Patents by Inventor Tsjerk Hans Hoekstra
Tsjerk Hans Hoekstra has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10117028Abstract: A MEMS transducer (200) comprises a substrate (101) having a first surface (102) and a membrane (103) formed relative to an aperture in the substrate. The MEMS transducer (200) further comprises one or more bonding structures (107) coupled to the substrate, wherein the one or more bonding structures (107), during use, mechanically couple the MEMS transducer to an associated substrate (111). The MEMS transducer (200) comprises a sealing element (109) for providing a seal, during use, in relation to the substrate (101) and the associated substrate (111). A stress decoupling member (119) is coupled between the substrate (101) and the sealing element (109).Type: GrantFiled: January 27, 2017Date of Patent: October 30, 2018Assignee: Cirrus Logic, Inc.Inventors: David Talmage Patten, Tsjerk Hans Hoekstra
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Publication number: 20180208454Abstract: There is provided a flexible membrane for use in a microelectromechanical transducer, the flexible membrane comprising an electromagnetic waveguide. There is further provided a microelectromechanical system comprising a substrate which comprises the flexible membrane, and a process for forming the flexible membrane. The flexible membrane may be configured to operate within an optical microphone system.Type: ApplicationFiled: January 16, 2018Publication date: July 26, 2018Applicant: Cirrus Logic International Semiconductor Ltd.Inventor: Tsjerk Hans HOEKSTRA
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Publication number: 20180152792Abstract: A MEMS transducer comprising: a flexible membrane, the flexible membrane comprising a first membrane electrode; a back plate, the back plate comprising a first back plate electrode; wherein the back plate is supported in a spaced relation with respect to the flexible membrane. The MEMS transducer is configured to provide electrical connections to the first membrane electrode and the first back plate electrode. The flexible membrane further comprises a second membrane electrode, the second membrane electrode being electrically isolated from the first membrane electrode, wherein the first membrane electrode and the second membrane electrode are arranged to reduce variation in electrostatic forces across the flexible membrane.Type: ApplicationFiled: November 29, 2017Publication date: May 31, 2018Applicant: Cirrus Logic International Semiconductor Ltd.Inventors: Tsjerk Hans HOEKSTRA, Axel THOMSEN, Colin Robert JENKINS, Aleksey Sergeyevich KHENKIN
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Publication number: 20180091906Abstract: The application describes a MEMS transducer comprising: a substrate; a primary membrane supported in a fixed relation relative to the substrate and a secondary membrane provided in a plane overlying the primary membrane. The secondary membrane is mechanically coupled to the primary membrane by a substantially rigid coupling structure. A rigid support plate may be interposed between the primary and secondary membranes.Type: ApplicationFiled: September 19, 2017Publication date: March 29, 2018Applicant: Cirrus Logic International Semiconductor Ltd.Inventors: Aleksey Sergeyevich KHENKIN, Tsjerk Hans HOEKSTRA
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Publication number: 20180050900Abstract: The application describes a MEMS transducer comprising a layer of conductive material provided on a surface of a layer of membrane material. The layer of conductive material comprises first and second regions, wherein the thickness and/or the conductivity of the/each first and second regions is different.Type: ApplicationFiled: August 14, 2017Publication date: February 22, 2018Applicant: Cirrus Logic International Semiconductor Ltd.Inventors: Stephen DUFFY, Colin Robert JENKINS, Tsjerk Hans HOEKSTRA
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Publication number: 20170359658Abstract: A MEMS capacitive transducer with increased robustness and resilience to acoustic shock. The transducer structure includes a flexible membrane supported between a first volume and a second volume, and at least one variable vent structure in communication with at least one of the first and second volumes. The variable vent structure includes at least one moveable portion which is moveable in response to a pressure differential across the moveable portion so as to vary the size of a flow path through the vent structure. The variable vent may be formed through the membrane and the moveable portion may be a part of the membrane, defined by one or more channels, that is deflectable away from the surface of the membrane. The variable vent is preferably closed in the normal range of pressure differentials but opens at high pressure differentials to provide more rapid equalisation of the air volumes above and below the membrane.Type: ApplicationFiled: August 1, 2017Publication date: December 14, 2017Inventors: Colin Robert Jenkins, Tsjerk Hans Hoekstra, Euan James Boyd
