Abstract: The present invention concerns an optic projecting technique for a projecting system comprising a housing and a projector unit, the projecting system comprises a housing and a projector unit, wherein the housing is provided with a display screen and a plurality of optic elements in the housing; the system is characterized in that: the projector unit is placed on the back of the housing in favor of detachment and displacement; when the projector unit projects optic images into the housing, the images from the projector are reflected by the optic elements and projected to the rear side of the display screen; when the projector unit is placed outside of the housing, it directly projects the optic images to the display screen at a suitable distance away, thus a dual projecting system for rear projection and front projection can be is formed.

Abstract: A modular system for projection television is disclosed wherein the major components may be removed from the frame or cabinet, which may then be folded into a compact unit for transporting. The projector is of a type that may be used either as a front or rear projecting television. Where appropriate, amplifiers, speakers, projector and optical devices are electrically connected within the enclosure, which may be achieved through the use of slot connectors or other means that permit easy withdrawal and reinsertion of the modules. The screen may be detached and used in the front projection mode, or designed to fold along with the frame or cabinet.

Abstract: A microelectromechanical switch includes a substrate, an insulator layer disposed outwardly from the substrate, and an electrode disposed outwardly from the insulator layer. The switch also includes a dielectric layer disposed outwardly from the insulator layer and the electrode, the dielectric layer having a dielectric constant of greater than or equal to twenty. The switch also includes a membrane layer disposed outwardly from the dielectric layer, the membrane layer overlying a support layer, the support layer operable to space the membrane layer outwardly from the dielectric layer.

Abstract: An improved wafer level encapsulated micro-electromechanical device fabricated on a semiconductor wafer and a method of manufacture using state-of-the-art wafer fabrication and packaging technology. The device is contained within a hermetic cavity produced by bonding a silicon wafer with active circuits to an etched silicon wafer having cavities which surround each device, and bonding the two wafer by either thin film glass seal or by solder seal. The etched wafer and thin film sealing allow conductors to be kept to a minimum length and matched for improved electrical control of the circuit. Further, the device has capability for a ground ring in the solder sealed device. The devices may be packaged in plastic packages with wire bond technology or may be solder connected to an area array solder connected package.

Abstract: A Micro Electro-Mechanical System (MEMS) varactor (100, 200) having a bottom electrode (116) formed over a substrate (112) and a dielectric material (130) disposed over the bottom electrode (116). A pull-down electrode (122) is formed over spacer (120) and the dielectric material (130). The MEMS varactor (100, 200) is adapted to operate in a stiction mode, with at least a portion of pull-down electrode (122) in contact with dielectric material (130). The MEMS varactor (100, 200) has a high Q, large tuning range, and high sensitivity.

Abstract: A microactuator, or micromotor, (60) and method for making it are presented such that a symmetrical build up of material is performed on opposite sides of a substrate. This reduces mechanical stresses in the device. In its construction, respective layers of circuit portions (108, 110) are built on each side of the structure, thereby eliminating the need to stack complex patterns. Stacking one complex pattern on top of a similar pattern is difficult because the surface, which is the base for subsequent layers, is not flat. The photolithography process that forms these patterns is not very forgiving to non-flat surfaces. Avoiding the stacked layers also allows thicker conductors to be considered for each circuit. Thicker circuits increase current carrying capacity, which in one of the key variables increase the power of the micromotor.

Abstract: A microelectromechanical switch includes a substrate, an insulator layer disposed outwardly from the substrate, and an electrode disposed outwardly from the insulator layer. The switch also includes a dielectric layer disposed outwardly from the insulator layer and the electrode, the dielectric layer having a dielectric constant of greater than or equal to twenty. The switch also includes a membrane layer disposed outwardly from the dielectric layer, the membrane layer overlying a support layer, the support layer operable to space the membrane layer outwardly from the dielectric layer.

Abstract: A Micro Electro-Mechanical System (MEMS) varactor (100, 200) having a bottom electrode (116) formed over a substrate (112) and a dielectric material (130) disposed over the bottom electrode (116). A pull-down electrode (122) is formed over spacer (120) and the dielectric material (130). The MEMS varactor (100, 200) is adapted to operate in a stiction mode, with at least a portion of pull-down electrode (122) in contact with dielectric material (130). The MEMS varactor (100, 200) has a high Q, large tuning range, and high sensitivity.

Abstract: A microelectromechanical switch includes a substrate, an insulator layer disposed outwardly from the substrate, and an electrode disposed outwardly from the insulator layer. The switch also includes a dielectric layer disposed outwardly from the insulator layer and the electrode, the dielectric layer having a dielectric constant of greater than or equal to twenty. The switch also includes a membrane layer disposed outwardly from the dielectric layer, the membrane layer overlying a support layer, the support layer operable to space the membrane layer outwardly from the dielectric layer.

