device.

Abstract: Fixed length code (FLC)-based image compression method and device are provided. The FLC-based image compression method for compressing a block containing multiple pixels includes the following steps: determining a first representative pixel and a second representative pixel from the pixels according to the pixel values of the pixels; generating, by interpolation, multiple interpolated pixels according to the first representative pixel and the second representative pixel; generating an index value for each of the pixels according to the first representative pixel, the second representative pixel, and the interpolated pixels; adjusting the first representative pixel and the second representative pixel to generate a first adjusted representative pixel and a second adjusted representative pixel; and using the index values and complete or quantized pixel values of the first adjusted representative pixel and the second adjusted representative pixel to represent the block.

Abstract: A proximity sensing device includes: a light source, a sensing unit, a light guide unit, and a window. The light source emits light, which is guided by the light guide unit to the window. The emitted light reflected by an object is received by the same window. The light guide unit includes a partial-transmissive-partial-reflective (PTPR) optical element, whereby the light emitted from the light source is reflected by the PTPR optical element, while the light reflected by the object passes through the PTPR optical element. There is only one window required.

Abstract: There is provided a pupil tracking device including an active light source, an image sensor and a processing unit. The active light source emits light toward an eyeball alternatively in a first brightness value and a second brightness value. The image sensor captures a first brightness image corresponding to the first brightness value and a second brightness image corresponding to the second brightness value. The processing unit identifies a brightest region at corresponding positions of the first brightness image and the second brightness image as an active light image.

Abstract: An electronic system including a display device, an image sensor, a face detection engine, an eye detection engine and an eye protection engine is provided. The image sensor captures an image. The face detection engine recognizes a user face in the image. The eye detection engine recognizes user eyes in the image. The eye protection engine turns off the display device when the user eyes are recognized in the image but the user face is not recognized in the image.

Abstract: Disclosed are a color reconstruction device and method capable of accurately recovering the missing color of a target pixel. The device includes: a direction-characteristic estimation circuit calculating a horizontal-variation characteristic and a vertical-variation characteristic according to a first color of a target pixel and the values of pixels within a reference range, in which the target pixel is in the reference range and a current value of the target pixel is a first color value; an edge-texture decision circuit determining which of N predetermined relations matches the relation between the horizontal-variation characteristic and the vertical-variation characteristic and thereby determining the directional characteristic of the target pixel, in which the N is not less than four; and a color recovery circuit calculating a second and a third color values of the target pixel according to the directional characteristic and the values of the pixels within the reference range.

Abstract: A device package includes a die and a molding compound around the die. The molding compound has a non-planar surface recessed from a top surface of the die. The device package also includes an interconnect structure over the die. The interconnect structure includes a redistribution layer extending onto the molding compound and conformal to the non-planar surface of the molding compound. The device package further includes a first connector disposed over the die and bonded to the interconnect structure.

Abstract: A fixed length code (FLC)-based image compression method and a device thereof. The method is utilized to compress a block containing plural pixels and includes the following steps: determining a first representative pixel, a second representative pixel and a third representative pixel from the pixels according to pixel values of the pixels, the three representative pixels being noncollinear in a color space to which the pixels correspond; generating plural first interpolated pixels by interpolation according to the first representative pixel and the third representative pixel; generating plural second interpolated pixels by interpolation according to the second representative pixel and the third representative pixel; and generating an index value for each pixel according to the three representative pixels, the first interpolated pixels and the second interpolated pixels.

Abstract: Some embodiments relate to a semiconductor device package, which includes a substrate with a contact pad. A non-solder ball is coupled to the contact pad at a contact pad interface surface. A layer of solder is disposed over an outer surface of the non-solder ball, and has an inner surface and an outer surface which are generally concentric with the outer surface of the non-solder ball. An intermediate layer separates the non-solder ball and the layer of solder. The intermediate layer is distinct in composition from both the non-solder ball and the layer of solder. Sidewalls of the layer of solder are curved or sphere-like and terminate at a planar surface, which is disposed at a maximum height of the layer of solder as measured from the contact pad interface surface.

Abstract: Disclosed is a method for determining filter coefficients. The method includes: obtaining the coefficients of a target filter and calculating the response of the target filter; computing according to collected data and/or predetermined data in accordance with a first data pattern so as to have the response of a first filter approximate to the response of the target filter and thereby determine the coefficients of the first filter; and computing according to the collected data and/or the predetermined data in accordance with a second data pattern so as to have the response of a second filter approximate to the response of the target filter and thereby determine the coefficients of the second filter. Accordingly, the difference between the responses of the first filter and the second filter is insignificant and results in less negative influence; and the first and the second filters can replace the target filter to reduce cost.

Abstract: A system and method for applying an underfill is provided. An embodiment comprises applying an underfill to a substrate and patterning the underfill. Once patterned other semiconductor devices, such as semiconductor dies or semiconductor packages may then be attached to the substrate through the underfill, with electrical connections from the other semiconductor devices extending into the pattern of the underfill.

Abstract: A semiconductor device includes a first package component and a second package component. The first package component has a first die formed on a first substrate. A second package component has a second die formed on a second substrate. A thermal isolation material is attached on the first die, wherein the thermal isolation material thermally insulates the second die from the first die, and the thermal isolation material has a thermal conductivity of from about 0.024 W/mK to about 0.2 W/mK. A first set of conductive elements couples the first package component to the second package component.

Abstract: A method includes forming a metal post over a first dielectric layer, attaching a second dielectric layer over the first dielectric layer, encapsulating a device die, the second dielectric layer, a shielding structure, and the metal post in an encapsulating material, planarizing the encapsulating material to reveal the device die, the shielding structure, and the metal post, and forming an antenna electrically coupling to the device die. The antenna has a portion vertically aligned to a portion of the device die.

Abstract: Packaging methods for semiconductor devices are disclosed. In one embodiment, a method of packaging a semiconductor device includes providing a workpiece including a plurality of packaging substrates. A portion of the workpiece is removed between the plurality of packaging substrates. A die is attached to each of the plurality of packaging substrates.