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Patent number: 9756429Abstract: A MEMS capacitive transducer with increased robustness and resilience to acoustic shock. The transducer structure includes a flexible membrane supported between a first volume and a second volume, and at least one variable vent structure in communication with at least one of the first and second volumes. The variable vent structure includes at least one moveable portion which is moveable in response to a pressure differential across the moveable portion so as to vary the size of a flow path through the vent structure. The variable vent may be formed through the membrane and the moveable portion may be a part of the membrane, defined by one or more channels, that is deflectable away from the surface of the membrane. The variable vent is preferably closed in the normal range of pressure differentials but opens at high pressure differentials to provide more rapid equalization of the air volumes above and below the membrane.Type: GrantFiled: March 27, 2017Date of Patent: September 5, 2017Assignee: Cirrus Logic, Inc.Inventors: Colin Robert Jenkins, Tsjerk Hans Hoekstra, Euan James Boyd
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Publication number: 20170247248Abstract: The application relates to integrated MEMS transducers comprising a MEMS transducer structure formed of a plurality of transducer layers and at least one circuit component formed from a plurality of circuitry (CMOS) layers. The integrated MEMS transducer further comprises a conductive enclosure that is integral to the transducer layers and circuitry layers. The at least one circuit component is inside the conductive enclosure whilst the MEMS transducer structure is outside the enclosure.Type: ApplicationFiled: February 23, 2017Publication date: August 31, 2017Applicant: Cirrus Logic International Semiconductor Ltd.Inventor: Tsjerk Hans HOEKSTRA
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Publication number: 20170217762Abstract: A MEMS transducer package (300) comprises a package cover (313) comprising a first bonding region (316) and an integrated circuit die (319) comprising a second bonding region (314) for bonding with the first bonding region of the package cover. The integrated circuit die (309) comprises an integrated MEMS transducer (311) and integrated electronic circuitry (312) in electrical connection with the integrated MEMS transducer. The footprint of the integrated electronic circuitry (312) at least overlaps the bonding region (314) of the integrated circuit die (309).Type: ApplicationFiled: January 27, 2017Publication date: August 3, 2017Applicant: Cirrus Logic International Semiconductor Ltd.Inventor: Tsjerk Hans HOEKSTRA
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Publication number: 20170223466Abstract: A MEMS transducer (200) comprises a substrate (101) having a first surface (102) and a membrane (103) formed relative to an aperture in the substrate. The MEMS transducer (200) further comprises one or more bonding structures (107) coupled to the substrate, wherein the one or more bonding structures (107), during use, mechanically couple the MEMS transducer to an associated substrate (111). The MEMS transducer (200) comprises a sealing element (109) for providing a seal, during use, in relation to the substrate (101) and the associated substrate (111). A stress decoupling member (119) is coupled between the substrate (101) and the sealing element (109).Type: ApplicationFiled: January 27, 2017Publication date: August 3, 2017Applicant: Cirrus Logic International Semiconductor Ltd.Inventors: David Talmage PATTEN, Tsjerk Hans HOEKSTRA
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Publication number: 20170201835Abstract: A MEMS capacitive transducer with increased robustness and resilience to acoustic shock. The transducer structure includes a flexible membrane supported between a first volume and a second volume, and at least one variable vent structure in communication with at least one of the first and second volumes. The variable vent structure includes at least one moveable portion which is moveable in response to a pressure differential across the moveable portion so as to vary the size of a flow path through the vent structure. The variable vent may be formed through the membrane and the moveable portion may be a part of the membrane, defined by one or more channels, that is deflectable away from the surface of the membrane. The variable vent is preferably closed in the normal range of pressure differentials but opens at high pressure differentials to provide more rapid equalisation of the air volumes above and below the membrane.Type: ApplicationFiled: March 27, 2017Publication date: July 13, 2017Inventors: Colin R. Jenkins, Tsjerk Hans Hoekstra, Euan James Boyd
