Patents by Inventor Tse-An CHEN

Tse-An CHEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Structure of memory device and fabrication method thereof
    Patent number: 11024672
    Abstract: A structure of memory device is provided. The structure of memory device includes a transistor formed on a substrate. A contact structure is disposed on a source/drain region of the transistor. A conductive layer is disposed on the contact structure. Four memory structures is disposed on the conductive layer to form a quadrilateral structure.
    Type: Grant
    Filed: May 21, 2019
    Date of Patent: June 1, 2021
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Chung-Tse Chen, Ko-Chi Chen, Tzu-Yun Chang
  • Method for outputting command by detecting object movement and system thereof
    Patent number: 11023052
    Abstract: The present invention discloses a method for outputting a command by detecting a movement of an object, which includes the following steps. First, an image capturing device captures images generated by the movement of the object at different timings by. Next, a motion trajectory is calculated according to the plurality of images. Further next, a corresponding command is outputted according to the motion trajectory. The present invention also provides a system which employs the above-mentioned method.
    Type: Grant
    Filed: December 3, 2019
    Date of Patent: June 1, 2021
    Assignee: PIXART IMAGING INCORPORATION
    Inventors: Yu-Hao Huang, Yi-Fang Lee, Ming-Tsan Kao, Nien-Tse Chen
  • Image processing method based on sensor characteristics
    Publication number: 20210144351
    Abstract: Disclosed is an image processing method based on sensor characteristics. The method includes the following steps: obtaining a constant of a relation “c??(x)/?{square root over (x)}” between output signals “x” and the noise standard deviation “?(x)” of the output signals, in which the output signals are outputted by a sensor based on a sensor gain such as an ISO value of a camera; and calculating an output value of a target pixel according to pixel values within a sampling window, the constant, and a front-end gain such as an auto exposure gain, in which the pixel values include an input value of the target pixel.
    Type: Application
    Filed: November 9, 2020
    Publication date: May 13, 2021
    Inventors: YANG-TING CHOU, TSUNG-HSUAN LI, WAN-JU TANG, SHIH-TSE CHEN
  • FILTER AND OPERATION METHOD
    Publication number: 20210126626
    Abstract: A filter includes a switching circuit, a first filter circuit, and a second filter circuit. The first filter circuit is coupled to the switching circuit. The second filter circuit is coupled to the switching circuit. The switching circuit is controlled to control the first filter circuit to perform a first filtering process on an input signal or control the first filter circuit to work in coordination with the second filter circuit to perform a second filtering process on the input signal.
    Type: Application
    Filed: April 14, 2020
    Publication date: April 29, 2021
    Inventors: Yun-Tse CHEN, Kai-Yin LIU
  • FIELD EFFECT TRANSISTOR AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20210119131
    Abstract: A field effect transistor includes a semiconductor substrate, a first pad layer, carbon nanotubes and a gate structure. The first pad layer is disposed over the semiconductor substrate and comprises a 2D material. The carbon nanotubes are disposed over the first insulating pad layer. The gate structure is disposed over the semiconductor substrate and is vertically stacked with the carbon nanotubes. The carbon nanotubes extend from one side to an opposite side of the gate structure.
    Type: Application
    Filed: October 18, 2019
    Publication date: April 22, 2021
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Timothy Vasen, Chao-Ching Cheng, Matthias Passlack, Martin Christopher Holland, Tse-An Chen, Lain-Jong Li
  • Proximity sensing device and light guiding method thereof
    Patent number: 10982996
    Abstract: A proximity sensing device includes: a light source, a sensing unit, a light guide unit, and a window. The light source emits light, which is guided by the light guide unit to the window. The emitted light reflected by an object is received by the same window. The light guide unit includes a partial-transmissive-partial-reflective (PTPR) optical element, whereby the light emitted from the light source is reflected by the PTPR optical element, while the light reflected by the object passes through the PTPR optical element. There is only one window required.
    Type: Grant
    Filed: January 17, 2020
    Date of Patent: April 20, 2021
    Assignee: PIXART IMAGING INCORPORATION
    Inventors: Hui-Hsuan Chen, Nien-Tse Chen
  • Interactive system and device with gesture recognition function
    Patent number: 10976831
    Abstract: Glasses with gesture recognition function include a glasses frame and a gesture recognition system. The gesture recognition system is disposed on the glasses frame and configured to detect hand gestures in front of the glasses thereby generating a control command The gesture recognition system transmits the control command to an electronic device to correspondingly control the electronic device.
    Type: Grant
    Filed: February 3, 2020
    Date of Patent: April 13, 2021
    Assignee: PIXART IMAGING INC.
    Inventors: Horng-Goung Lai, En-Feng Hsu, Meng-Huan Hsieh, Yu-Hao Huang, Nien-Tse Chen
  • Method of updating background model and related device
    Patent number: 10964029
    Abstract: A method of updating background model for an image processing device is disclosed. The method includes receiving at least a background image, counting a number of occurrences of a color of each pixel of the background image according to a color information of each pixel of the at least a background image, to establish a background model including a statistical color information about the color and the number of occurrences of the color, receiving a current image, and determining whether to update the number of occurrences of the color in the background model corresponding to a color of each pixel of the current image according to a color information of each pixel of the current image and a result of comparing a random number with a threshold.