Abstract: An improved wafer level encapsulated micro-electromechanical device fabricated on a semiconductor wafer and a method of manufacture using state-of-the-art wafer fabrication and packaging technology. The device is contained within a hermetic cavity produced by bonding a silicon wafer with active circuits to an etched silicon wafer having cavities which surround each device, and bonding the two wafer by either thin film glass seal or by solder seal. The etched wafer and thin film sealing allow conductors to be kept to a minimum length and matched for improved electrical control of the circuit. Further, the device has capability for a ground ring in the solder sealed device. The devices may be packaged in plastic packages with wire bond technology or may be solder connected to an area array solder connected package.

Abstract: A microactuator includes a base, first microactuator elements carried by the base, a platform attached to the base, second microactuator elements carried by the platform, and the first microactuator elements being located substantially symmetrically on either side of a plane along a centerline of the base

Abstract: An improved wafer level encapsulated micro-electromechanical device fabricated on a semiconductor wafer and a method of manufacture using state-of-the-art wafer fabrication and packaging technology. The device is contained within a hermetic cavity produced by bonding a silicon wafer with active circuits to an etched silicon wafer having cavities which surround each device, and bonding the two wafer by either thin film glass seal or by solder seal. The etched wafer and thin film sealing allow conductors to be kept to a minimum length and matched for improved electrical control of the circuit. Further, the device has capability for a ground ring in the solder sealed device. The devices may be packaged in plastic packages with wire bond technology or may be solder connected to an area array solder connected package.

Abstract: A disk rotates and information is stored on the disk. An arm accesses the information and a fly height controller controls the height of the arm with respect to the disk as the disk rotates.

Abstract: An integral computer hard drive microactuator support comprising a unitary member of solid material. The support includes a frame portion surrounding and defining an opening portion, and a platform portion disposed within the opening portion. Four fixed-fixed beam portions connect the platform portion to the frame portion, the fixed-fixed beam portions being generally rectangular in cross section and substantially straight along their length.

Abstract: An optical matrix switch station (1) is shown mounting a plurality of optical switch units (15, 17), each of which includes a mirror (29), moveable in two axes, for purpose of switching optical beams from one optical fiber to another. A mirror assembly (41) includes a single body of silicon comprising a frame portion (43), gimbals (45), mirror portion (47), and related hinges (55). Magnets (53, 54) and air coils (89) are utilized to position the central mirror surface (29) to a selected orientation. The moveable mirror and associated magnets along with control LED's (71) are hermetically packaged in a header (81) and mounted with the air coils on mounting bracket (85) to form a micromirror assembly package (99) mounted in each optical switch unit.

Abstract: A microelectromechanical switch includes a substrate, an insulator layer disposed outwardly from the substrate, and an electrode disposed outwardly from the insulator layer. The switch also includes a dielectric layer disposed outwardly from the insulator layer and the electrode, the dielectric layer having a dielectric constant of greater than or equal to twenty. The switch also includes a membrane layer disposed outwardly from the dielectric layer, the membrane layer overlying a support layer, the support layer operable to space the membrane layer outwardly from the dielectric layer.

Abstract: An optical matrix switch station (1) is shown mounting a plurality of optical switch units (15, 17), each of which includes a mirror (29), moveable in two axes, for purpose of switching optical beams from one optical fiber to another. A mirror assembly (41) includes a single body of silicon comprising a frame portion (43), gimbals (45), mirror portion (47), and related hinges (55). Magnets (53, 54) and air coils (89) are utilized to position the central mirror surface (29) to a selected orientation. The moveable mirror and associated magnets along with control LED's (71) are hermetically packaged in a header (81) and mounted with the air coils on mounting bracket (85) to form a micromirror assembly package (99) mounted in each optical switch unit.

Abstract: An improved micro-actuator position sensor which provides an accurate position signal for higher bandwidth control of a micro-actuator. The position sensor allows closed loop control of the micro-actuator position. Preferred embodiment micro-actuator sensors include a piezo-resistive stress sensor integrated within the springs, a capacitance sensor and magnetic reluctance sensor. Embodiments of the present invention are described in detail as integrated sensors for a micro-actuator used in hard disk drives. The sensor is integrated with a micro-actuator at the tip of the conventional actuator arm to improve the precision seeking capability of the actuator arm.

Abstract: A read/write data interface (26) is provided that interfaces with a read/write head (28) and is positioned in close proximity to the read/write head (28). The read/write data interface (26) includes a pre-amplifier (46) and a read channel (44). The pre-amplifier (46) amplifies an analog read signal and generates an amplified analog read signal in response. The read channel (44) receives the amplified analog read signal and generates a digital read signal in response.

Abstract: A membrane device is provided in which a plurality of ridges (14) and recesses (16) are formed proximate to a substrate (12). Electrodes (18) are formed within the recesses (16). A spacer (20) supports a membrane (22). Application of a potential difference between the membrane (22) and the electrodes (18) allows for deflection of the membrane (22) toward the electrodes (18).