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Patent number: 9637374Abstract: A MEMS capacitive transducer with increased robustness and resilience to acoustic shock. The transducer structure includes a flexible membrane supported between a first volume and a second volume, and at least one variable vent structure in communication with at least one of the first and second volumes. The variable vent structure includes at least one moveable portion which is moveable in response to a pressure differential across the moveable portion so as to vary the size of a flow path through the vent structure. The variable vent may be formed through the membrane and the moveable portion may be a part of the membrane, defined by one or more channels, that is deflectable away from the surface of the membrane. The variable vent is preferably closed in the normal range of pressure differentials but opens at high pressure differentials to provide more rapid equalization of the air volumes above and below the membrane.Type: GrantFiled: October 11, 2016Date of Patent: May 2, 2017Assignee: Cirrus Logic, Inc.Inventors: Colin Robert Jenkins, Tsjerk Hans Hoekstra, Euan James Boyd
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Publication number: 20170029267Abstract: A MEMS capacitive transducer with increased robustness and resilience to acoustic shock. The transducer structure includes a flexible membrane supported between a first volume and a second volume, and at least one variable vent structure in communication with at least one of the first and second volumes. The variable vent structure includes at least one moveable portion which is moveable in response to a pressure differential across the moveable portion so as to vary the size of a flow path through the vent structure. The variable vent may be formed through the membrane and the moveable portion may be a part of the membrane, defined by one or more channels, that is deflectable away from the surface of the membrane. The variable vent is preferably closed in the normal range of pressure differentials but opens at high pressure differentials to provide more rapid equalisation of the air volumes above and below the membrane.Type: ApplicationFiled: October 11, 2016Publication date: February 2, 2017Inventors: Colin Robert Jenkins, Tsjerk Hans Hoekstra, Euan James Boyd
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Patent number: 9487389Abstract: A MEMS capacitive transducer with increased robustness and resilience to acoustic shock. The transducer structure includes a flexible membrane supported between a first volume and a second volume, and at least one variable vent structure in communication with at least one of the first and second volumes. The variable vent structure includes at least one moveable portion which is moveable in response to a pressure differential across the moveable portion so as to vary the size of a flow path through the vent structure. The variable vent may be formed through the membrane and the moveable portion may be a part of the membrane, defined by one or more channels, that is deflectable away from the surface of the membrane. The variable vent is preferably closed in the normal range of pressure differentials but opens at high pressure differentials to provide more rapid equalization of the air volumes above and below the membrane.Type: GrantFiled: December 4, 2015Date of Patent: November 8, 2016Assignee: Cirrus Logic, Inc.Inventors: Colin Robert Jenkins, Tsjerk Hans Hoekstra, Euan James Boyd
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Publication number: 20160083246Abstract: A MEMS capacitive transducer with increased robustness and resilience to acoustic shock. The transducer structure includes a flexible membrane supported between a first volume and a second volume, and at least one variable vent structure in communication with at least one of the first and second volumes. The variable vent structure includes at least one moveable portion which is moveable in response to a pressure differential across the moveable portion so as to vary the size of a flow path through the vent structure. The variable vent may be formed through the membrane and the moveable portion may be a part of the membrane, defined by one or more channels, that is deflectable away from the surface of the membrane. The variable vent is preferably closed in the normal range of pressure differentials but opens at high pressure differentials to provide more rapid equalisation of the air volumes above and below the membrane.Type: ApplicationFiled: December 4, 2015Publication date: March 24, 2016Inventors: Colin Robert Jenkins, Tsjerk Hans Hoekstra, Euan James Boyd
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Patent number: 9206031Abstract: A MEMS capacitive transducer with increased robustness and resilience to acoustic shock. The transducer structure includes a flexible membrane supported between a first volume and a second volume, and at least one variable vent structure in communication with at least one of the first and second volumes. The variable vent structure includes at least one moveable portion which is moveable in response to a pressure differential across the moveable portion so as to vary the size of a flow path through the vent structure. The variable vent may be formed through the membrane and the moveable portion may be a part of the membrane, defined by one or more channels, that is deflectable away from the surface of the membrane. The variable vent is preferably closed in the normal range of pressure differentials but opens at high pressure differentials to provide more rapid equalization of the air volumes above and below the membrane.Type: GrantFiled: March 3, 2015Date of Patent: December 8, 2015Assignee: Cirrus Logic International Semiconductor Ltd.Inventors: Colin Robert Jenkins, Tsjerk Hans Hoekstra, Euan James Boyd