    Type: Grant
    Filed: October 15, 2019
    Date of Patent: March 30, 2021
    Assignee: Realtek Semiconductor Corp.
    Inventors: Shang-Lun Chan, Tsung-Hsuan Li, Chao-Hsun Yang, Shih-Tse Chen
  • 3D Package Structure and Methods of Forming Same
    Publication number: 20210091047
    Abstract: An embodiment is method including forming a first die package over a carrier substrate, the first die package comprising a first die, forming a first redistribution layer over and coupled to the first die, the first redistribution layer including one or more metal layers disposed in one or more dielectric layers, adhering a second die over the redistribution layer, laminating a first dielectric material over the second die and the first redistribution layer, forming first vias through the first dielectric material to the second die and forming second vias through the first dielectric material to the first redistribution layer, and forming a second redistribution layer over the first dielectric material and over and coupled to the first vias and the second vias.
    Type: Application
    Filed: December 7, 2020
    Publication date: March 25, 2021
    Inventors: Meng-Tse Chen, Chung-Shi Liu, Chih-Wei Lin, Hui-Min Huang, Hsuan-Ting Kuo, Ming-Da Cheng
  • EMI shielding structure in InFO package
    Patent number: 10950556
    Abstract: A method includes forming a metal post over a first dielectric layer, attaching a second dielectric layer over the first dielectric layer, encapsulating a device die, the second dielectric layer, a shielding structure, and the metal post in an encapsulating material, planarizing the encapsulating material to reveal the device die, the shielding structure, and the metal post, and forming an antenna electrically coupling to the device die. The antenna has a portion vertically aligned to a portion of the device die.
    Type: Grant
    Filed: September 13, 2019
    Date of Patent: March 16, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kai-Chiang Wu, Chen-Hua Yu, Ching-Feng Yang, Meng-Tse Chen
  • Motion Image Integration Method and Motion Image Integration System Capable of Merging Motion Object Images
    Publication number: 20210074002
    Abstract: A motion image integration method includes acquiring a raw image, detecting a first motion region image and a second motion region image by using a motion detector according to the raw image, merging the first motion region image with the second motion region image for generating a motion object image according to a relative position between the first motion region image and the second motion region image, and cropping the raw image to generate a sub-image corresponding to the motion object image according to the motion object image. A range of the motion object image is greater than or equal to a total range of the first motion region image and the second motion region image. Shapes of the first motion region image, the second motion region image, and the motion object image are polygonal shapes.
    Type: Application
    Filed: January 16, 2020
    Publication date: March 11, 2021
    Inventors: Chao-Hsun Yang, Shang-Lun Chan, Chun-Chang Wu, Shih-Tse Chen
  • Motion Detection Method and Motion Detection System with Low Computational Complexity and High Detection Accuracy
    Publication number: 20210074001
    Abstract: A motion detection method includes acquiring a raw image, detecting a motion object image according to the raw image by using a motion detector, cropping the raw image to generate a sub-image according to the motion object image, and inputting the sub-image to a processor for determining if a motion object of the sub-image matches with a detection category. The processor includes a neural network. The shape of the sub-image is a polygonal shape.
    Type: Application
    Filed: January 16, 2020
    Publication date: March 11, 2021
    Inventors: Shang-Lun Chan, Chao-Hsun Yang, Chun-Chang Wu, Shih-Tse Chen
  • METHOD FOR PROCESSING IMAGE USING FULLY CONNECTED CONVOLUTIONAL NEURAL NETWORK AND CIRCUIT SYSTEM
    Publication number: 20210042560
    Abstract: A method for processing image using fully connected convolutional neural network and a circuit system are provided. The method is operated using fully connected convolutional neural network (CNN) and performed by the circuit system. In the method, an image with a length, a width and an aspect ratio is obtained. A reference image closest to the input image can be obtained by querying a lookup table that records multiple reference images with various sizes to be adapted to the fully connected CNN. The input image can be resized as the closest reference image. A convolution operation is then performed onto the resized image, and a feature cube is formed after multiple operations of convolution. The feature cube is transformed to one-dimensional feature values that are configured to be inputted to a fully connected layer for fully connected operation. An output value of the fully connected CNN is generated.
    Type: Application
    Filed: May 18, 2020
    Publication date: February 11, 2021
    Inventors: CHUN-CHANG WU, SHIH-TSE CHEN
  • METHOD AND SYSTEM FOR PIXEL CHANNEL IMBALANCE COMPENSATION FOR IMAGE SENSING CIRCUIT
    Publication number: 20210019530
    Abstract: A method and a system for pixel channel imbalance compensation for an image sensing circuit are provided. The system includes an image acquisition circuit having a lens, a color filter and an image sensor and a processing circuit. In the method performed by the processing circuit, a second frame image is retrieved from a motion image, and a first frame image that has undergone noise reduction can be retrieved from a memory. Motion detection is performed between the frames by comparing the first frame image and the second frame image. The motion detection is referred to as a reference for determining how to perform 3D noise reduction. A compensation value for channel imbalance between the adjacent channels can be estimated based on the image under noise reduction in a same buffer. While the pixel channel imbalance is compensated, the image is then restored by an interpolation method.