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Publication number: 20150175404Abstract: A MEMS capacitive transducer with increased robustness and resilience to acoustic shock. The transducer structure includes a flexible membrane supported between a first volume and a second volume, and at least one variable vent structure in communication with at least one of the first and second volumes. The variable vent structure includes at least one moveable portion which is moveable in response to a pressure differential across the moveable portion so as to vary the size of a flow path through the vent structure. The variable vent may be formed through the membrane and the moveable portion may be a part of the membrane, defined by one or more channels, that is deflectable away from the surface of the membrane. The variable vent is preferably closed in the normal range of pressure differentials but opens at high pressure differentials to provide more rapid equalisation of the air volumes above and below the membrane.Type: ApplicationFiled: March 3, 2015Publication date: June 25, 2015Inventors: Colin Robert Jenkins, Tsjerk Hans Hoekstra, Euan James Boyd
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Patent number: 8987844Abstract: A MEMS capacitive transducer with increased robustness and resilience to acoustic shock. The transducer structure includes a flexible membrane supported between a first volume and a second volume, and at least one variable vent structure in communication with at least one of the first and second volumes. The variable vent structure includes at least one moveable portion which is moveable in response to a pressure differential across the moveable portion so as to vary the size of a flow path through the vent structure. The variable vent may be formed through the membrane and the moveable portion may be a part of the membrane, defined by one or more channels, that is deflectable away from the surface of the membrane. The variable vent is preferably closed in the normal range of pressure differentials but opens at high pressure differentials to provide more rapid equalization of the air volumes above and below the membrane.Type: GrantFiled: February 10, 2014Date of Patent: March 24, 2015Assignee: Cirrus Logic International (UK) LimitedInventors: Colin Robert Jenkins, Tsjerk Hans Hoekstra, Euan James Boyd
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Publication number: 20140161290Abstract: A MEMS capacitive transducer with increased robustness and resilience to acoustic shock. The transducer structure includes a flexible membrane supported between a first volume and a second volume, and at least one variable vent structure in communication with at least one of the first and second volumes. The variable vent structure includes at least one moveable portion which is moveable in response to a pressure differential across the moveable portion so as to vary the size of a flow path through the vent structure. The variable vent may be formed through the membrane and the moveable portion may be a part of the membrane, defined by one or more channels, that is deflectable away from the surface of the membrane. The variable vent is preferably closed in the normal range of pressure differentials but opens at high pressure differentials to provide more rapid equalisation of the air volumes above and below the membrane.Type: ApplicationFiled: February 10, 2014Publication date: June 12, 2014Applicant: Wolfson Microelectronics plcInventors: Colin Robert Jenkins, Tsjerk Hans Hoekstra, Euan James Boyd
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Patent number: 8737171Abstract: A MEMS capacitive transducer with increased robustness and resilience to acoustic shock. The transducer structure includes a flexible membrane supported between a first volume and a second volume, and at least one variable vent structure in communication with at least one of the first and second volumes. The variable vent structure includes at least one moveable portion which is moveable in response to a pressure differential across the moveable portion so as to vary the size of a flow path through the vent structure. The variable vent may be formed through the membrane and the moveable portion may be a part of the membrane, defined by one or more channels, that is deflectable away from the surface of the membrane. The variable vent is preferably closed in the normal range of pressure differentials but opens at high pressure differentials to provide more rapid equalization of the air volumes above and below the membrane.Type: GrantFiled: August 23, 2013Date of Patent: May 27, 2014Assignee: Wolfson Microelectronics plcInventors: Colin Robert Jenkins, Tsjerk Hans Hoekstra, Euan James Boyd