    Type: Application
    Filed: July 15, 2020
    Publication date: January 21, 2021
    Inventors: WAN-JU TANG, TSUNG-HSUAN LI, SHIH-TSE CHEN
  • OPTOELECTRONIC DEVICE HAVING PHOTODIODES FOR DIFFERENT WAVELENGTHS AND PROCESS FOR MAKING SAME
    Publication number: 20210020803
    Abstract: An optoelectronic device includes: a substrate made of a first material; a region in the substrate, the region being made of a second material different from the first material; an N-well in the region made of the second material; and a photo diode formed in the region by ion implantation. The second material for example is silicon germanium (Si1-xGex) or silicon carbide (Si1-yCy), wherein 0<x,y<1.
    Type: Application
    Filed: October 1, 2020
    Publication date: January 21, 2021
    Inventors: Sen-Huang Huang, Hsin-Hui Hsu, Nien-Tse Chen
  • Advanced INFO POP and Method of Forming Thereof
    Publication number: 20210020611
    Abstract: In accordance with some embodiments, a package-on-package (PoP) structure includes a first semiconductor package having a first side and a second side opposing the first side, a second semiconductor package having a first side and a second side opposing the first side, and a plurality of inter-package connector coupled between the first side of the first semiconductor package and the first side of the second semiconductor package. The PoP structure further includes a first molding material on the second side of the first semiconductor package. The second side of the second semiconductor package is substantially free of the first molding material.
    Type: Application
    Filed: October 5, 2020
    Publication date: January 21, 2021
    Inventors: Yi-Da Tsai, Meng-Tse Chen, Sheng-Feng Weng, Sheng-Hsiang Chiu, Wei-Hung Lin, Ming-Da Cheng, Ching-Hua Hsieh, Chung-Shi Liu
  • DENOISING METHOD BASED ON SIGNAL-TO-NOISE RATIO
    Publication number: 20210004938
    Abstract: A denoising method based on a signal-to-noise ratio (SNR), which includes: obtaining a current input coefficient; obtaining a current noise standard deviation by querying a first relationship table; querying a second relationship table according to the current noise standard deviation and the current input coefficient to obtain a current slope corresponding to the current input coefficient; generating a current output coefficient by multiplying the current input coefficient and a compression magnification function; and calculating the current output coefficient by substituting the current noise standard deviation, the current input coefficient, and the current slope.
    Type: Application
    Filed: January 22, 2020
    Publication date: January 7, 2021
    Inventors: WAN-JU TANG, Tsung-Hsuan Li, SHIH-TSE CHEN
  • ELECTRONIC SYSTEM WITH EYE PROTECTION
    Publication number: 20200412941
    Abstract: An electronic system including a display device, an image sensor, a face detection engine, an eye detection engine and an eye protection engine is provided. The image sensor captures an image. The face detection engine recognizes a user face in the image. The eye detection engine recognizes user eyes in the image. The eye protection engine turns off the display device when the user eyes are recognized in the image but the user face is not recognized in the image.
    Type: Application
    Filed: September 15, 2020
    Publication date: December 31, 2020
    Inventors: HAN-CHANG LIN, GUO-ZHEN WANG, NIEN-TSE CHEN
  • Stud bump structure for semiconductor package assemblies
    Patent number: 10879203
    Abstract: A semiconductor package structure comprises a substrate, a die bonded to the substrate, and one or more stud bump structures connecting the die to the substrate, wherein each of the stud bump structures having a stud bump and a solder ball encapsulating the stud bump to enhance thermal dissipation and reduce high stress concentrations in the semiconductor package structure.
    Type: Grant
    Filed: September 18, 2017
    Date of Patent: December 29, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Meng-Tse Chen, Hsiu-Jen Lin, Chih-Wei Lin, Cheng-Ting Chen, Ming-Da Cheng, Chung-Shi Liu
  • CALCULATION METHOD USING PIXEL-CHANNEL SHUFFLE CONVOLUTIONAL NEURAL NETWORK AND OPERATING SYSTEM USING THE SAME
    Publication number: 20200401847
    Abstract: A calculation method using pixel-channel shuffle convolutional neural network is provided. In the method, an operating system receives original input data. The original input data is pre-processed by a pixel shuffle process to be separated into multiple groups in order to minimize dimension of the data. The multiple groups of data are then processed by a channel shuffle process so as to form multiple groups of new input data selected for convolution operation. The unselected data are abandoned. Therefore, the dimension of the input data can be much effectively minimized. A multiplier-accumulator of the operating system is used to execute convolution operation using a convolution kernel and the multiple new groups of input data. Multiple output data are then produced.
    Type: Application
    Filed: February 14, 2020
    Publication date: December 24, 2020
    Inventors: CHUN-CHANG WU, SHIH-TSE CHEN